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公开(公告)号：US20120012379A1
公开(公告)日：2012-01-19
申请号：US13200355
申请日：2011-09-23
申请人： Ho-Sik Park , Keung-Jin Sohn , Joon-Sik Shin , Sang-Youp Lee , Joung-Gul Ryu , Jung-Hwan Park , Jee-Soo Mok
发明人： Ho-Sik Park , Keung-Jin Sohn , Joon-Sik Shin , Sang-Youp Lee , Joung-Gul Ryu , Jung-Hwan Park , Jee-Soo Mok
IPC分类号： H05K1/11
CPC分类号： H05K3/4069 , H05K3/20 , H05K3/281 , H05K3/4602 , H05K3/4647 , H05K3/4658 , H05K3/4682 , H05K2201/09481 , H05K2203/0156 , H05K2203/066 , H05K2203/1189 , Y10T29/49124
摘要： A printed circuit board including: an insulation layer; a first pattern buried in one surface of the insulation layer; a first resin layer laminated on one surface of the insulation layer to cover the first pattern; a second pattern buried in the other surface of the insulation layer; a via electrically connecting the first pattern with the second pattern; and a second resin layer laminated on the other surface of the insulation layer to cover the second pattern.
摘要翻译： 一种印刷电路板，包括：绝缘层; 绝缘层的一个表面中的第一图案; 层叠在所述绝缘层的一个表面上以覆盖所述第一图案的第一树脂层; 掩埋在所述绝缘层的另一个表面中的第二图案; 通孔，电连接第一图案与第二图案; 以及层叠在所述绝缘层的另一表面上以覆盖所述第二图案的第二树脂层。
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公开(公告)号：US20120030938A1
公开(公告)日：2012-02-09
申请号：US13317026
申请日：2011-10-07
申请人： Ho-Sik Park , Keung-Jin Sohn , Joon-Sik Shin , Sang-Youp Lee , Joung-Gul Ryu , Jung-Hwan Park , Jee-Soo Mok
发明人： Ho-Sik Park , Keung-Jin Sohn , Joon-Sik Shin , Sang-Youp Lee , Joung-Gul Ryu , Jung-Hwan Park , Jee-Soo Mok
IPC分类号： H05K3/00
CPC分类号： H05K3/4069 , H05K3/20 , H05K3/281 , H05K3/4602 , H05K3/4647 , H05K3/4658 , H05K3/4682 , H05K2201/09481 , H05K2203/0156 , H05K2203/066 , H05K2203/1189 , Y10T29/49124
摘要： A printed circuit board including: an inner layer substrate part; a first insulation layer laminated on one surface of the inner layer substrate part; a first pattern buried in one surface of the first insulation layer; a first resin layer laminated on one surface of the first insulation layer to cover the first pattern; and a first via electrically connecting the first pattern with the inner layer substrate part, wherein the first resin layer is made of a material comprising one of Liquid Crystal Polymer (LCP), Polyimide (PI), Polytetrafluoroethylene (PTFE). Polyetheretherketon (PEEK) and a photo solder resist.
摘要翻译： 一种印刷电路板，包括：内层基板部分; 层叠在所述内层基板部的一个表面上的第一绝缘层; 掩埋在所述第一绝缘层的一个表面中的第一图案; 层叠在所述第一绝缘层的一个表面上以覆盖所述第一图案的第一树脂层; 以及将第一图案与内层基板部电连接的第一通孔，其中第一树脂层由包含液晶聚合物（LCP），聚酰亚胺（PI），聚四氟乙烯（PTFE）中的一种的材料制成。 聚醚醚酮（PEEK）和光阻焊剂。
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公开(公告)号：US20120018195A1
公开(公告)日：2012-01-26
申请号：US13200329
申请日：2011-09-23
申请人： Ho-Sik Park , Keung-Jin Sohn , Joon-Sik Shin , Sang-Youp Lee , Joung-Gul Ryu , Jung-Hwan Park , Jee-Soo Mok
发明人： Ho-Sik Park , Keung-Jin Sohn , Joon-Sik Shin , Sang-Youp Lee , Joung-Gul Ryu , Jung-Hwan Park , Jee-Soo Mok
IPC分类号： H05K1/02
CPC分类号： H05K3/4069 , H05K3/20 , H05K3/281 , H05K3/4602 , H05K3/4647 , H05K3/4658 , H05K3/4682 , H05K2201/09481 , H05K2203/0156 , H05K2203/066 , H05K2203/1189 , Y10T29/49124
摘要： A printed circuit board including: an inner layer substrate part; a first insulation layer laminated on one surface of the inner layer substrate part; a first pattern buried in one surface of the first insulation layer; a first resin layer laminated on one surface of the first insulation layer to cover the first pattern; and a first via electrically connecting the first pattern with the inner layer substrate part, wherein the first resin layer is made of a material comprising one of Liquid Crystal Polymer (LCP), Polyimide (PI), Polytetrafluoroethylene (PTFE). Polyetheretherketon (PEEK) and a photo solder resist.
