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    Connection device for use with memory card connector apparatus
    1.
    发明授权
    Connection device for use with memory card connector apparatus 失效
    用于存储卡连接装置的连接装置

    公开(公告)号：US5709568A

    公开(公告)日：1998-01-20

    申请号：US503706

    申请日：1995-07-18

    申请人： Hua-Tsong Pan ,  May Chen

    发明人： Hua-Tsong Pan ,  May Chen

    IPC分类号： G06K7/00 ,  H01R23/68

    CPC分类号： G06K7/0047 ,  H01R12/716

    摘要： A memory card connector assembly (32) includes a connection device (40) for use with a memory card connector apparatus (34) for electrically connecting the memory card connector apparatus (34) to a mother board (33) on which such memory card connector apparatus (34) is mounted. The connection device (40) includes a daughter board (42) and a card edge connector (44) wherein the daughter board (42) is vertically positioned on the back side of the memory card connector apparatus (34) for receiving multiple rows of plural spaced contact tails (46) of the memory card connectors (36, 38). The bottom edge region (50) of the daughter board (42) having conductive pads (52) thereon, is adapted to be electrically received within the slot (56) of the card edge connector (44) which is directly electrically mounted onto the mother board (33).

    摘要翻译： 存储卡连接器组件（32）包括用于与存储卡连接器装置（34）一起使用的连接装置（40），用于将存储卡连接器装置（34）电连接到母板（33），母板连接器 装置（34）被安装。 连接装置（40）包括子板（42）和卡缘连接器（44），其中子板（42）垂直定位在存储卡连接器装置（34）的背面，用于接收多行多个 间隔的存储卡连接器（36,38）的接触尾部（46）。 在其上具有导电焊盘（52）的子板（42）的底边缘区域（50）适于被电接收在卡边缘连接器（44）的槽（56）内，其直接电气安装在母体 董事会（33）。

    Image sensor package structure
    3.
    发明申请
    Image sensor package structure 审中-公开
    图像传感器封装结构

    公开(公告)号：US20070090284A1

    公开(公告)日：2007-04-26

    申请号：US11256366

    申请日：2005-10-20

    申请人： Mon Ho ,  Chen Peng ,  May Chen ,  Eric Lin

    发明人： Mon Ho ,  Chen Peng ,  May Chen ,  Eric Lin

    IPC分类号： H01J5/02

    CPC分类号： H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An image sensor package structure includes a substrate having an upper surface, which is formed with equal amount of the first electrodes arranged at the each side of the upper surface, each the first electrode of the adjacent side of the substrate is corresponding electrically connected each other, so that the signal from one side of the substrate may be transmitted the adjacent side, the each side of the lower surface of the substrate is formed with second electrodes, each side of the second electrodes is less than the each side of the first electrodes of the upper surface, then the second electrode is electrically connected to the first electrode, so that the signal from the first electrode may be directly transmitted to the second electrode and through adjacent one side of the first electrode transmitted to the second electrode. A frame layer is arranged at the upper surface of the substrate. A chip is mounted at the upper surface of the substrate a, at least one side of the chip is formed with bonding pads, which are equal or not many than the first electrodes of the one side of the substrate. Wires are electrically connected the pads of the chip to the first electrodes of the substrate. A transparent layer is covered on the frame layer to encapsulate the chip.

    摘要翻译： 图像传感器封装结构包括具有上表面的基板，其形成有布置在上表面的每一侧的等量的第一电极，基板的相邻侧的每个第一电极彼此相互电连接 ，使得来自基板的一侧的信号可以相邻地传输，基板的下表面的每一侧形成有第二电极，第二电极的每侧都小于第一电极的每一侧 然后第二电极电连接到第一电极，使得来自第一电极的信号可以直接传输到第二电极并且通过传输到第二电极的第一电极的相邻一侧。 框架层布置在基板的上表面。 芯片安装在基板a的上表面，芯片的至少一侧形成有与基板一侧的第一电极相等或不多的接合焊盘。 电线将芯片的焊盘电连接到衬底的第一电极。 透明层被覆盖在帧层上以封装芯片。