公开(公告)号：US08138825B2

公开(公告)日：2012-03-20

申请号：US12785399

申请日：2010-05-21

申请人： Hsin-Chia Lu ,  Guan-Ming Wu ,  Chun Pan

发明人： Hsin-Chia Lu ,  Guan-Ming Wu ,  Chun Pan

IPC分类号： H03C1/00 ,  H03D1/00 ,  H03K7/02 ,  H03K9/02 ,  H04L25/00

CPC分类号： H03H7/09 ,  H03C1/36 ,  H03H7/01 ,  H03H2001/0085

摘要： A multi-chip stack structure and a signal transmission method are disclosed in specification and drawing, where the multi-chip stack structure includes first and second chips. The first chip includes a first inductance coil with a first series capacitor, and the second chip includes a second inductance coil with a second series capacitor. The first and second inductance coils are magnetically coupled to each other. The magnetically coupled inductance coils and the capacitors constitute a coupling filter.

摘要翻译： 多芯片堆叠结构和信号传输方法在说明书和附图中公开，其中多芯片堆叠结构包括第一和第二芯片。 第一芯片包括具有第一串联电容器的第一电感线圈，并且第二芯片包括具有第二串联电容器的第二电感线圈。 第一和第二电感线圈彼此磁耦合。 磁耦合电感线圈和电容器构成耦合滤波器。

公开(公告)号：US20080023528A1

公开(公告)日：2008-01-31

申请号：US11858837

申请日：2007-09-20

申请人： Chun Pan

发明人： Chun Pan

IPC分类号： A47J36/02

CPC分类号： H01L24/73 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14051 ,  H01L2224/14104 ,  H01L2224/16237 ,  H01L2224/17104 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A fabrication method and structure for a PBCA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints, and an electronic device. The circuit board has a solder mask, having a plurality of openings exposing at least one first pad and a plurality of second pads arranged beyond the first pad, on a surface. The first solder joint has a maximum width J1 and electrically connects to the first pad. The second solder joints respectively have a maximum width J2 exceeding J1 and respectively electrically connect to the second pads. The electronic device has a plurality of third pads, arranged substantially corresponding to the openings, respectively electrically connecting to the first pad and second pads.

摘要翻译： 一种PBCA的制造方法和结构，以及该结构的装配工具。 该结构包括电路板，至少一个第一焊接接头，多个第二焊点和电子器件。 电路板具有焊接掩模，其具有在表面上暴露至少一个第一焊盘和布置成超过第一焊盘的多个第二焊盘的多个开口。 第一焊点具有最大宽度J 1和电连接到第一焊盘。 第二焊点分别具有超过J 1的最大宽度J 2，并且分别电连接到第二焊盘。 电子设备具有多个第三焊盘，其大致对应于开口分别电连接到第一焊盘和第二焊盘。