公开(公告)号：US20210317601A1

公开(公告)日：2021-10-14

申请号：US17346497

申请日：2021-06-14

申请人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

发明人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

IPC分类号： D01F6/66 ,  C08J3/12 ,  B33Y70/00 ,  C08K3/04 ,  B05D3/06 ,  C08K3/16 ,  C08K3/22 ,  C08K5/1575 ,  C08K5/527 ,  C08K7/14 ,  C08K7/20 ,  D01F1/07 ,  D01F1/10 ,  D01F6/06 ,  D01F6/80 ,  D01F6/84

摘要： A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.

公开(公告)号：US10800096B2

公开(公告)日：2020-10-13

申请号：US15919251

申请日：2018-03-13

申请人： Sohichiroh Iida ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

发明人： Sohichiroh Iida ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

IPC分类号： B29C64/153 ,  B29C64/264 ,  C08L67/04 ,  C08L67/07 ,  C08L71/00 ,  C08L77/10 ,  B33Y30/00 ,  B29C64/10 ,  B33Y70/00 ,  B29C64/165 ,  B33Y10/00 ,  B29B9/06 ,  B29B9/12 ,  B29K67/00 ,  B29K71/00 ,  B29K77/00

摘要： A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.

公开(公告)号：US20180264721A1

公开(公告)日：2018-09-20

申请号：US15919251

申请日：2018-03-13

申请人： Sohichiroh IIDA ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

发明人： Sohichiroh IIDA ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

IPC分类号： B29C64/153 ,  B29C64/264 ,  C08L67/04 ,  C08L67/07 ,  C08L71/00 ,  C08L77/10

CPC分类号： B29C64/153 ,  B29B9/06 ,  B29B9/12 ,  B29B2009/125 ,  B29C64/10 ,  B29C64/165 ,  B29C64/264 ,  B29K2067/003 ,  B29K2067/006 ,  B29K2067/046 ,  B29K2071/00 ,  B29K2077/10 ,  B29K2995/0041 ,  B29K2995/0094 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08L67/04 ,  C08L67/07 ,  C08L71/00 ,  C08L77/10

摘要： A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.

公开(公告)号：US11066758B2

公开(公告)日：2021-07-20

申请号：US15656214

申请日：2017-07-21

申请人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

发明人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

IPC分类号： B32B5/16 ,  D01F6/66 ,  C08J3/12 ,  B33Y70/00 ,  C08K3/04 ,  B05D3/06 ,  C08K3/16 ,  C08K3/22 ,  C08K5/1575 ,  C08K5/527 ,  C08K7/14 ,  C08K7/20 ,  D01F1/07 ,  D01F1/10 ,  D01F6/06 ,  D01F6/80 ,  D01F6/84

摘要： A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.

公开(公告)号：US11052649B2

公开(公告)日：2021-07-06

申请号：US16007064

申请日：2018-06-13

申请人： Akira Saito ,  Shigenori Yaguchi ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Hitoshi Iwatsuki

发明人： Akira Saito ,  Shigenori Yaguchi ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Hitoshi Iwatsuki

IPC分类号： B33Y70/00 ,  C08K5/52 ,  C08K5/09 ,  C08K5/1575 ,  C08K5/372 ,  C08K5/521 ,  B29C64/153 ,  C08L71/00 ,  C08L77/06 ,  C08L59/00 ,  B33Y10/00 ,  C08L77/02 ,  C08K5/00 ,  B29K71/00 ,  B29K105/00 ,  B29K77/00 ,  B29K67/00 ,  B33Y30/00 ,  B29K23/00 ,  C08L23/12 ,  C08K5/36 ,  C08K5/49 ,  C08K5/098 ,  C08K5/13

摘要： A resin powder for solid freeform fabrication, having a melting point of 100 degrees C. or higher as measured according to ISO 3146 regulation and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15 degrees C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15 degrees C. lower than the melting point under a pressure of 0.1 kPa for four hours.

公开(公告)号：US09782935B2

公开(公告)日：2017-10-10

申请号：US15065161

申请日：2016-03-09

申请人： Yasuyuki Yamashita ,  Yasuo Suzuki ,  Mitsuru Naruse ,  Nozomu Tamoto ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Kazumi Ohtaki

发明人： Yasuyuki Yamashita ,  Yasuo Suzuki ,  Mitsuru Naruse ,  Nozomu Tamoto ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Kazumi Ohtaki

IPC分类号： B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B22F1/00 ,  B22F3/00 ,  C04B35/00 ,  B29K29/00 ,  B29L31/00 ,  C09D129/04

CPC分类号： B29C64/165 ,  B22F1/0062 ,  B22F3/003 ,  B22F3/008 ,  B29C64/20 ,  B29K2029/04 ,  B29L2031/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C04B35/00 ,  C09D129/04

摘要： A powder material for three-dimensional modeling includes a base particle and a coverage film including an organic material. The coverage film covers the base particle. The powder material is used for three dimensional modeling and when the coverage film is dissolved in a solvent to prepare a solution and the solution is formed into a coated film on a smooth surface, the coated film has a wetting tension of from 22 mN/m to 28 mN/m.

