Methods for forming optoelectronic devices including heterojunction
    2.
    发明授权
    Methods for forming optoelectronic devices including heterojunction 有权
    用于形成包括异质结的光电器件的方法

    公开(公告)号:US09178099B2

    公开(公告)日:2015-11-03

    申请号:US13451439

    申请日:2012-04-19

    摘要: Embodiments generally relate to optoelectronic semiconductor devices such as photovoltaic cells. In one aspect, a method for forming a device includes forming an absorber layer made of gallium arsenide (GaAs) and having one type of doping, and forming an emitter layer made of a different material and having a higher bandgap than the absorber layer. An intermediate layer can be formed between emitter and absorber layers. A heterojunction and p-n junction are formed between the emitter layer and the absorber layer, where the p-n junction is formed at least partially within the different material at a location offset from the heterojunction. A majority of the absorber layer can be outside of a depletion region formed by the p-n junction. The p-n junction causes a voltage to be generated in the cell in response to the cell being exposed to light at a front side.

    摘要翻译: 实施例通常涉及诸如光伏电池的光电半导体器件。 一方面,用于形成器件的方法包括形成由砷化镓(GaAs)制成并具有一种类型的掺杂的吸收层,并形成由不同材料制成并具有比吸收层更高的带隙的发射极层。 可以在发射极和吸收层之间形成中间层。 在发射极层和吸收层之间形成异质结和p-n结,其中在与异质结偏离的位置处至少部分地在不同的材料内形成p-n结。 吸收层的大部分可以在由p-n结形成的耗尽区的外部。 p-n结导致电池响应于电池暴露于正面的光而产生电压。

    Methods for forming optoelectronic devices including heterojunction

    公开(公告)号:US09082919B2

    公开(公告)日:2015-07-14

    申请号:US13451439

    申请日:2012-04-19

    摘要: Embodiments generally relate to optoelectronic semiconductor devices such as photovoltaic cells. In one aspect, a method for forming a device includes forming an absorber layer made of gallium arsenide (GaAs) and having one type of doping, and forming an emitter layer made of a different material and having a higher bandgap than the absorber layer. An intermediate layer can be formed between emitter and absorber layers. A heterojunction and p-n junction are formed between the emitter layer and the absorber layer, where the p-n junction is formed at least partially within the different material at a location offset from the heterojunction. A majority of the absorber layer can be outside of a depletion region formed by the p-n junction. The p-n junction causes a voltage to be generated in the cell in response to the cell being exposed to light at a front side.

    Methods for forming optoelectronic devices including heterojunction

    公开(公告)号:US09048366B2

    公开(公告)日:2015-06-02

    申请号:US13451439

    申请日:2012-04-19

    摘要: Embodiments generally relate to optoelectronic semiconductor devices such as photovoltaic cells. In one aspect, a method for forming a device includes forming an absorber layer made of gallium arsenide (GaAs) and having one type of doping, and forming an emitter layer made of a different material and having a higher bandgap than the absorber layer. An intermediate layer can be formed between emitter and absorber layers. A heterojunction and p-n junction are formed between the emitter layer and the absorber layer, where the p-n junction is formed at least partially within the different material at a location offset from the heterojunction. A majority of the absorber layer can be outside of a depletion region formed by the p-n junction. The p-n junction causes a voltage to be generated in the cell in response to the cell being exposed to light at a front side.

    Optoelectronic devices including heterojunction and intermediate layer

    公开(公告)号:US09093591B2

    公开(公告)日:2015-07-28

    申请号:US13451455

    申请日:2012-04-19

    摘要: Embodiments generally relate to optoelectronic semiconductor devices such as solar cells. In one aspect, a device includes an absorber layer made of gallium arsenide (GaAs) and having only one type of doping. An emitter layer is located closer than the absorber layer to a back side of the device and is made of a different material and having a higher bandgap than the absorber layer. A heterojunction is formed between the emitter layer and the absorber layer, and a p-n junction is formed between the emitter layer and the absorber layer and at least partially within the different material at a location offset from the heterojunction. An intermediate layer is located between the absorber layer and the emitter layer and provides the offset of the p-n junction from the heterojunction, and includes a graded layer and an ungraded back window layer.

