Thermal regulatory modules useful for cooling energy packs

    公开(公告)号:US12009494B2

    公开(公告)日:2024-06-11

    申请号:US17152384

    申请日:2021-01-19

    CPC classification number: H01M10/653 H01M10/613 H01M10/655

    Abstract: Systems and methods in which a thermal conductive composite comprises a non-uniform heat absorption profile of a thermal reactive material are described. Thermal conductive composites herein may be utilized in thermal regulatory modules with a gradient structure configured to transfer heat energy away from an area near a heat source to an area with a relatively large latent heat absorbing capacity. Thermal conductive material may be provided in a frame structure having lower porosity in a first region more near a heat source and higher porosity in a second region more distant from the heat source. A thermal reactive material may be deposited so as to be disposed within the pores of the thermal conductive material frame structure wherein the density of the thermal reactive material in the first region of the thermal conductive composite is lower than that at the second region of the thermal conductive composite.

    THERMAL REGULATORY MODULES USEFUL FOR COOLING ENERGY PACKS

    公开(公告)号:US20220231352A1

    公开(公告)日:2022-07-21

    申请号:US17152384

    申请日:2021-01-19

    Abstract: Systems and methods in which a thermal conductive composite comprises a non-uniform heat absorption profile of a thermal reactive material are described. Thermal conductive composites herein may be utilized in thermal regulatory modules with a gradient structure configured to transfer heat energy away from an area near a heat source to an area with a relatively large latent heat absorbing capacity. Thermal conductive material may be provided in a frame structure having lower porosity in a first region more near a heat source and higher porosity in a second region more distant from the heat source. A thermal reactive material may be deposited so as to be disposed within the pores of the thermal conductive material frame structure wherein the density of the thermal reactive material in the first region of the thermal conductive composite is lower than that at the second region of the thermal conductive composite.

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