公开(公告)号：US11045978B2

公开(公告)日：2021-06-29

申请号：US16184244

申请日：2018-11-08

申请人： Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Toshiyuki Iseki ,  Mitsuru Naruse ,  Akira Saito ,  Shinzo Higuchi ,  Sohichiroh Iida

发明人： Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Toshiyuki Iseki ,  Mitsuru Naruse ,  Akira Saito ,  Shinzo Higuchi ,  Sohichiroh Iida

IPC分类号： B29B9/12 ,  B29C64/153 ,  B33Y70/00 ,  B33Y10/00 ,  B29B9/06 ,  C08J3/12 ,  B29K101/12

摘要： A particle for solid freeform fabrication having a columnar form has end surfaces and a side surface, wherein one of the end surfaces partially covers the side surface.

公开(公告)号：US20190241734A1

公开(公告)日：2019-08-08

申请号：US16268529

申请日：2019-02-06

申请人： Mitsuru Naruse ,  Akira Saito ,  Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Kiichi Kamoda ,  Sohichiroh Iida ,  Shinzo Higuchi ,  Toshiyuki Iseki

发明人： Mitsuru Naruse ,  Akira Saito ,  Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Toshiyuki Mutoh ,  Yasutomo Aman ,  Kiichi Kamoda ,  Sohichiroh Iida ,  Shinzo Higuchi ,  Toshiyuki Iseki

IPC分类号： C08L67/02 ,  B29C64/153 ,  B33Y70/00 ,  C08J3/12

CPC分类号： C08L67/02 ,  B29B9/04 ,  B29B9/06 ,  B29B9/12 ,  B29B9/16 ,  B29C64/153 ,  B29K2105/0094 ,  B29K2105/251 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08J3/12 ,  C08J2367/02 ,  C08J2467/02 ,  C08L2205/025

摘要： A powder for solid freeform fabrication includes a first resin particle and a second resin particle, wherein MFR2 is greater than MFR1 and a ratio of MFR2 to MFR1 is from 2 to 5, where MFR1 represents a melt mass-flow rate (MFR) of the first resin particle and MFR2 represents a melt mass-flow rate of the second resin particle.

公开(公告)号：US20210317601A1

公开(公告)日：2021-10-14

申请号：US17346497

申请日：2021-06-14

申请人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

发明人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

IPC分类号： D01F6/66 ,  C08J3/12 ,  B33Y70/00 ,  C08K3/04 ,  B05D3/06 ,  C08K3/16 ,  C08K3/22 ,  C08K5/1575 ,  C08K5/527 ,  C08K7/14 ,  C08K7/20 ,  D01F1/07 ,  D01F1/10 ,  D01F6/06 ,  D01F6/80 ,  D01F6/84

摘要： A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.

公开(公告)号：US10800096B2

公开(公告)日：2020-10-13

申请号：US15919251

申请日：2018-03-13

申请人： Sohichiroh Iida ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

发明人： Sohichiroh Iida ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

IPC分类号： B29C64/153 ,  B29C64/264 ,  C08L67/04 ,  C08L67/07 ,  C08L71/00 ,  C08L77/10 ,  B33Y30/00 ,  B29C64/10 ,  B33Y70/00 ,  B29C64/165 ,  B33Y10/00 ,  B29B9/06 ,  B29B9/12 ,  B29K67/00 ,  B29K71/00 ,  B29K77/00

摘要： A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.

公开(公告)号：US20180264721A1

公开(公告)日：2018-09-20

申请号：US15919251

申请日：2018-03-13

申请人： Sohichiroh IIDA ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

发明人： Sohichiroh IIDA ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Shinzo Higuchi ,  Akira Saito ,  Yasuyuki Yamashita ,  Kiichi Kamoda

IPC分类号： B29C64/153 ,  B29C64/264 ,  C08L67/04 ,  C08L67/07 ,  C08L71/00 ,  C08L77/10

CPC分类号： B29C64/153 ,  B29B9/06 ,  B29B9/12 ,  B29B2009/125 ,  B29C64/10 ,  B29C64/165 ,  B29C64/264 ,  B29K2067/003 ,  B29K2067/006 ,  B29K2067/046 ,  B29K2071/00 ,  B29K2077/10 ,  B29K2995/0041 ,  B29K2995/0094 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08L67/04 ,  C08L67/07 ,  C08L71/00 ,  C08L77/10

摘要： A resin powder for solid freeform fabrication includes resin particles having a significantly pillar-like form including resin particles having a concave portion on the circumferential side surface.

公开(公告)号：US11066758B2

公开(公告)日：2021-07-20

申请号：US15656214

申请日：2017-07-21

申请人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

发明人： Akira Saito ,  Shigenori Yaguchi ,  Yasuyuki Yamashita ,  Kiichi Kamoda ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Hitoshi Iwatsuki ,  Shinzo Higuchi ,  Sohichiroh Iida

IPC分类号： B32B5/16 ,  D01F6/66 ,  C08J3/12 ,  B33Y70/00 ,  C08K3/04 ,  B05D3/06 ,  C08K3/16 ,  C08K3/22 ,  C08K5/1575 ,  C08K5/527 ,  C08K7/14 ,  C08K7/20 ,  D01F1/07 ,  D01F1/10 ,  D01F6/06 ,  D01F6/80 ,  D01F6/84

摘要： A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.

