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公开(公告)号：US11304312B2
公开(公告)日：2022-04-12
申请号：US16887473
申请日：2020-05-29
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Hao-Yi Wei , Yan-Lu Li
摘要： A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.
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公开(公告)号：US10660218B2
公开(公告)日：2020-05-19
申请号：US15957875
申请日：2018-04-19
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Xian-Qin Hu , Li-Kun Liu , Yan-Lu Li , Ming-Jaan Ho
IPC分类号： H05K3/46 , H05K3/00 , H05K3/42 , H01L23/498 , H05K1/18 , H01L21/48 , H05K1/11 , H05K3/28 , H05K3/06
摘要： A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.
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公开(公告)号：US10349533B1
公开(公告)日：2019-07-09
申请号：US16236358
申请日：2018-12-29
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Li-Kun Liu , Yan-Lu Li
摘要： A multilayer circuit board comprises an inner circuit board, a tin layer, at least one outer circuit board, and a solder mask. The inner circuit board comprises at least one first mounting region and at least one second mounting region. The tin layer is formed on a surface of the inner circuit board except the first mounting region connecting the outer circuit board. The outer circuit board comprises at least one first opening to expose the first mounting region and at least one second opening to expose a portion of the tin layer covering the second mounting region. The inner circuit board, the tin layer, and the outer circuit board together form a middle structure. The solder mask covers the middle structure except the portion and the first mounting region. A treatment layer is formed on the first mounting region.
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公开(公告)号：US09980386B1
公开(公告)日：2018-05-22
申请号：US15795198
申请日：2017-10-26
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Yan-Lu Li , Jun-Hua Wang
CPC分类号： H05K1/183 , H05K1/0393 , H05K1/111 , H05K1/115 , H05K1/189 , H05K3/4069 , H05K3/423 , H05K3/462 , H05K3/4697 , H05K2201/09509
摘要： A method for manufacturing a flexible printed circuit board includes providing a first double-sided circuit substrate which comprises an electronic component. A multilayer circuit substrate having a mounting groove is also provided. The multilayer circuit substrate covers the first double-sided circuit substrate through an adhesive layer, causing the electronic component to be received in the mounting groove, thereby forming an intermediate product. At least one through hole is defined in the intermediate product, which when filled with conductive material electrically connects the multilayer circuit substrate to the first double-sided circuit substrate to form the flexible printed circuit board.
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公开(公告)号：US11582859B2
公开(公告)日：2023-02-14
申请号：US17467373
申请日：2021-09-06
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Bao-Jun Li , Yang Li , Yan-Lu Li , Li-Kun Liu
摘要： A method for manufacturing a flexible circuit board capable of transmitting high frequency signals with reduced attenuation includes providing an inner wiring board including a first conductive wiring layer and a first substrate layer, the first conductive wiring layer including a signal line and two ground lines on both sides of the signal line, the first substrate layer covering a side of the first conductive wiring layer and defining first through holes which expose the signal line; providing two copper clad laminates including a second substrate layer and a copper foil, the second substrate layer having second through hole aligned with the first through holes; laminating the two copper clad laminates onto two sides of the inner wiring board via two adhesive layers, each adhesive layer defining third through holes aligned with the first and second through holes; and forming a second conductive wiring layer from the copper foil.
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公开(公告)号：US11140769B1
公开(公告)日：2021-10-05
申请号：US16916067
申请日：2020-06-29
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Bao-Jun Li , Yang Li , Yan-Lu Li , Li-Kun Liu
IPC分类号： H05K1/02
摘要： A flexible circuit board capable of transmitting high frequency signals with reduced attenuation includes two outer wiring boards enclosing an inner wiring board. The inner wiring board includes a first conductive wiring layer and a first substrate layer. The first conductive wiring layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductive wiring layer and defines first through holes which expose the signal line. Each of the two outer wiring boards includes a second substrate layer and a second conductive wiring layer. The second substrate layer abuts the inner wiring board and defines second through holes aligning with the first through holes, to partially surround the signal line with air of very low dielectric constant. A method for manufacturing the flexible circuit board is also disclosed.
