公开(公告)号：US11045978B2

公开(公告)日：2021-06-29

申请号：US16184244

申请日：2018-11-08

申请人： Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Toshiyuki Iseki ,  Mitsuru Naruse ,  Akira Saito ,  Shinzo Higuchi ,  Sohichiroh Iida

发明人： Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Toshiyuki Iseki ,  Mitsuru Naruse ,  Akira Saito ,  Shinzo Higuchi ,  Sohichiroh Iida

IPC分类号： B29B9/12 ,  B29C64/153 ,  B33Y70/00 ,  B33Y10/00 ,  B29B9/06 ,  C08J3/12 ,  B29K101/12

摘要： A particle for solid freeform fabrication having a columnar form has end surfaces and a side surface, wherein one of the end surfaces partially covers the side surface.

公开(公告)号：US20190241734A1

公开(公告)日：2019-08-08

申请号：US16268529

申请日：2019-02-06

申请人： Mitsuru Naruse ,  Akira Saito ,  Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Kiichi Kamoda ,  Sohichiroh Iida ,  Shinzo Higuchi ,  Toshiyuki Iseki

发明人： Mitsuru Naruse ,  Akira Saito ,  Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Kiichi Kamoda ,  Sohichiroh Iida ,  Shinzo Higuchi ,  Toshiyuki Iseki

IPC分类号： C08L67/02 ,  B29C64/153 ,  B33Y70/00 ,  C08J3/12

CPC分类号： C08L67/02 ,  B29B9/04 ,  B29B9/06 ,  B29B9/12 ,  B29B9/16 ,  B29C64/153 ,  B29K2105/0094 ,  B29K2105/251 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08J3/12 ,  C08J2367/02 ,  C08J2467/02 ,  C08L2205/025

摘要： A powder for solid freeform fabrication includes a first resin particle and a second resin particle, wherein MFR2 is greater than MFR1 and a ratio of MFR2 to MFR1 is from 2 to 5, where MFR1 represents a melt mass-flow rate (MFR) of the first resin particle and MFR2 represents a melt mass-flow rate of the second resin particle.

公开(公告)号：US20210317601A1

公开(公告)日：2021-10-14

申请号：US17346497

申请日：2021-06-14

申请人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

发明人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

IPC分类号： D01F6/66 ,  C08J3/12 ,  B33Y70/00 ,  C08K3/04 ,  B05D3/06 ,  C08K3/16 ,  C08K3/22 ,  C08K5/1575 ,  C08K5/527 ,  C08K7/14 ,  C08K7/20 ,  D01F1/07 ,  D01F1/10 ,  D01F6/06 ,  D01F6/80 ,  D01F6/84

摘要： A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.

公开(公告)号：US10800096B2

公开(公告)日：2020-10-13

申请号：US15919251

申请日：2018-03-13

申请人： Sohichiroh Iida ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

发明人： Sohichiroh Iida ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

IPC分类号： B29C64/153 ,  B29C64/264 ,  C08L67/04 ,  C08L67/07 ,  C08L71/00 ,  C08L77/10 ,  B33Y30/00 ,  B29C64/10 ,  B33Y70/00 ,  B29C64/165 ,  B33Y10/00 ,  B29B9/06 ,  B29B9/12 ,  B29K67/00 ,  B29K71/00 ,  B29K77/00

摘要： A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.

公开(公告)号：US11066758B2

公开(公告)日：2021-07-20

申请号：US15656214

申请日：2017-07-21

申请人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

发明人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

IPC分类号： B32B5/16 ,  D01F6/66 ,  C08J3/12 ,  B33Y70/00 ,  C08K3/04 ,  B05D3/06 ,  C08K3/16 ,  C08K3/22 ,  C08K5/1575 ,  C08K5/527 ,  C08K7/14 ,  C08K7/20 ,  D01F1/07 ,  D01F1/10 ,  D01F6/06 ,  D01F6/80 ,  D01F6/84

摘要： A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.

公开(公告)号：US20210023778A1

公开(公告)日：2021-01-28

申请号：US16936498

申请日：2020-07-23

申请人： Sohichiroh Iida ,  Hitoshi Iwatsuki ,  Satoshi Ogawa ,  Yunsheng Sun

发明人： Sohichiroh Iida ,  Hitoshi Iwatsuki ,  Satoshi Ogawa ,  Yunsheng Sun

IPC分类号： B29C64/153 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B29C64/268

摘要： A resin powder for solid freeform fabrication is provided which maintains the degree of smoothness of a thin layer formed with the resin powder for solid freeform fabrication even when the speed of supplying the resin powder for solid freeform fabrication using a recoater is increased and reduce lowering of the degree of smoothness of the thin layer caused by the resin powder for solid freeform fabrication that has scattered and accumulated on the recoater and others.