摘要:
A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.
摘要:
A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.
摘要:
A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.
摘要:
A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.
摘要:
A resin powder for solid freeform fabrication, having a melting point of 100 degrees C. or higher as measured according to ISO 3146 regulation and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15 degrees C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15 degrees C. lower than the melting point under a pressure of 0.1 kPa for four hours.
摘要:
A powder material for three-dimensional modeling includes a base particle and a coverage film including an organic material. The coverage film covers the base particle. The powder material is used for three dimensional modeling and when the coverage film is dissolved in a solvent to prepare a solution and the solution is formed into a coated film on a smooth surface, the coated film has a wetting tension of from 22 mN/m to 28 mN/m.
摘要:
A powder material for three-dimensional modeling includes a base particle and a resin covering the base particle, wherein the resin has a first absorption peak in the range of from 1,141 cm−1 to 1,145 cm−1 and a second absorption peak in the range of from 1,089 cm−1 to 1,093 cm−1 in an infrared absorption spectrum and the intensity ratio of the first absorption peak to the second absorption peak is from 0.40 to 0.70.
摘要:
A powder material for three-dimensional modeling includes a base material and a resin covering the base material, wherein the covering factor by the resin is 15 percent or more and the aspect ratio of the powder material is 0.90 or greater as calculated according to the following relation 1. Aspect ratio (average)=X1×Y1/100+X2×Y2/100+ . . . +Xn×Yn/100, Relation 1 In the Relation 1, Y1+Y2+ . . . +Yn=100 (percent), Xn represents the aspect ratio (minor axis/major axis), Yn represents an existence ratio (percent) of a particle having an aspect ratio of Xn, and n is 15,000 or greater.
摘要翻译:在关系1中,Y1 + Y2 +。 。 。 + Yn = 100(%),Xn表示长宽比(短轴/长轴),Yn表示纵横比为Xn,n为15000以上的粒子的存在比(百分比)。
摘要:
A powder for 3D modeling includes a base particle and a resin having a functional group represented by the following Chemical formula 1, where A1 represents O or NH and R1, R2, and R3 each, independently represent CH3, C2H5, C3H7, or C4H9. The base particle is covered with the resin.
摘要:
A powder material for three-dimensional modeling includes a base particle and a resin including a first water soluble resin and a second water soluble resin, wherein a first aqueous solution of the first water soluble resin having a concentration of two percent by mass has a thermally reversible sol-gel phase transition and is gelated at temperatures higher than a first phase transition temperature of the first aqueous solution.