摘要:
In a video signal play-back circuit connected so that a play-back signal from a magnetic head may be applied to an amplifier circuit through a resonance circuit which consists of an inductance element and a capacitance element, a resistor for adjusting the quality factor Q of the resonance circuit is connected between one terminal of the resonance circuit and one output terminal of the amplifier circuit, thereby to reduce thermal noises which develop from the Q adjusting resistor.
摘要:
In a video signal play-back circuit connected so that a play-back signal from a magnetic head may be applied to an amplifier circuit through a resonance circuit which consists of an inductance element and a capacitance element, a resistor for adjusting the quality factor Q of the resonance circuit is connected between one terminal of the resonance circuit and one output terminal of the amplifier circuit, thereby to reduce thermal noises which develop from the Q adjusting resistor.
摘要:
A servo circuit is disclosed for a video tape recorder of helical scan type having two rotary heads, in which recording/reproduction is capable of being performed at different tape feed rates, and a recording track for the video signal is formed partially superimposed on the previously-formed recording track, thus forming a recording track narrower than the heads when the tape feed rate is low. A control pulse which is in phase with the vertical synchronizing signal extracted from the video signal to be recorded is recorded in the control track, and the rotational phase of the rotary heads is controlled by use of the control pulse read at the time of reproduction. The servo circuit causes a shift in the phase of the control pulses and a change in the phase of the control pulses before recording when the tape feed rate is low.
摘要:
A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back surface.
摘要:
A cleaning apparatus includes a first substrate-holding portion configured to hold a first area of a back surface of the substrate so that the top surface is kept face up; a second substrate-holding portion configured to hold a second area of the back surface of the substrate, the second area being not overlapped with the first area, and rotate the substrate; a top-surface cleaning nozzle configured to supply a top surface cleaning fluid to a top surface of the substrate; a bevel cleaning nozzle configured to supply a bevel cleaning fluid to a bevel portion of the substrate; a cleaning fluid supplying portion configured to supply a back surface cleaning fluid to the back surface of the substrate held by the first or the second substrate-holding portion; and a cleaning member configured to clean the back surface of the substrate held by the first or the second-substrate holding portion.
摘要:
A cleaning apparatus includes a first substrate-holding portion configured to hold a first area of a back surface of the substrate so that the top surface is kept face up; a second substrate-holding portion configured to hold a second area of the back surface of the substrate, the second area being not overlapped with the first area, and rotate the substrate; a top-surface cleaning nozzle configured to supply a top surface cleaning fluid to a top surface of the substrate; a bevel cleaning nozzle configured to supply a bevel cleaning fluid to a bevel portion of the substrate; a cleaning fluid supplying portion configured to supply a back surface cleaning fluid to the back surface of the substrate held by the first or the second substrate-holding portion; and a cleaning member configured to clean the back surface of the substrate held by the first or the second-substrate holding portion.
摘要:
A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back surface.