公开(公告)号：US20120152753A1

公开(公告)日：2012-06-21

申请号：US13045941

申请日：2011-03-11

申请人： Suk Won LEE ,  Tae Eun CHANG ,  Ho Sik PARK ,  Keung Jin SOHN

发明人： Suk Won LEE ,  Tae Eun CHANG ,  Ho Sik PARK ,  Keung Jin SOHN

IPC分类号： C25D5/02 ,  H05K3/00

CPC分类号： H05K3/4647 ,  H05K3/4602 ,  H05K2201/096 ,  H05K2203/025

摘要： Disclosed herein is a method of manufacturing a printed circuit board that simultaneously forms a via and an embedding land and thus improves the matching value of the via and the embedding land to secure interlayer conduction reliability, and further simultaneously forms the via and the embedding land to reduce manufacturing costs. In addition, the embedding land is formed to be embedded in the second insulating layer to implement high-density/high-integration of the printed circuit board and a via is formed in less time as compared to a method of forming a via hole using laser to reduce a process time.

摘要翻译： 本发明公开了一种制造印刷电路板的方法，该印刷电路板同时形成通孔和嵌入台面，从而提高通孔和嵌入层的匹配值，从而确保层间传导可靠性，并且进一步同时形成通孔和嵌入层 降低制造成本。 此外，与通过使用激光形成通孔的方法相比，嵌入式焊盘形成为嵌入第二绝缘层中以实现印刷电路板的高密度/高集成度，并且在较少的时间内形成通孔 以减少处理时间。

公开(公告)号：US20120088334A1

公开(公告)日：2012-04-12

申请号：US13007444

申请日：2011-01-14

申请人： Mi Sun HWANG ,  Keung Jin SOHN ,  Eung Suek LEE ,  Myung Sam KANG

发明人： Mi Sun HWANG ,  Keung Jin SOHN ,  Eung Suek LEE ,  Myung Sam KANG

IPC分类号： H01L21/60

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81192 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4647 ,  H05K2203/0384 ,  H01L2924/00015 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a method for manufacturing a semiconductor package which uses a base member 120 in which a first metal layer 113, a barrier layer 115, and a second metal layer 117 are stacked on both surface thereof in sequence based on an adhesive member 111 to simultaneously manufacture two printed circuit boards through a single sheet process, thereby making it possible to improve manufacturing efficiency; electrically connects a semiconductor chip 300 to a printed circuit board through a solder bump 250, thereby making it possible to implement a high-density package substrate; and forms a metal post 140 instead of a through hole to required in an interlayer circuit connection, thereby making it possible to reduce costs required in the processing/plating of the through hole.

摘要翻译： 本发明公开了一种半导体封装件的制造方法，该半导体封装件使用基片120，其中第一金属层113，阻挡层115和第二金属层117依次以两个表面层叠在第一金属层113，阻挡层115和第二金属层117上， 同时通过单片工艺制造两个印刷电路板，从而可以提高制造效率; 通过焊料凸块250将半导体芯片300电连接到印刷电路板，从而可以实现高密度封装基板; 并且形成金属柱140而不是层间电路连接所需的通孔，从而可以降低通孔的加工/电镀所需的成本。

公开(公告)号：US20120030938A1

公开(公告)日：2012-02-09

申请号：US13317026

申请日：2011-10-07

申请人： Ho-Sik Park ,  Keung-Jin Sohn ,  Joon-Sik Shin ,  Sang-Youp Lee ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Jee-Soo Mok

发明人： Ho-Sik Park ,  Keung-Jin Sohn ,  Joon-Sik Shin ,  Sang-Youp Lee ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Jee-Soo Mok

IPC分类号： H05K3/00

CPC分类号： H05K3/4069 ,  H05K3/20 ,  H05K3/281 ,  H05K3/4602 ,  H05K3/4647 ,  H05K3/4658 ,  H05K3/4682 ,  H05K2201/09481 ,  H05K2203/0156 ,  H05K2203/066 ,  H05K2203/1189 ,  Y10T29/49124

摘要： A printed circuit board including: an inner layer substrate part; a first insulation layer laminated on one surface of the inner layer substrate part; a first pattern buried in one surface of the first insulation layer; a first resin layer laminated on one surface of the first insulation layer to cover the first pattern; and a first via electrically connecting the first pattern with the inner layer substrate part, wherein the first resin layer is made of a material comprising one of Liquid Crystal Polymer (LCP), Polyimide (PI), Polytetrafluoroethylene (PTFE). Polyetheretherketon (PEEK) and a photo solder resist.