    Optoelectronic devices including heterojunction and intermediate layer
    6.
    发明授权
    Optoelectronic devices including heterojunction and intermediate layer 有权
    包括异质结和中间层的光电器件

    公开(公告)号:US09136418B2

    公开(公告)日:2015-09-15

    申请号:US13451455

    申请日:2012-04-19

    摘要: Embodiments generally relate to optoelectronic semiconductor devices such as solar cells. In one aspect, a device includes an absorber layer made of gallium arsenide (GaAs) and having only one type of doping. An emitter layer is located closer than the absorber layer to a back side of the device and is made of a different material and having a higher bandgap than the absorber layer. A heterojunction is formed between the emitter layer and the absorber layer, and a p-n junction is formed between the emitter layer and the absorber layer and at least partially within the different material at a location offset from the heterojunction. An intermediate layer is located between the absorber layer and the emitter layer and provides the offset of the p-n junction from the heterojunction, and includes a graded layer and an ungraded back window layer.

    摘要翻译: 实施例通常涉及诸如太阳能电池的光电半导体器件。 在一个方面,器件包括由砷化镓(GaAs)制成并且仅具有一种掺杂类型的吸收层。 发射极层位于比器件的背面靠近吸收体层,并且由不同的材料制成并具有比吸收层更高的带隙。 在发射极层和吸收层之间形成异质结,并且在偏离异质结的位置处,在发射极层和吸收层之间形成p-n结,并且至少部分地在不同的材料内形成p-n结。 中间层位于吸收层和发射极层之间,并且提供p-n结与异质结的偏移,并且包括渐变层和未分级的后窗层。

    Methods for forming optoelectronic devices including heterojunction

    公开(公告)号:US09136417B2

    公开(公告)日:2015-09-15

    申请号:US13451439

    申请日:2012-04-19

    摘要: Embodiments generally relate to optoelectronic semiconductor devices such as photovoltaic cells. In one aspect, a method for forming a device includes forming an absorber layer made of gallium arsenide (GaAs) and having one type of doping, and forming an emitter layer made of a different material and having a higher bandgap than the absorber layer. An intermediate layer can be formed between emitter and absorber layers. A heterojunction and p-n junction are formed between the emitter layer and the absorber layer, where the p-n junction is formed at least partially within the different material at a location offset from the heterojunction. A majority of the absorber layer can be outside of a depletion region formed by the p-n junction. The p-n junction causes a voltage to be generated in the cell in response to the cell being exposed to light at a front side.

    Method and system for a GAN vertical JFET utilizing a regrown gate
    8.
    发明授权
    Method and system for a GAN vertical JFET utilizing a regrown gate 有权
    使用再生栅的GAN垂直JFET的方法和系统

    公开(公告)号:US09184305B2

    公开(公告)日:2015-11-10

    申请号:US13198655

    申请日:2011-08-04

    摘要: A vertical III-nitride field effect transistor includes a drain comprising a first III-nitride material, a drain contact electrically coupled to the drain, and a drift region comprising a second III-nitride material coupled to the drain and disposed adjacent to the drain along a vertical direction. The field effect transistor also includes a channel region comprising a third III-nitride material coupled to the drift region, a gate region at least partially surrounding the channel region, and a gate contact electrically coupled to the gate region. The field effect transistor further includes a source coupled to the channel region and a source contact electrically coupled to the source. The channel region is disposed between the drain and the source along the vertical direction such that current flow during operation of the vertical III-nitride field effect transistor is along the vertical direction.

    摘要翻译: 垂直III族氮化物场效应晶体管包括:包含第一III族氮化物材料的漏极,与漏极电耦合的漏极接触点;以及漂移区域,包括耦合到漏极并邻近漏极设置的第二III族氮化物材料 垂直方向 场效应晶体管还包括沟道区,该沟道区包括耦合到漂移区的第三III族氮化物材料,至少部分围绕沟道区的栅极区和电耦合到栅极区的栅极接触。 场效应晶体管还包括耦合到沟道区的源极和电耦合到源极的源极接触。 沟道区域沿着垂直方向设置在漏极和源极之间,使得垂直III族氮化物场效应晶体管的工作期间的电流沿着垂直方向。