公开(公告)号：US20180057720A1

公开(公告)日：2018-03-01

申请号：US15805547

申请日：2017-11-07

Applicant: Hitachi Metals, Ltd.

Inventor： Daisuke SHANAI ,  Akinari NAKAYAMA ,  Kenichi MURAKAMI ,  Kazuhiko SASADA ,  Masanobu YAMANOBE

IPC: C09J167/00 ,  C09J7/02 ,  C09J11/06 ,  C09J11/04 ,  C09J9/00 ,  B32B7/12 ,  B32B27/36 ,  B32B27/40 ,  B32B27/28 ,  B32B27/38

Abstract: An adhesive film includes a resin film; and an adhesive layer provided on the resin film. The adhesive layer comprises a resin composition including 2 parts by mass or more of an epoxy resin including two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, per 100 parts by mass of an amorphous resin, which is soluble to a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 5 KOHmg/g or more. A flat wiring member includes a conductor and the adhesive film as described above.