摘要翻译： 一种印刷电路板，包括：内层基板部分; 层叠在所述内层基板部的一个表面上的第一绝缘层; 掩埋在所述第一绝缘层的一个表面中的第一图案; 层叠在所述第一绝缘层的一个表面上以覆盖所述第一图案的第一树脂层; 以及将第一图案与内层基板部电连接的第一通孔，其中第一树脂层由包含液晶聚合物（LCP），聚酰亚胺（PI），聚四氟乙烯（PTFE）中的一种的材料制成。 聚醚醚酮（PEEK）和光阻焊剂。
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公开(公告)号：US20090250253A1
公开(公告)日：2009-10-08
申请号：US12285871
申请日：2008-10-15
申请人： Ho-Sik Park , Keung-Jin Sohn , Joon-Sik Shin , Sang-Youp Lee , Joung-Gul Ryu , Jung-Hwan Park , Jee-Soo Mok
发明人： Ho-Sik Park , Keung-Jin Sohn , Joon-Sik Shin , Sang-Youp Lee , Joung-Gul Ryu , Jung-Hwan Park , Jee-Soo Mok
CPC分类号： H05K3/4069 , H05K3/20 , H05K3/281 , H05K3/4602 , H05K3/4647 , H05K3/4658 , H05K3/4682 , H05K2201/09481 , H05K2203/0156 , H05K2203/066 , H05K2203/1189 , Y10T29/49124
摘要： Disclosed are a printed circuit board and a manufacturing method thereof. The method of manufacturing a printed circuit board in accordance with an embodiment of the present invention includes: providing a first resin layer having a first pattern on one surface thereof; forming a conductive bump, which is electrically connected to the first pattern, on one surface of the first resin layer; compressing an insulation layer and the first resin layer such that the conductive bump passes through the insulation layer; laminating a second resin layer, which has a second pattern on a surface thereof facing the insulation layer, on the insulation layer; and forming an opening by etching a part of at least one of the first resin layer and the second resin layer.
摘要翻译： 公开了一种印刷电路板及其制造方法。 根据本发明实施例的制造印刷电路板的方法包括：在其一个表面上提供具有第一图案的第一树脂层; 在所述第一树脂层的一个表面上形成与所述第一图案电连接的导电凸块; 压缩绝缘层和第一树脂层，使得导电凸块穿过绝缘层; 在绝缘层上层叠在其面对绝缘层的表面上具有第二图案的第二树脂层; 以及通过蚀刻所述第一树脂层和所述第二树脂层中的至少一个的一部分来形成开口。
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公开(公告)号：US08397378B2
公开(公告)日：2013-03-19
申请号：US12232894
申请日：2008-09-25
申请人： Keung-Jin Sohn , Joon-Sik Shin , Joung-Gul Ryu , Jung-Hwan Park , Ho-Sik Park , Sang-Youp Lee
发明人： Keung-Jin Sohn , Joon-Sik Shin , Joung-Gul Ryu , Jung-Hwan Park , Ho-Sik Park , Sang-Youp Lee
CPC分类号： H05K1/0366 , C08J5/046 , H05K2201/0116 , H05K2201/0129 , H05K2201/0141 , H05K2201/0293 , Y10T29/49126 , Y10T29/49156
摘要： A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.
