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公开(公告)号:US09716196B2
公开(公告)日:2017-07-25
申请号:US13023733
申请日:2011-02-09
申请人: Hui Nie , Brendan M. Kayes , Isik C. Kizilyalli
发明人: Hui Nie , Brendan M. Kayes , Isik C. Kizilyalli
IPC分类号: H01L31/0304 , H01L27/142 , H01L31/0735 , H01L31/0443
CPC分类号: H01L31/03046 , H01L27/142 , H01L31/0304 , H01L31/0443 , H01L31/0735 , Y02E10/544 , Y02P70/521
摘要: Embodiments of the invention generally relate to photovoltaic devices. In one embodiment, a method for forming a gallium arsenide based photovoltaic device includes providing a semiconductor structure, the structure including an absorber layer comprising gallium arsenide. A bypass function is provided in a p-n junction of the semiconductor structure, where under reverse-bias conditions the p-n junction breaks down in a controlled manner by a Zener breakdown effect.
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2.
公开(公告)号:US09178099B2
公开(公告)日:2015-11-03
申请号:US13451439
申请日:2012-04-19
申请人: Hui Nie , Brendan M. Kayes , Isik C. Kizilyalli
发明人: Hui Nie , Brendan M. Kayes , Isik C. Kizilyalli
IPC分类号: H01L31/0304 , H01L31/0735 , H01L31/0224 , H01L31/18
CPC分类号: H01L31/0735 , H01L31/022441 , H01L31/1896 , Y02E10/52 , Y02E10/544
摘要: Embodiments generally relate to optoelectronic semiconductor devices such as photovoltaic cells. In one aspect, a method for forming a device includes forming an absorber layer made of gallium arsenide (GaAs) and having one type of doping, and forming an emitter layer made of a different material and having a higher bandgap than the absorber layer. An intermediate layer can be formed between emitter and absorber layers. A heterojunction and p-n junction are formed between the emitter layer and the absorber layer, where the p-n junction is formed at least partially within the different material at a location offset from the heterojunction. A majority of the absorber layer can be outside of a depletion region formed by the p-n junction. The p-n junction causes a voltage to be generated in the cell in response to the cell being exposed to light at a front side.
摘要翻译: 实施例通常涉及诸如光伏电池的光电半导体器件。 一方面,用于形成器件的方法包括形成由砷化镓(GaAs)制成并具有一种类型的掺杂的吸收层,并形成由不同材料制成并具有比吸收层更高的带隙的发射极层。 可以在发射极和吸收层之间形成中间层。 在发射极层和吸收层之间形成异质结和p-n结,其中在与异质结偏离的位置处至少部分地在不同的材料内形成p-n结。 吸收层的大部分可以在由p-n结形成的耗尽区的外部。 p-n结导致电池响应于电池暴露于正面的光而产生电压。
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公开(公告)号:US09082919B2
公开(公告)日:2015-07-14
申请号:US13451439
申请日:2012-04-19
申请人: Hui Nie , Brendan M. Kayes , Isik C. Kizilyalli
发明人: Hui Nie , Brendan M. Kayes , Isik C. Kizilyalli
IPC分类号: H01L31/0304 , H01L31/0735 , H01L31/0224 , H01L31/18
摘要: Embodiments generally relate to optoelectronic semiconductor devices such as photovoltaic cells. In one aspect, a method for forming a device includes forming an absorber layer made of gallium arsenide (GaAs) and having one type of doping, and forming an emitter layer made of a different material and having a higher bandgap than the absorber layer. An intermediate layer can be formed between emitter and absorber layers. A heterojunction and p-n junction are formed between the emitter layer and the absorber layer, where the p-n junction is formed at least partially within the different material at a location offset from the heterojunction. A majority of the absorber layer can be outside of a depletion region formed by the p-n junction. The p-n junction causes a voltage to be generated in the cell in response to the cell being exposed to light at a front side.
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公开(公告)号:US09048366B2
公开(公告)日:2015-06-02
申请号:US13451439
申请日:2012-04-19
申请人: Hui Nie , Brendan M. Kayes , Isik C. Kizilyalli
发明人: Hui Nie , Brendan M. Kayes , Isik C. Kizilyalli
IPC分类号: H01L31/0304 , H01L31/0735 , H01L31/0224 , H01L31/18
摘要: Embodiments generally relate to optoelectronic semiconductor devices such as photovoltaic cells. In one aspect, a method for forming a device includes forming an absorber layer made of gallium arsenide (GaAs) and having one type of doping, and forming an emitter layer made of a different material and having a higher bandgap than the absorber layer. An intermediate layer can be formed between emitter and absorber layers. A heterojunction and p-n junction are formed between the emitter layer and the absorber layer, where the p-n junction is formed at least partially within the different material at a location offset from the heterojunction. A majority of the absorber layer can be outside of a depletion region formed by the p-n junction. The p-n junction causes a voltage to be generated in the cell in response to the cell being exposed to light at a front side.