摘要翻译： 一种印刷电路板，包括：内层基板部分; 层叠在所述内层基板部的一个表面上的第一绝缘层; 掩埋在所述第一绝缘层的一个表面中的第一图案; 层叠在所述第一绝缘层的一个表面上以覆盖所述第一图案的第一树脂层; 以及将第一图案与内层基板部电连接的第一通孔，其中第一树脂层由包含液晶聚合物（LCP），聚酰亚胺（PI），聚四氟乙烯（PTFE）中的一种的材料制成。 聚醚醚酮（PEEK）和光阻焊剂。

公开(公告)号：US20120018195A1

公开(公告)日：2012-01-26

申请号：US13200329

申请日：2011-09-23

申请人： Ho-Sik Park ,  Keung-Jin Sohn ,  Joon-Sik Shin ,  Sang-Youp Lee ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Jee-Soo Mok

发明人： Ho-Sik Park ,  Keung-Jin Sohn ,  Joon-Sik Shin ,  Sang-Youp Lee ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Jee-Soo Mok

IPC分类号： H05K1/02

CPC分类号： H05K3/4069 ,  H05K3/20 ,  H05K3/281 ,  H05K3/4602 ,  H05K3/4647 ,  H05K3/4658 ,  H05K3/4682 ,  H05K2201/09481 ,  H05K2203/0156 ,  H05K2203/066 ,  H05K2203/1189 ,  Y10T29/49124

摘要： A printed circuit board including: an inner layer substrate part; a first insulation layer laminated on one surface of the inner layer substrate part; a first pattern buried in one surface of the first insulation layer; a first resin layer laminated on one surface of the first insulation layer to cover the first pattern; and a first via electrically connecting the first pattern with the inner layer substrate part, wherein the first resin layer is made of a material comprising one of Liquid Crystal Polymer (LCP), Polyimide (PI), Polytetrafluoroethylene (PTFE). Polyetheretherketon (PEEK) and a photo solder resist.

摘要翻译： 一种印刷电路板，包括：内层基板部分; 层叠在所述内层基板部的一个表面上的第一绝缘层; 掩埋在所述第一绝缘层的一个表面中的第一图案; 层叠在所述第一绝缘层的一个表面上以覆盖所述第一图案的第一树脂层; 以及将第一图案与内层基板部电连接的第一通孔，其中第一树脂层由包含液晶聚合物（LCP），聚酰亚胺（PI），聚四氟乙烯（PTFE）中的一种的材料制成。 聚醚醚酮（PEEK）和光阻焊剂。

公开(公告)号：US20110139858A1

公开(公告)日：2011-06-16

申请号：US12721544

申请日：2010-03-10

申请人： Seong Min Cho ,  Keung Jin Sohn ,  Chang Gun Oh ,  Hyun Jung Hong ,  Tae Kyun Bae

发明人： Seong Min Cho ,  Keung Jin Sohn ,  Chang Gun Oh ,  Hyun Jung Hong ,  Tae Kyun Bae

IPC分类号： B23K31/02 ,  B32B15/01

CPC分类号： H05K3/4644 ,  H05K3/0097 ,  H05K2203/1536 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/12986

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities.

摘要翻译： 这里公开了一种用于制造基板的载体，包括：两个绝缘层，每个绝缘层的一侧上设置有第一金属层，在另一侧上设置有第二金属层; 以及第三金属层，其具有比所述第一金属层低的熔点，并且形成在分别形成在所述两个绝缘层上的所述两个第一金属层之间，使得所述两个第一金属层彼此附接。 载体的优点在于，可以通过加热第三金属层来分离载体，使得在分离载体时基板的尺寸不变，从而保持基板和制造设备之间的相容性。

公开(公告)号：US20090250253A1

公开(公告)日：2009-10-08

申请号：US12285871

申请日：2008-10-15

申请人： Ho-Sik Park ,  Keung-Jin Sohn ,  Joon-Sik Shin ,  Sang-Youp Lee ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Jee-Soo Mok

发明人： Ho-Sik Park ,  Keung-Jin Sohn ,  Joon-Sik Shin ,  Sang-Youp Lee ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Jee-Soo Mok

IPC分类号： H05K1/02 ,  C23F1/00 ,  G03F7/20 ,  H05K1/00

CPC分类号： H05K3/4069 ,  H05K3/20 ,  H05K3/281 ,  H05K3/4602 ,  H05K3/4647 ,  H05K3/4658 ,  H05K3/4682 ,  H05K2201/09481 ,  H05K2203/0156 ,  H05K2203/066 ,  H05K2203/1189 ,  Y10T29/49124

摘要： Disclosed are a printed circuit board and a manufacturing method thereof. The method of manufacturing a printed circuit board in accordance with an embodiment of the present invention includes: providing a first resin layer having a first pattern on one surface thereof; forming a conductive bump, which is electrically connected to the first pattern, on one surface of the first resin layer; compressing an insulation layer and the first resin layer such that the conductive bump passes through the insulation layer; laminating a second resin layer, which has a second pattern on a surface thereof facing the insulation layer, on the insulation layer; and forming an opening by etching a part of at least one of the first resin layer and the second resin layer.

