公开(公告)号：US20180057720A1

公开(公告)日：2018-03-01

申请号：US15805547

申请日：2017-11-07

Applicant: Hitachi Metals, Ltd.

Inventor： Daisuke SHANAI ,  Akinari NAKAYAMA ,  Kenichi MURAKAMI ,  Kazuhiko SASADA ,  Masanobu YAMANOBE

IPC: C09J167/00 ,  C09J7/02 ,  C09J11/06 ,  C09J11/04 ,  C09J9/00 ,  B32B7/12 ,  B32B27/36 ,  B32B27/40 ,  B32B27/28 ,  B32B27/38

Abstract: An adhesive film includes a resin film; and an adhesive layer provided on the resin film. The adhesive layer comprises a resin composition including 2 parts by mass or more of an epoxy resin including two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, per 100 parts by mass of an amorphous resin, which is soluble to a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 5 KOHmg/g or more. A flat wiring member includes a conductor and the adhesive film as described above.

公开(公告)号：US20140202737A1

公开(公告)日：2014-07-24

申请号：US14158252

申请日：2014-01-17

Applicant: Hitachi Metals, Ltd.

Inventor： Daisuke SHANAI ,  Takashi AOYAMA ,  Kazuhiko SASADA ,  Hiroaki KOMATSU

IPC: C09J175/08 ,  H05K1/02 ,  C09J7/02

CPC classification number: H05K1/0298 ,  C08G18/0852 ,  C08G18/4879 ,  C08G18/8116 ,  C09J7/22 ,  C09J7/35 ,  C09J175/16 ,  C09J2203/326 ,  C09J2475/00 ,  C09J2479/086 ,  H05K3/386 ,  H05K2201/0154 ,  Y10T428/24959 ,  Y10T428/2852

Abstract: An adhesive varnish includes 100 parts by mass of a component A that includes a phenoxy resin including a plurality of hydroxyl groups in a side chain, 2 to 55 parts by mass of a component B that includes a polyfunctional isocyanate compound including, in a molecule thereof, an isocyanate and at least one of a vinyl group, an acrylate group and a methacrylate group, 5 to 30 parts by mass of a component C that includes a maleimide compound including a plurality of maleimide groups in a molecule thereof or/and a reaction product thereof, a component S1 including a low-boiling point solvent having a boiling point of not more than 100° C., and a component S2 including a high-boiling point solvent having a boiling point of more than 100° C.

Abstract translation: 粘合剂清漆包括100质量份包含在侧链中包含多个羟基的苯氧基树脂的组分A，2〜55质量份包含多官能异氰酸酯化合物的组分B，所述多官能异氰酸酯化合物在其分子中包含 异氰酸酯和乙烯基，丙烯酸酯基和甲基丙烯酸酯基中的至少一个，含有分子内含有多个马来酰亚胺基的马来酰亚胺化合物的成分C 5〜30质量份，和/或反应 的产物，包含沸点不高于100℃的低沸点溶剂的组分S1和包含沸点高于100℃的高沸点溶剂的组分S2。

公开(公告)号：US20140158413A1

公开(公告)日：2014-06-12

申请号：US14103131

申请日：2013-12-11

Applicant: HITACHI METALS, LTD.

Inventor： Daisuke SHANAI ,  Takashi Aoyama ,  Kazuhiko Sasada ,  Hiroaki Komatsu

IPC: H05K1/02 ,  C09J171/08 ,  C09J7/02 ,  H05K1/09

CPC classification number: H05K1/09 ,  C08G18/6407 ,  C08G18/8108 ,  C08G18/8116 ,  C08G2650/56 ,  C08L79/085 ,  C09J7/22 ,  C09J7/30 ,  C09J171/00 ,  C09J171/08 ,  C09J175/16 ,  C09J2201/128 ,  C09J2203/326 ,  C09J2461/00 ,  C09J2479/086 ,  H05K3/20 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0154 ,  Y10T428/24975 ,  Y10T428/2896

Abstract: An adhesive composition includes (A) a phenoxy resin including a plurality of hydroxyl groups at a side chain: 100 parts by mass, (B) a multifunctional isocyanate compound including an isocyanate and at least one functional group selected from the group consisting of a vinyl group, an acrylate group and a methacrylate group within its molecule: 2 to 55 parts by mass, (C) a maleimide compound and/or a reaction product thereof having a plurality of maleimide groups within its molecule: 5 to 30 parts by mass, and (D) one or more kinds of an inorganic filler having an average particle size of 5 μm or less which is measured by a laser diffraction: 1 to 50 parts by mass, a total amount of the components (B) and (C) is 7 to 60 parts by mass.

Abstract translation: 粘合剂组合物包含（A）包含侧链多个羟基的苯氧基树脂：100质量份，（B）包含异氰酸酯和至少一种选自乙烯基的官能团的多官能异氰酸酯化合物 基团，分子内的丙烯酸酯基和甲基丙烯酸酯基团：2〜55质量份，（C）分子内具有多个马来酰亚胺基团的马来酰亚胺化合物和/或其反应产物为5〜30质量份， 和（D）通过激光衍射测定的一种或多种平均粒径为5μm以下的无机填料：1〜50质量份，（B）成分和（C）成分的总量， 为7〜60质量份。

公开(公告)号：US20140158398A1

公开(公告)日：2014-06-12

申请号：US14098684

申请日：2013-12-06

Applicant: Hitachi Metals, Ltd.

Inventor： Daisuke SHANAI ,  Tomiya ABE

IPC: H01B3/42 ,  H01B7/08

CPC classification number: H01B3/421 ,  H01B3/427 ,  Y10T428/2852

Abstract: An adhesive resin composition includes 60 to 95 parts by mass of amorphous thermoplastic polyester-based resin (A), 5 to 40 parts by mass of polyphenylene ether-based polymer (B) including a hydroxyl group and a repeating unit of 2,6-dimethylphenylene ether in a molecule thereof, and 60 to 200 parts by mass of a flame retardant per total 100 parts by mass of the amorphous thermoplastic polyester based resin (A) and the polyphenylene ether-based polymer (B).

Abstract translation: 粘合性树脂组合物含有60〜95质量份无定形热塑性聚酯类树脂（A），5〜40质量份含有羟基的聚苯醚类聚合物（B）和2,6- 二苯基亚苯基醚和100〜100质量份无定形热塑性聚酯类树脂（A）和聚苯醚系聚合物（B）中的阻燃剂为60〜200质量份。