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公开(公告)号:US09093591B2
公开(公告)日:2015-07-28
申请号:US13451455
申请日:2012-04-19
申请人: Hui Nie , Brendan M. Kayes , Isik C. Kizilyalli
发明人: Hui Nie , Brendan M. Kayes , Isik C. Kizilyalli
IPC分类号: H01L21/04 , H01L31/0735 , H01L31/0224 , H01L31/18
摘要: Embodiments generally relate to optoelectronic semiconductor devices such as solar cells. In one aspect, a device includes an absorber layer made of gallium arsenide (GaAs) and having only one type of doping. An emitter layer is located closer than the absorber layer to a back side of the device and is made of a different material and having a higher bandgap than the absorber layer. A heterojunction is formed between the emitter layer and the absorber layer, and a p-n junction is formed between the emitter layer and the absorber layer and at least partially within the different material at a location offset from the heterojunction. An intermediate layer is located between the absorber layer and the emitter layer and provides the offset of the p-n junction from the heterojunction, and includes a graded layer and an ungraded back window layer.
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6.
公开(公告)号:US09136418B2
公开(公告)日:2015-09-15
申请号:US13451455
申请日:2012-04-19
申请人: Hui Nie , Brendan M. Kayes , Isik C. Kizilyalli
发明人: Hui Nie , Brendan M. Kayes , Isik C. Kizilyalli
IPC分类号: H01L21/04 , H01L31/0735 , H01L31/0224 , H01L31/18
CPC分类号: H01L31/0735 , H01L31/022441 , H01L31/1896 , Y02E10/52 , Y02E10/544
摘要: Embodiments generally relate to optoelectronic semiconductor devices such as solar cells. In one aspect, a device includes an absorber layer made of gallium arsenide (GaAs) and having only one type of doping. An emitter layer is located closer than the absorber layer to a back side of the device and is made of a different material and having a higher bandgap than the absorber layer. A heterojunction is formed between the emitter layer and the absorber layer, and a p-n junction is formed between the emitter layer and the absorber layer and at least partially within the different material at a location offset from the heterojunction. An intermediate layer is located between the absorber layer and the emitter layer and provides the offset of the p-n junction from the heterojunction, and includes a graded layer and an ungraded back window layer.
摘要翻译: 实施例通常涉及诸如太阳能电池的光电半导体器件。 在一个方面,器件包括由砷化镓(GaAs)制成并且仅具有一种掺杂类型的吸收层。 发射极层位于比器件的背面靠近吸收体层,并且由不同的材料制成并具有比吸收层更高的带隙。 在发射极层和吸收层之间形成异质结,并且在偏离异质结的位置处,在发射极层和吸收层之间形成p-n结,并且至少部分地在不同的材料内形成p-n结。 中间层位于吸收层和发射极层之间,并且提供p-n结与异质结的偏移,并且包括渐变层和未分级的后窗层。
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公开(公告)号:US09136417B2
公开(公告)日:2015-09-15
申请号:US13451439
申请日:2012-04-19
申请人: Hui Nie , Brendan M. Kayes , Isik C. Kizilyalli
发明人: Hui Nie , Brendan M. Kayes , Isik C. Kizilyalli
IPC分类号: H01L31/0304 , H01L31/0735 , H01L31/0224 , H01L31/18
摘要: Embodiments generally relate to optoelectronic semiconductor devices such as photovoltaic cells. In one aspect, a method for forming a device includes forming an absorber layer made of gallium arsenide (GaAs) and having one type of doping, and forming an emitter layer made of a different material and having a higher bandgap than the absorber layer. An intermediate layer can be formed between emitter and absorber layers. A heterojunction and p-n junction are formed between the emitter layer and the absorber layer, where the p-n junction is formed at least partially within the different material at a location offset from the heterojunction. A majority of the absorber layer can be outside of a depletion region formed by the p-n junction. The p-n junction causes a voltage to be generated in the cell in response to the cell being exposed to light at a front side.
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8.