公开(公告)号：US10682808B2

公开(公告)日：2020-06-16

申请号：US16056855

申请日：2018-08-07

申请人： Takashi Fujita ,  Akira Saito ,  Kiichi Kamoda ,  Yasutada Shitara ,  Kazuhiko Watanabe ,  Hitoshi Iwatsuki ,  Yuuya Endoh ,  Kazufumi Kimura ,  Yasuyuki Yamashita ,  Shinnosuke Koshizuka ,  Yuuki Kamon ,  Nozomu Tamoto

发明人： Takashi Fujita ,  Akira Saito ,  Kiichi Kamoda ,  Yasutada Shitara ,  Kazuhiko Watanabe ,  Hitoshi Iwatsuki ,  Yuuya Endoh ,  Kazufumi Kimura ,  Yasuyuki Yamashita ,  Shinnosuke Koshizuka ,  Yuuki Kamon ,  Nozomu Tamoto

IPC分类号： B29C64/147 ,  B29C64/218 ,  B29C64/40

摘要： A fabrication method includes laminating a fabrication material to form an object, and applying a release material on a surface of the object to form a release layer on the surface of the object. A surface free energy of the release material is equal to or smaller than 25 mN/m.

公开(公告)号：US20160272817A1

公开(公告)日：2016-09-22

申请号：US15073192

申请日：2016-03-17

申请人： Mitsuru Naruse ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Yasuyuki Yamashita ,  Hitoshi Iwatsuki ,  Kazumi Ohtaki

发明人： Mitsuru Naruse ,  Yasuo Suzuki ,  Nozomu Tamoto ,  Yasuyuki Yamashita ,  Hitoshi Iwatsuki ,  Kazumi Ohtaki

IPC分类号： C09D5/03 ,  B22F3/22 ,  B28B1/00 ,  C09D101/28 ,  C09D129/04

CPC分类号： C09D5/03 ,  B22F1/0062 ,  B22F1/0074 ,  B22F3/008 ,  B22F3/22 ,  B22F2998/10 ,  B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C09D101/28 ,  C09D129/04 ,  B22F3/1003

摘要： A powder material for three-dimensional modeling includes a base particle and a resin including a first water soluble resin and a second water soluble resin, wherein a first aqueous solution of the first water soluble resin having a concentration of two percent by mass has a thermally reversible sol-gel phase transition and is gelated at temperatures higher than a first phase transition temperature of the first aqueous solution.

摘要翻译： 用于三维建模的粉末材料包括基础颗粒和包含第一水溶性树脂和第二水溶性树脂的树脂，其中浓度为2质量％的第一水溶性树脂的第一水溶液具有热 可逆溶胶 - 凝胶相变，并在高于第一水溶液的第一相转变温度的温度下凝胶化。

公开(公告)号：US09782935B2

公开(公告)日：2017-10-10

申请号：US15065161

申请日：2016-03-09

申请人： Yasuyuki Yamashita ,  Yasuo Suzuki ,  Mitsuru Naruse ,  Nozomu Tamoto ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Kazumi Ohtaki

发明人： Yasuyuki Yamashita ,  Yasuo Suzuki ,  Mitsuru Naruse ,  Nozomu Tamoto ,  Shigenori Yaguchi ,  Hitoshi Iwatsuki ,  Kazumi Ohtaki

IPC分类号： B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B22F1/00 ,  B22F3/00 ,  C04B35/00 ,  B29K29/00 ,  B29L31/00 ,  C09D129/04

CPC分类号： B29C64/165 ,  B22F1/0062 ,  B22F3/003 ,  B22F3/008 ,  B29C64/20 ,  B29K2029/04 ,  B29L2031/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C04B35/00 ,  C09D129/04

摘要： A powder material for three-dimensional modeling includes a base particle and a coverage film including an organic material. The coverage film covers the base particle. The powder material is used for three dimensional modeling and when the coverage film is dissolved in a solvent to prepare a solution and the solution is formed into a coated film on a smooth surface, the coated film has a wetting tension of from 22 mN/m to 28 mN/m.

公开(公告)号：US09708502B2

公开(公告)日：2017-07-18

申请号：US14956916

申请日：2015-12-02

申请人： Mitsuru Naruse ,  Nozomu Tamoto ,  Yasuo Suzuki ,  Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Kazumi Ohtaki

发明人： Mitsuru Naruse ,  Nozomu Tamoto ,  Yasuo Suzuki ,  Hitoshi Iwatsuki ,  Yasuyuki Yamashita ,  Kazumi Ohtaki

IPC分类号： C09D129/04 ,  C08K9/10 ,  B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B22F3/00 ,  B22F1/00 ,  B22F3/105

CPC分类号： C09D129/04 ,  B22F1/0059 ,  B22F3/008 ,  B22F2003/1056 ,  B29C64/165 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C08K9/10 ,  Y02P10/295

摘要： A powder for 3D modeling includes a base particle and a resin having a functional group represented by the following Chemical formula 1, where A1 represents O or NH and R1, R2, and R3 each, independently represent CH3, C2H5, C3H7, or C4H9. The base particle is covered with the resin.