公开(公告)号：US20200070412A1

公开(公告)日：2020-03-05

申请号：US16555751

申请日：2019-08-29

申请人： Yunsheng SUN ,  Toshiyuki Mutoh ,  Hitoshi Iwatsuki ,  Shigenori Yaguchi ,  Mitsuru Naruse ,  Sohichiroh IIDA

发明人： Yunsheng SUN ,  Toshiyuki Mutoh ,  Hitoshi Iwatsuki ,  Shigenori Yaguchi ,  Mitsuru Naruse ,  Sohichiroh IIDA

IPC分类号： B29C64/153 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B29C64/20

摘要： A resin powder contains a resin, wherein the proportion of fine powder having a number diameter of 40 percent or less of a mean number diameter Mn of the resin powder is 30 percent or less in the resin powder.

公开(公告)号：US20140072910A1

公开(公告)日：2014-03-13

申请号：US13927744

申请日：2013-06-26

申请人： Hitoshi IWATSUKI ,  Shigenori Yaguchi ,  Toyoaki Tano ,  Mariko Takii ,  Koichi Sakata ,  Hiroyuki Kishida ,  Hiroshi Tohmatsu

发明人： Hitoshi IWATSUKI ,  Shigenori Yaguchi ,  Toyoaki Tano ,  Mariko Takii ,  Koichi Sakata ,  Hiroyuki Kishida ,  Hiroshi Tohmatsu

IPC分类号： G03G9/00 ,  G03G15/08

CPC分类号： G03G9/1139 ,  G03G9/1131 ,  G03G9/1136 ,  G03G9/1137

摘要： A carrier for developing an electrostatic latent image of the present invention includes a core material and a coating layer which coats the core material, wherein the coating layer includes a resin and fine particles, wherein the coating layer has an average layer thickness difference of 0.02 μm to 3.0 μm, and wherein the carrier for developing an electrostatic latent image has an arithmetic mean surface roughness Ra1 of 0.5 μm to 0.9 μm.

摘要翻译： 本发明的静电潜像显影用载体包括芯材和覆盖芯材的涂层，其中，涂层包含树脂和微粒，其中，涂层的平均层厚度差为0.02μm 至3.0μm，并且其中用于显影静电潜像的载体具有0.5μm至0.9μm的算术平均表面粗糙度Ra1。

公开(公告)号：US20130101930A1

公开(公告)日：2013-04-25

申请号：US13648540

申请日：2012-10-10

申请人： Kimitoshi Yamaguchi ,  Shigenori Yaguchi ,  Toyoshi Sawada ,  Hiroshi Tohmatsu ,  Hitoshi Iwatsuki ,  Toyoaki Tano

发明人： Kimitoshi Yamaguchi ,  Shigenori Yaguchi ,  Toyoshi Sawada ,  Hiroshi Tohmatsu ,  Hitoshi Iwatsuki ,  Toyoaki Tano

IPC分类号： G03G9/00 ,  G03G15/08

CPC分类号： G03G9/0819 ,  G03G9/0823 ,  G03G9/107 ,  G03G9/1075 ,  G03G9/1131 ,  G03G9/1139

摘要： A carrier for developing an electrostatic latent image, including a particulate core material having a magnetism having developed spontaneous magnetization; and a covering layer comprising an electroconductive material, covering the surface of the particulate core material, wherein the carrier has an electrical resistivity Log R [Ωcm] of from 8.0 to 12.0 when measured by a method, including filling the carrier in a cell containing a pair of facing electrodes, each having a surface area of 2×4 [cm2] with a gap of 2 [mm] therebetween; and applying a DC voltage of 1,000 [V] therebetween to measure a DC resistivity, and a weight-average particle diameter (Dw) of from 25 to 45

摘要翻译： 用于显影静电潜像的载体，包括具有显影自发磁化的磁性的颗粒状芯材料; 以及包括导电材料的覆盖层，覆盖颗粒芯材料的表面，其中当通过一种方法测量时，载体的电阻率Log RΩ= 8.0至12.0，包括将载体填充在含有 一对面对电极，各自具有2×4 [cm 2]的表面积，间隙为2 [mm]; 在其间施加1000 [V]的直流电压，测定直流电阻率，重均粒径（Dw）为25〜45

公开(公告)号：US20120064451A1

公开(公告)日：2012-03-15

申请号：US13226219

申请日：2011-09-06

申请人： Hiroyuki Kishida ,  Shigenori Yaguchi ,  Kimitoshi Yamaguchi ,  Toyoshi Sawada ,  Hiroshi Tohmatsu ,  Koichi Sakata ,  Hitoshi Iwatsuki ,  Toyoaki Tano ,  Mariko Takii

发明人： Hiroyuki Kishida ,  Shigenori Yaguchi ,  Kimitoshi Yamaguchi ,  Toyoshi Sawada ,  Hiroshi Tohmatsu ,  Koichi Sakata ,  Hitoshi Iwatsuki ,  Toyoaki Tano ,  Mariko Takii

IPC分类号： G03G9/00 ,  G03G21/16 ,  G03G15/08

CPC分类号： G03G15/08 ,  G03G9/1075 ,  G03G9/1131 ,  G03G9/1133 ,  G03G9/1139 ,  G03G2215/0607

摘要： A carrier comprising a magnetic core particle having a shape factor SF-2 of 130 to 160 and a resin layer covering a surface of the magnetic core particle. The resin layer comprises a conductive particle and a resin obtained by heating a copolymer comprising a silicon-containing A unit and another silicon-containing B unit having.

摘要翻译： 一种载体，其包含具有130至160的形状系数SF-2的磁芯颗粒和覆盖该磁芯颗粒的表面的树脂层。 树脂层包括导电颗粒和通过加热包含含硅A单元和另一含硅B单元的共聚物而获得的树脂。