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6.发明申请公开(公告)号：US20090255714A1
公开(公告)日：2009-10-15
申请号：US12232894
申请日：2008-09-25
申请人： Keung-Jin Sohn , Joon-Sik Shin , Joung-Gul Ryu , Jung-Hwan Park , Ho-Sik Park , Sang-Youp Lee
发明人： Keung-Jin Sohn , Joon-Sik Shin , Joung-Gul Ryu , Jung-Hwan Park , Ho-Sik Park , Sang-Youp Lee
CPC分类号： H05K1/0366 , C08J5/046 , H05K2201/0116 , H05K2201/0129 , H05K2201/0141 , H05K2201/0293 , Y10T29/49126 , Y10T29/49156
摘要： A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.
摘要翻译： 公开了一种绝缘片的制造方法，覆铜层压板的制造方法以及印刷电路板的制造方法以及使用这些方法制造的印刷电路板。 制造绝缘片的方法可以包括：形成热塑性增强材料，其包括由热塑性聚合物粘合剂固定的纤维，并且其中形成有孔; 形成热塑性树脂层，使得热塑性增强材料用热塑性树脂浸渍; 并热压热塑性增强材料和热塑性树脂层。 该方法可以用于制造绝缘片，其具有低吸湿率和极好的电性能，包括低介电常数（Dk）和低介电损耗（Df），并且其中纤维可以容易地浸渍 树脂。
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公开(公告)号：US08450618B2
公开(公告)日：2013-05-28
申请号：US13137656
申请日：2011-08-31
申请人： Keung-Jin Sohn , Joon-Sik Shin , Joung-Gul Ryu , Jung-Hwan Park , Ho-Sik Park , Sang-Youp Lee
发明人： Keung-Jin Sohn , Joon-Sik Shin , Joung-Gul Ryu , Jung-Hwan Park , Ho-Sik Park , Sang-Youp Lee
CPC分类号： H05K1/0366 , C08J5/046 , H05K2201/0116 , H05K2201/0129 , H05K2201/0141 , H05K2201/0293 , Y10T29/49126 , Y10T29/49156
摘要： A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher.
摘要翻译： 印刷电路板包括： 一种热塑性增强材料，其具有通过热塑性聚合物粘合剂固定并具有形成在其中的孔的纤维; 热塑性树脂层，其具有浸渍有热塑性树脂的热塑性增强材料; 以及形成在热塑性树脂层上的电路图案，其中，热塑性增强材料和热塑性树脂层的厚度比（热塑性增强材料的厚度÷热塑性树脂层的厚度）为0.9以上。
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公开(公告)号：US20110315437A1
公开(公告)日：2011-12-29
申请号：US13137656
申请日：2011-08-31
申请人： Keung-Jin Sohn , Joon-Sik Shin , Joung-Gul Ryu , Jung-Hwan Park , Ho-Sik Park , Sang-Youp Lee
发明人： Keung-Jin Sohn , Joon-Sik Shin , Joung-Gul Ryu , Jung-Hwan Park , Ho-Sik Park , Sang-Youp Lee
IPC分类号： H05K1/00
CPC分类号： H05K1/0366 , C08J5/046 , H05K2201/0116 , H05K2201/0129 , H05K2201/0141 , H05K2201/0293 , Y10T29/49126 , Y10T29/49156
摘要： A printed circuit board includes; a thermoplastic reinforcement material having fibers secured by a thermoplastic polymer binder and having pores formed therein; a thermoplastic resin layer having the thermoplastic reinforcement material impregnated with a thermoplastic resin; and a circuit pattern formed over the thermoplastic resin layer, wherein the thermoplastic reinforcement material and the thermoplastic resin layer have a thickness ratio (thickness of the thermoplastic reinforcement material÷thickness of the thermoplastic resin layer) of 0.9 or higher.
摘要翻译： 印刷电路板包括： 一种热塑性增强材料，其具有通过热塑性聚合物粘合剂固定并具有形成在其中的孔的纤维; 热塑性树脂层，其具有浸渍有热塑性树脂的热塑性增强材料; 以及形成在热塑性树脂层上的电路图案，其中热塑性增强材料和热塑性树脂层具有0.9或更高的厚度比（热塑性增强材料的厚度÷热塑性树脂层的厚度）。
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