公开(公告)号：US20240339308A1

公开(公告)日：2024-10-10

申请号：US18027200

申请日：2022-01-25

Applicant: Hitachi High-Tech Corporation

Inventor： Satoru Matsukura ,  Yoshito KAMAJI ,  Nanako TAMARI ,  Akira KAGOSHIMA ,  Masahiro SUMIYA

IPC: H01J37/32 ,  H01L21/67

CPC classification number: H01J37/32926 ,  H01J37/32935 ,  H01L21/67253

Abstract: An apparatus diagnostic apparatus that performs a computation process using data acquired from a semiconductor apparatus manufacturing apparatus having a reference chamber to create reference chamber feature quantity map data by mapping a feature quantity onto a graph having axes representing a plurality of parameters. The apparatus diagnostic apparatus also performs a computation process using data acquired from a semiconductor apparatus manufacturing apparatus having a calibration-target chamber to create calibration-target chamber feature quantity map data by mapping a feature quantity onto a graph having axes representing a plurality of parameters. Based on patterns observed in the reference chamber feature quantity map data and the calibration-target chamber feature quantity map data, the apparatus diagnostic apparatus identifies a performance difference between different chambers, a performance difference resulting from a temporal change of a single chamber, or a performance difference resulting from component replacement or component cleaning of a single chamber.

公开(公告)号：US20240310827A1

公开(公告)日：2024-09-19

申请号：US18026201

申请日：2022-03-24

Applicant: Hitachi High-Tech Corporation

Inventor： Nanako Tamari ,  Masahiro Sumiya ,  Akira Kagoshima ,  Satoru Matsukura ,  Yuji Nagatani

IPC: G05B23/02 ,  G05B19/048 ,  H01L21/67

CPC classification number: G05B23/0283 ,  G05B19/048 ,  G05B23/024 ,  H01L21/67253 ,  G05B2219/45031

Abstract: An apparatus diagnostic system for diagnosing conditions of a semiconductor manufacturing apparatus includes an apparatus diagnostic apparatus that outputs soundness indicators by a first algorithm with sensor data collected from the semiconductor manufacturing apparatus as an input to the first algorithm, outputs threshold spatial data under normal conditions of the semiconductor manufacturing apparatus by a second algorithm with the soundness indicators as an input to the second algorithm, and diagnoses conditions of the semiconductor manufacturing apparatus by a third algorithm with the soundness indicators and the threshold spatial data as an input to the third algorithm. The soundness indicators are indicators concerning a degree of soundness of conditions of the semiconductor manufacturing apparatus.