摘要翻译： 公开了一种印刷电路板及其制造方法。 根据本发明实施例的制造印刷电路板的方法包括：在其一个表面上提供具有第一图案的第一树脂层; 在所述第一树脂层的一个表面上形成与所述第一图案电连接的导电凸块; 压缩绝缘层和第一树脂层，使得导电凸块穿过绝缘层; 在绝缘层上层叠在其面对绝缘层的表面上具有第二图案的第二树脂层; 以及通过蚀刻所述第一树脂层和所述第二树脂层中的至少一个的一部分来形成开口。

公开(公告)号：US08415200B2

公开(公告)日：2013-04-09

申请号：US13007444

申请日：2011-01-14

申请人： Mi Sun Hwang ,  Keung Jin Sohn ,  Eung Suek Lee ,  Myung Sam Kang

发明人： Mi Sun Hwang ,  Keung Jin Sohn ,  Eung Suek Lee ,  Myung Sam Kang

IPC分类号： H01L23/48

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81192 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4647 ,  H05K2203/0384 ,  H01L2924/00015 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a method for manufacturing a semiconductor package which uses a base member 120 in which a first metal layer 113, a barrier layer 115, and a second metal layer 117 are stacked on both surface thereof in sequence based on an adhesive member 111 to simultaneously manufacture two printed circuit boards through a single sheet process, thereby making it possible to improve manufacturing efficiency; electrically connects a semiconductor chip 300 to a printed circuit board through a solder bump 250, thereby making it possible to implement a high-density package substrate; and forms a metal post 140 instead of a through hole to required in an interlayer circuit connection, thereby making it possible to reduce costs required in the processing/plating of the through hole.

摘要翻译： 本发明公开了一种半导体封装件的制造方法，该半导体封装件使用基片120，其中第一金属层113，阻挡层115和第二金属层117依次以两个表面层叠在第一金属层113，阻挡层115和第二金属层117上， 同时通过单片工艺制造两个印刷电路板，从而可以提高制造效率; 通过焊料凸块250将半导体芯片300电连接到印刷电路板，从而可以实现高密度封装基板; 并且形成金属柱140而不是层间电路连接所需的通孔，从而可以降低通孔的加工/电镀所需的成本。

公开(公告)号：US08397378B2

公开(公告)日：2013-03-19

申请号：US12232894

申请日：2008-09-25

申请人： Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

发明人： Keung-Jin Sohn ,  Joon-Sik Shin ,  Joung-Gul Ryu ,  Jung-Hwan Park ,  Ho-Sik Park ,  Sang-Youp Lee

IPC分类号： H05K1/03 ,  H05K3/00 ,  H05K3/02

CPC分类号： H05K1/0366 ,  C08J5/046 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0293 ,  Y10T29/49126 ,  Y10T29/49156

摘要： A method of manufacturing an insulating sheet, a method of manufacturing a copper clad laminate, and a method of manufacturing a printed circuit board, as well as a printed circuit board manufactured using these methods are disclosed. The method of manufacturing an insulating sheet can include: forming a thermoplastic reinforcement material, which includes fibers secured by a thermoplastic polymer binder, and in which pores are formed; forming a thermoplastic resin layer such that the thermoplastic reinforcement material is impregnated with a thermoplastic resin; and hot pressing the thermoplastic reinforcement material and the thermoplastic resin layer. This method can be utilized to manufacture an insulating sheet, which has a low rate of moisture absorption and superb electrical properties, including a low dielectric constant (Dk) and low dielectric loss (Df), and in which the fibers can readily be impregnated with the resin.

公开(公告)号：US08156635B2

公开(公告)日：2012-04-17

申请号：US12720567

申请日：2010-03-09

申请人： Seong Min Cho ,  Keung Jin Sohn ,  Tae Kyun Bae ,  Hyun Jung Hong ,  Kyung Ah Lee ,  Chang Gun Oh

发明人： Seong Min Cho ,  Keung Jin Sohn ,  Tae Kyun Bae ,  Hyun Jung Hong ,  Kyung Ah Lee ,  Chang Gun Oh

IPC分类号： B23P19/00

CPC分类号： H05K3/0097 ,  B32B15/20 ,  H05K3/4682 ,  H05K2201/0355 ,  H05K2203/0156 ,  H05K2203/047 ,  H05K2203/1105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/5313 ,  Y10T428/12493 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities.

摘要翻译： 本文公开了一种用于制造衬底的载体，包括：绝缘层，其包括在其一侧或两侧形成的第一金属层; 形成在所述第一金属层的一侧上的第二金属层; 以及形成在所述第二金属层的一侧上的第三金属层，其中所述第二金属层具有比所述第一金属层或所述第三金属层低的熔点。 载体的优点在于可以通过加热将载置层与载体分离，从而不需要布线过程，结果是当构建层与载体分离时，基底的尺寸不变化 从而重新使用载体并保持基板和制造设备之间的兼容性。

公开(公告)号：US20110315745A1

公开(公告)日：2011-12-29

申请号：US13224265

申请日：2011-09-01

申请人： Seong Min CHO ,  Keung Jin SOHN ,  Chang Gun OH ,  Hyun Jung HONG ,  Tae Kyun BAE

发明人： Seong Min CHO ,  Keung Jin SOHN ,  Chang Gun OH ,  Hyun Jung HONG ,  Tae Kyun BAE

IPC分类号： B23K31/00

CPC分类号： H05K3/4644 ,  H05K3/0097 ,  H05K2203/1536 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/12986

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities.