公开(公告)号：US11304312B2

公开(公告)日：2022-04-12

申请号：US16887473

申请日：2020-05-29

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Hao-Yi Wei ,  Yan-Lu Li

IPC分类号： H05K3/46 ,  H05K1/02 ,  H05K3/28

摘要： A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.

公开(公告)号：US11700698B2

公开(公告)日：2023-07-11

申请号：US17686743

申请日：2022-03-04

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Hao-Yi Wei ,  Yan-Lu Li

IPC分类号： H05K3/46 ,  H05K1/02 ,  H05K3/28

CPC分类号： H05K3/4644 ,  H05K1/0218 ,  H05K3/28 ,  H05K2201/0715

摘要： A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.

公开(公告)号：US12120812B2

公开(公告)日：2024-10-15

申请号：US17564941

申请日：2021-12-29

申请人： HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Ltd. ,  Garuda Technology Co., Ltd.

发明人： Hao-Yi Wei ,  Childe Zhu ,  Yan-Lu Li

IPC分类号： H01P3/00 ,  H01P3/02 ,  H05K1/02 ,  H05K3/10

CPC分类号： H05K1/0242 ,  H01P3/003 ,  H01P3/026 ,  H05K1/0215 ,  H05K3/10

摘要： A circuit board includes a dielectric substrate, a signal line and a pair of ground wires. The dielectric substrate includes a base and an elevated platform protruding from an upper surface of the base. The signal line is conformally disposed on the dielectric substrate and includes a first segment disposed on an upper surface of the elevated platform, a second segment extending on the upper surface of the base, and a third segment disposed on a sidewall of the elevated platform and connecting the first segment and the second segment. The pair of ground wires are disposed on the dielectric substrate and are spaced apart from the signal line. A projection of the second segment of the signal line on the upper surface of the base partly overlaps projections of the pair of ground wires on the upper surface of the base.