公开(公告)号：US20060275943A1

公开(公告)日：2006-12-07

申请号：US11131727

申请日：2005-05-18

申请人： Chung Hsin ,  Yves Huang ,  Kevin Chang ,  Chief Lin

发明人： Chung Hsin ,  Yves Huang ,  Kevin Chang ,  Chief Lin

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A substrate structure for an image sensor package, the substrate structure includes a bottom base and a frame layer. The bottom base has an upper surface formed with a plurality of first electrodes, and a lower surface formed with a plurality of second electrodes, an insulation layer is coated between each of the first electrode, so as to the upper surface of the bottom base is smooth. A frame layer is arranged on the upper surface of the bottom base to form a cavity together with the bottom base.

摘要翻译： 一种用于图像传感器封装的衬底结构，该衬底结构包括底部底座和框架层。 底部底部具有形成有多个第一电极的上表面和形成有多个第二电极的下表面，绝缘层涂覆在每个第一电极之间，底部底部的上表面是 光滑。 框架层布置在底部底部的上表面上以与底部底部一起形成空腔。

公开(公告)号：US06642554B2

公开(公告)日：2003-11-04

申请号：US09996675

申请日：2001-11-21

申请人： Nai Hua Yeh ,  Chen Pin Peng ,  Chief Lin ,  C. S. Cheng ,  Kuang Yu Fan ,  Ren Long Kau ,  Fu Yung Huang ,  Yves Huang ,  Wu Hsiang Lee ,  Chih Hsien Chung ,  May Chen

发明人： Nai Hua Yeh ,  Chen Pin Peng ,  Chief Lin ,  C. S. Cheng ,  Kuang Yu Fan ,  Ren Long Kau ,  Fu Yung Huang ,  Yves Huang ,  Wu Hsiang Lee ,  Chih Hsien Chung ,  May Chen

IPC分类号： H01L31072

CPC分类号： G11C5/04 ,  H05K1/181 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10689 ,  Y02P70/611

摘要： A memory module structure of the invention is used for being assembled on a locking device. The memory module includes a substrate and a plurality of memories. The substrate has certain long sides and short sides. Notches are formed on the short sides for being secured by the locking device. Each of the plurality of memories has a suitable length and width. Some memories of the plurality of memories are transversely mounted on the substrate with respect to the substrate. The other memories of the plurality of memories are longitudinally mounted on the substrate with respect to the substrate. According to this structure, it is possible to suitably arrange a plurality of memories on the substrate so as to increase the memory capacity of the memory module.

摘要翻译： 本发明的存储器模块结构用于组装在锁定装置上。 存储器模块包括衬底和多个存储器。 基板有一定的长边和短边。 在短边上形成凹口以由锁定装置固定。 多个存储器中的每一个具有合适的长度和宽度。 多个存储器的一些存储器相对于衬底横向地安装在衬底上。 多个存储器的其它存储器相对于衬底纵向地安装在衬底上。 根据该结构，可以在基板上适当地配置多个存储器，以增加存储器模块的存储容量。

公开(公告)号：US08314481B2

公开(公告)日：2012-11-20

申请号：US11131727

申请日：2005-05-18

申请人： Chung Hsien Hsin ,  Yves Huang ,  Kevin Chang ,  Chief Lin

发明人： Chung Hsien Hsin ,  Yves Huang ,  Kevin Chang ,  Chief Lin

IPC分类号： H01L23/06

CPC分类号： H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： A substrate structure for an image sensor package includes a bottom base and a frame layer. The bottom base has an upper surface formed with a plurality of first electrodes, and a lower surface formed with a plurality of second electrodes. An insulation layer is coated between the first electrodes and in direct surface contact with the upper surface of the bottom base. A frame layer is arranged on and in direct surface contact with the first electrodes and the insulation layer to form a cavity together with the bottom base. The insulation layer is interposed between the bottom base and the frame layer.

摘要翻译： 用于图像传感器封装的衬底结构包括底部底座和框架层。 底部底部具有形成有多个第一电极的上表面和形成有多个第二电极的下表面。 绝缘层涂覆在第一电极之间并且直接与底部底部的上表面接触。 框架层布置成与第一电极和绝缘层直接表面接触以与底部底部一起形成空腔。 绝缘层位于底部底座和框架层之间。

公开(公告)号：US06501187B1

公开(公告)日：2002-12-31

申请号：US09996691

申请日：2001-11-21

申请人： Nai Hua Yeh ,  Chen Pin Peng ,  Chief Lin ,  Ching-Shui Cheng ,  Allis Chen

发明人： Nai Hua Yeh ,  Chen Pin Peng ,  Chief Lin ,  Ching-Shui Cheng ,  Allis Chen

IPC分类号： H01L2328

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2224/85 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package structure having central leads according to the invention includes a substrate, a semiconductor device, a plurality of wires, and glue. A long slot penetrating through the substrate is formed in the substrate. A plurality of bonding pads formed on the semiconductor device are mounted on substrate. The plurality of bonding pads on the semiconductor device are exposed via the long slot of the substrate. The length of the semiconductor device is smaller than that of the long slot of the substrate so that a channel is formed at one side of the long slot when the semiconductor device is mounted on the substrate. The plurality of wires are arranged within the long slot of the substrate for electrically connecting the plurality of bonding pads on the semiconductor device to the plurality of signal output terminals on the substrate. The glue is provided for sealing the upper surface of the substrate to protect the semiconductor device. The glue is poured into the long slot of the substrate via the channel formed by the long slot of the substrate, for covering the plurality of wires.

摘要翻译： 根据本发明的具有中心引线的半导体封装结构包括衬底，半导体器件，多根电线和胶水。 在衬底中形成穿过衬底的长槽。 形成在半导体器件上的多个接合焊盘安装在基板上。 半导体器件上的多个接合焊盘经由衬底的长槽露出。 半导体器件的长度小于衬底的长槽的长度，使得当半导体器件安装在衬底上时，在长槽的一侧形成沟道。 多个布线布置在基板的长槽内，用于将半导体器件上的多个接合焊盘电连接到基板上的多个信号输出端子。 提供胶水以密封衬底的上表面以保护半导体器件。 通过由衬底的长槽形成的通道将胶水注入衬底的长槽中，以覆盖多根电线。

公开(公告)号：US20060263460A1

公开(公告)日：2006-11-23

申请号：US11131728

申请日：2005-05-18

申请人： Chief Lin

发明人： Chief Lin

IPC分类号： A23G1/22

CPC分类号： H01L21/4803 ,  H01L24/48 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/17151 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A jig structure for manufacturing an image sensor, the image sensor includes a substrate and a frame layer, wherein the jig is located on the substrate, then fill the filler in the jig to form the frame layer, the jig comprising a plurality of connection channel to produce a plurality of square shape, dummy channel, and at least a inlet connected the channel and the dummy channel, so that fill the filler into the channel to form the frame layer of the image sensor.

摘要翻译： 一种用于制造图像传感器的夹具结构，所述图像传感器包括基板和框架层，其中所述夹具位于所述基板上，然后将所述填充物填充在所述夹具中以形成所述框架层，所述夹具包括多个连接通道 以产生多个正方形的虚拟通道，并且至少一个入口连接通道和虚拟通道，从而将填充物填充到通道中以形成图像传感器的框架层。