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公开(公告)号：US10653015B2
公开(公告)日：2020-05-12
申请号：US16255236
申请日：2019-01-23
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Xian-Qin Hu , Li-Kun Liu , Yan-Lu Li , Ming-Jaan Ho
IPC分类号： H05K3/46 , H05K1/11 , H05K1/18 , H01L23/498 , H01L21/48 , H05K3/00 , H05K3/42 , H05K3/28 , H05K3/06
摘要： A multilayer circuit board comprises an inner circuit unit having at least one solder portion, and at least one outer circuit board coupled with the inner circuit unit. The inner circuit unit connects with the outer circuit board by an insulation colloid. At least one side of the inner circuit unit does not extend to edges of the multilayer circuit board. The at least one outer circuit board forms at least one through-hole and at least one conductive hole. The at least one conductive hole which is internally-plated with copper extends from the at least one outer circuit board to the inner circuit unit. A method of manufacturing the multilayer circuit board is also disclosed.
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公开(公告)号：US09832888B1
公开(公告)日：2017-11-28
申请号：US15191554
申请日：2016-06-24
申请人： Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , GARUDA TECHNOLOGY CO., LTD.
发明人： Yan-Lu Li , Mei Yang , Cheng-Jia Li
CPC分类号： H05K3/4644 , H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/0011 , H05K3/0073 , H05K3/02 , H05K3/4038 , H05K2201/095
摘要： A method of manufacture of a circuit board without annular through-hole rings and thus allowing a higher component density includes a base layer, a first wire pattern layer, and a second wire pattern layer on both sides of the base layer. A portion of the base layer not covered by the first wire pattern layer defines at least one first hole. The circuit board further includes a wire layer. The wire layer includes at least a first portion and a second portion connecting to the first portion. The first portion is filled in the first hole. The second portion is formed on the first portion extending away from the base layer. A diameter of the second portion is less than an aperture diameter of the first hole. The wire layer is electrically conductive between the first wire pattern layer and the second wire pattern layer through the first portion.
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公开(公告)号：US12028976B2
公开(公告)日：2024-07-02
申请号：US17764402
申请日：2020-04-23
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Jian-Yi Hao , Yan-Lu Li
CPC分类号： H05K1/14 , H01R12/58 , H05K3/36 , H05K3/42 , H05K2201/0335
摘要： The present disclosure provides a method for manufacturing a board-to-board connection structure. The method includes defining a first through hole in a first circuit board, disposing a first connector within the first through hole by a first conductive paste, and connecting the first connector to a second circuit board on which a second connector is installed, thereby realizing a connection of the two circuit boards, and reducing a height of the two circuit boards after the connection. That is, the height of the board-to-board connection structure is reduced. Additionally, since the first connector is received within the first through hole, the first connector is not easy to be damaged and oxidized. The present disclosure further provides a board-to-board connection structure manufactured by the above method.
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公开(公告)号：US11985764B2
公开(公告)日：2024-05-14
申请号：US17727935
申请日：2022-04-25
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： Yang Li , Yan-Lu Li , Li-Kun Liu
CPC分类号： H05K1/147 , H05K3/388 , H05K9/0088
摘要： A circuit board, with inbuilt protection against incoming and outgoing electromagnetic interference (EMI), includes an insulating adhesive portion, a first signal line, and a second signal line. The first signal line and the second signal line are surrounded and separated by an electromagnetic shielding film against EMI. The insulating adhesive portion fills a gap between the first signal line and the electromagnetic shielding film and a gap between the second signal line and the electromagnetic shielding film. External interference with signals in the circuit board is reduced, mutual interference between the first signal line and the second signal line is reduced, and electromagnetic radiation of the circuit board is also reduced. A method for manufacturing the circuit board is also disclosed.
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