摘要:
The present invention relates to a process for producing particle-free solutions of polymeric semiconductors and to their use for producing layers of polymeric semiconductors in polymeric organic light-emitting diodes (PLEDs), organic integrated circuits (O-ICs), organic field effect transistors (OFETs), organic thin film transistors (OTFTs), organic solar cells (O-SCs) or organic laser diodes (O-lasers).
摘要:
The present invention relates to solutions and/or dispersions of organic semiconductors in a solvent mixture of at least two different organic solvents, characterized in that A. Each of the solvents on its own has a boiling point of below 200° C. and a melting point of 15° C. or less, B. at least one of the solvents has a boiling point in the range from greater than 140 to less than 200° C., C. the solvents used have no benzylic CH2 or CH groups, D. the solvents used are not benzene derivatives containing tert-butyl substituents or more than two methyl substituents, and their use in printing processes for producing layers of organic semiconductors, especially for the electronics industry.
摘要:
The present invention relates to solutions and/or dispersions of organic semiconductors in a solvent mixture of at least two different organic solvents, characterized in that A. Each of the solvents on its own has a boiling point of below 200° C. and a melting point of 15° C. or less, B. at least one of the solvents has a boiling point in the range from greater than 140 to less than 200° C., C. the solvents used have no benzylic CH2 or CH groups, D. the solvents used are not benzene derivatives containing tert-butyl substituents or more than two methyl substituents, and their use in printing processes for producing layers of organic semiconductors, especially for the electronics industry.
摘要:
The present invention relates to solutions and/or dispersions of organic semiconductors in a solvent mixture of at least two different organic solvents, characterized in that A. Each of the solvents on its own has a boiling point of below 200° C. and a melting point of 15° C. or less, B. at least one of the solvents has a boiling point in the range from greater than 140 to less than 200° C., C. the solvents used have no benzylic CH2 or CH groups, D. the solvents used are not benzene derivatives containing tert-butyl substituents or more than two methyl substituents, and their use in printing processes for producing layers of organic semiconductors, especially for the electronics industry.
摘要:
The invention relates to solutions of at least one organic semiconductor containing at least one high-molecular constituent, in a solvent mixture of at least three different organic solvents A, B and C. The invention is characterized in that the solvents A and B are good solvents for the organic semiconductor, the solvent C is a bad solvent for the organic semiconductor, and Sdp.(A)
摘要:
The invention relates to solutions of at least one organic semiconductor containing at least one high-molecular constituent, in a solvent mixture of at least three different organic solvents A, B and C. The invention is characterised in that the solvents A and B are good solvents for the organic semiconductor, the solvent C is a bad solvent for the organic semiconductor, and Sdp.(A)
摘要:
In a slide valve, especially for coating installations, for fluidic separation of two modules or chambers, interconnected through an opening, containing at least one slide plate, integrated in a housing transfixed by said opening, and which may be bidirectionally moved between an inactive position, releasing said opening, and an operating position, completely covering said opening, and at least a closing drive, which may be activated to act upon said slide plate in its operating position and for its sealing contact in a closed position against a sealing surface transfixing said housing, according to the invention, at least one of said closing drives is firmly attached inside housing, relative to the activating movement of said slide plate.
摘要:
Hollow members having conduits for process gas and coolant are mounted in parallel on sidewall of a vacuum chamber with a sputtering cathode therebetween. Anode members having an L-shaped cross section are mounted over the hollow members and held in place by thumb screws in threaded bores of strips fixed to the chamber walls above the hollow members. Mask members having a Z-shaped cross section are mounted over the anodes and are also held in place by the thumb screws.
摘要:
The present invention relates to an exhaust gas treatment device for an exhaust system of an internal combustion engine, more preferably of a road vehicle with a housing, in which at least one exhaust gas treatment element is arranged and mounted by means of a bearing mat and with an outlet pipe which is fluidically connected to an outlet chamber formed in the housing. The risk of a contamination of the bearing mat with water can be reduced with a separating bottom which is arranged in the housing and separates the outlet chamber from a collecting chamber. The separating bottom includes several passage openings through which the outlet chamber is fluidically connected to the collecting chamber and which are each enclosed by a collar protruding into the outlet chamber.
摘要:
A backside coating prevention device adapted for a coating chamber for coating plate-shaped substrates, said coating chamber comprising a plurality of walls, a coating material source for dispensing coating material into the coating chamber, a substrate support, a front side of the substrate support facing the coating material source, the substrate support being adapted for supporting on the front side one or more plate-shaped substrates each having a substrate front side and thereby defining a substrate front plane, wherein said backside coating prevention device comprises two or more screens, the screens being provided at least two of the walls of the coating chamber, each screen having a protruding member protruding from the respective wall.