公开(公告)号：US10347596B2

公开(公告)日：2019-07-09

申请号：US15467484

申请日：2017-03-23

申请人： Huawei Technologies Co., Ltd.

发明人： An Huang ,  Yanhai Lin ,  Wei Liu

IPC分类号： H01L23/66 ,  H01L23/00 ,  H01L23/488 ,  H01L25/065

摘要： The application provides an apparatus, including a first section, a second section, and a first bonding wire group, where the first bonding wire group includes at least three first bonding wire units. The first bonding wire unit includes at least one arc-shaped bonding wire, one end and the other end of the first bonding wire unit are electrically connected to electrodes of the first section and the second section, respectively, where arc heights of first bonding wire units located at two sides of the first bonding wire group are higher than an arc height of a first bonding wire unit at another position, and an arc height of a first bonding wire unit located in a central area of the first bonding wire group is lower than an arc height of a first bonding wire unit at another position.

公开(公告)号：US20170194282A1

公开(公告)日：2017-07-06

申请号：US15467484

申请日：2017-03-23

申请人： Huawei Technologies Co., Ltd.

发明人： An Huang ,  Yanhai Lin ,  Wei Liu

IPC分类号： H01L23/00 ,  H01L25/065

CPC分类号： H01L24/49 ,  H01L23/488 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L2223/6611 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/49052 ,  H01L2224/4909 ,  H01L2224/4912 ,  H01L2224/49175 ,  H01L2225/06506 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2924/20657 ,  H01L2224/45099

摘要： The application provides an apparatus, including a first section, a second section, and a first bonding wire group, where the first bonding wire group includes at least three first bonding wire units. The first bonding wire unit includes at least one arc-shaped bonding wire, one end and the other end of the first bonding wire unit are electrically connected to electrodes of the first section and the second section, respectively, where arc heights of first bonding wire units located at two sides of the first bonding wire group are higher than an arc height of a first bonding wire unit at another position, and an arc height of a first bonding wire unit located in a central area of the first bonding wire group is lower than an arc height of a first bonding wire unit at another position.