公开(公告)号:US09184305B2
公开(公告)日:2015-11-10
申请号:US13198655
申请日:2011-08-04
申请人: Isik C. Kizilyalli , Hui Nie , Andrew P. Edwards , Linda Romano , David P. Bour , Richard J. Brown , Thomas R. Prunty
发明人: Isik C. Kizilyalli , Hui Nie , Andrew P. Edwards , Linda Romano , David P. Bour , Richard J. Brown , Thomas R. Prunty
IPC分类号: H01L21/337 , H01L29/808 , H01L29/10 , H01L29/66 , H01L29/20
CPC分类号: H01L29/8083 , H01L29/1066 , H01L29/1095 , H01L29/2003 , H01L29/66446 , H01L29/66909 , H01L29/66924
摘要: A vertical III-nitride field effect transistor includes a drain comprising a first III-nitride material, a drain contact electrically coupled to the drain, and a drift region comprising a second III-nitride material coupled to the drain and disposed adjacent to the drain along a vertical direction. The field effect transistor also includes a channel region comprising a third III-nitride material coupled to the drift region, a gate region at least partially surrounding the channel region, and a gate contact electrically coupled to the gate region. The field effect transistor further includes a source coupled to the channel region and a source contact electrically coupled to the source. The channel region is disposed between the drain and the source along the vertical direction such that current flow during operation of the vertical III-nitride field effect transistor is along the vertical direction.
摘要翻译: 垂直III族氮化物场效应晶体管包括:包含第一III族氮化物材料的漏极,与漏极电耦合的漏极接触点;以及漂移区域,包括耦合到漏极并邻近漏极设置的第二III族氮化物材料 垂直方向 场效应晶体管还包括沟道区,该沟道区包括耦合到漂移区的第三III族氮化物材料,至少部分围绕沟道区的栅极区和电耦合到栅极区的栅极接触。 场效应晶体管还包括耦合到沟道区的源极和电耦合到源极的源极接触。 沟道区域沿着垂直方向设置在漏极和源极之间,使得垂直III族氮化物场效应晶体管的工作期间的电流沿着垂直方向。
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公开(公告)号:US08933532B2
公开(公告)日:2015-01-13
申请号:US13270641
申请日:2011-10-11
申请人: Andrew Edwards , Hui Nie , Isik C. Kizilyalli , Richard J. Brown , David P. Bour , Linda Romano , Thomas R. Prunty
发明人: Andrew Edwards , Hui Nie , Isik C. Kizilyalli , Richard J. Brown , David P. Bour , Linda Romano , Thomas R. Prunty
IPC分类号: H01L29/872 , H01L29/808 , H01L29/66 , H01L29/20 , H01L29/868 , H01L29/40 , H01L29/06
CPC分类号: H01L29/66143 , H01L21/26546 , H01L29/0615 , H01L29/0619 , H01L29/0692 , H01L29/08 , H01L29/2003 , H01L29/404 , H01L29/66083 , H01L29/66204 , H01L29/66212 , H01L29/66416 , H01L29/66924 , H01L29/8083 , H01L29/868 , H01L29/872
摘要: A semiconductor structure includes a III-nitride substrate characterized by a first conductivity type and having a first side and a second side opposing the first side, a III-nitride epitaxial layer of the first conductivity type coupled to the first side of the III-nitride substrate, and a plurality of III-nitride epitaxial structures of a second conductivity type coupled to the III-nitride epitaxial layer. The semiconductor structure further includes a III-nitride epitaxial formation of the first conductivity type coupled to the plurality of III-nitride epitaxial structures, and a metallic structure forming a Schottky contact with the III-nitride epitaxial formation and coupled to at least one of the plurality of III-nitride epitaxial structures.
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公开(公告)号:US08927999B2
公开(公告)日:2015-01-06
申请号:US13301165
申请日:2011-11-21
申请人: Isik C. Kizilyalli , Hui Nie , Andrew P. Edwards , Linda Romano , David Bour , Richard J. Brown , Thomas R. Prunty
发明人: Isik C. Kizilyalli , Hui Nie , Andrew P. Edwards , Linda Romano , David Bour , Richard J. Brown , Thomas R. Prunty
IPC分类号: H01L29/20 , H01L21/265 , H01L29/66 , H01L29/808 , H01L29/868 , H01L29/872 , H01L29/06
CPC分类号: H01L21/2654 , H01L29/0619 , H01L29/0642 , H01L29/2003 , H01L29/66143 , H01L29/6631 , H01L29/66446 , H01L29/66856 , H01L29/8083 , H01L29/868 , H01L29/872
摘要: An edge terminated semiconductor device is described including a GaN substrate; a doped GaN epitaxial layer grown on the GaN substrate including an ion-implanted insulation region, wherein the ion-implanted region has a resistivity that is at least 90% of maximum resistivity and a conductive layer, such as a Schottky metal layer, disposed over the GaN epitaxial layer, wherein the conductive layer overlaps a portion of the ion-implanted region. A Schottky diode is prepared using the Schottky contact structure.
摘要翻译: 描述了边缘端接的半导体器件,其包括GaN衬底; 在包括离子注入绝缘区域的GaN衬底上生长的掺杂GaN外延层,其中所述离子注入区域具有至少为最大电阻率的90%的电阻率和诸如肖特金属层的导电层设置在 所述GaN外延层,其中所述导电层与所述离子注入区域的一部分重叠。 使用肖特基接触结构制备肖特基二极管。
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