Abstract:
Gloss-controllable, radiation-curable inkjet inks cure quickly with minimal radiation exposure, enabling high-printing speed and low surface heating with controllable gloss on the printed image. Ink gloss can be controlled by varying the pinning energy to create the printed images with varied gloss from 10 to 100 gloss unit at 85° gloss measurement angle. After curing, the ink remains flexible on the surface, giving excellent performance on a wide range of surfaces, greatly expanding the range of applications for the ink. A gloss-controllable, radiation-curable inkjet ink may include approximately 8-18% of photo-initiators responding to UVA and UVV (UVA: 320-400 nm wavelengths, UVV: 400-450 nm wavelengths) radiation to initiate free radicals and optionally, other types of photo-initiators and approximately 60-85% of highly flexible mono-functional monomers. The resulting ink is of low viscosity, having excellent flexibility after curing, is low-odor and permits excellent print quality and high productivity on a wide range of surfaces.
Abstract:
A method for fabricating edge termination structures in gallium nitride (GaN) materials includes providing an n-type GaN substrate having a first surface and a second surface, forming an n-type GaN epitaxial layer coupled to the first surface of the n-type GaN substrate, and forming one or more p-type regions in the n-type GaN epitaxial layer by using a first ion implantation. At least one of the one or more p-type regions includes an edge termination structure.
Abstract:
A semiconductor structure includes a III-nitride substrate having a top surface and an opposing bottom surface and a first III-nitride layer of a first conductivity type coupled to the top surface of the III-nitride substrate. The semiconductor structure also includes a second III-nitride layer of a second conductivity type coupled to the first III-nitride layer along a vertical direction and a third III-nitride layer of a third conductivity type coupled to the second III-nitride layer along the vertical direction. The semiconductor structure further includes a first trench extending through a portion of the third III-nitride layer to the first III-nitride layer, a second trench extending through another portion of the third III-nitride layer to the second III-nitride layer, and a first metal layer coupled to the second and the third III-nitride layers.
Abstract:
Gloss-controllable, radiation-curable inkjet inks cure quickly with minimal radiation exposure, enabling high-printing speed and low surface heating with controllable gloss on the printed image. Ink gloss can be controlled by varying the pinning energy to create the printed images with varied gloss from 10 to 100 gloss unit at 85° gloss measurement angle. After curing, the ink remains flexible on the surface, giving excellent performance on a wide range of surfaces, greatly expanding the range of applications for the ink. A gloss-controllable, radiation-curable inkjet ink may include approximately 8-18% of photo-initiators responding to UVA and UW (UVA: 320-400 nm wavelengths, UW: 400-450 nm wavelengths) radiation to initiate free radicals and optionally, other types of photo-initiators and approximately 60-85% of highly flexible mono-functional monomers. The resulting ink is of low viscosity, having excellent flexibility after curing, is low-odor and permits excellent print quality and high productivity on a wide range of surfaces.
Abstract:
A semiconductor structure includes a III-nitride substrate having a top surface and an opposing bottom surface and a first III-nitride layer of a first conductivity type coupled to the top surface of the III-nitride substrate. The semiconductor structure also includes a second III-nitride layer of a second conductivity type coupled to the first III-nitride layer along a vertical direction and a third III-nitride layer of a third conductivity type coupled to the second III-nitride layer along the vertical direction. The semiconductor structure further includes a first trench extending through a portion of the third III-nitride layer to the first III-nitride layer, a second trench extending through another portion of the third III-nitride layer to the second III-nitride layer, and a first metal layer coupled to the second and the third III-nitride layers.
Abstract:
A semiconductor structure includes a III-nitride substrate characterized by a first conductivity type and having a first side and a second side opposing the first side, a III-nitride epitaxial layer of the first conductivity type coupled to the first side of the III-nitride substrate, and a plurality of III-nitride epitaxial structures of a second conductivity type coupled to the III-nitride epitaxial layer. The semiconductor structure further includes a III-nitride epitaxial formation of the first conductivity type coupled to the plurality of III-nitride epitaxial structures, and a metallic structure forming a Schottky contact with the III-nitride epitaxial formation and coupled to at least one of the plurality of III-nitride epitaxial structures.
Abstract:
An ink jet printer for printing on a substrate comprising a first print head outputting ink and defining an ink meniscus; a platen operable to carry the substrate; a support structure; and a print head mechanism coupled to the support structure and carrying the first print head. The print head mechanism moving the first print head relative to the platen. A controller controls the print head mechanism such that at least one of a predetermined acceleration and predetermined deceleration of the print head mechanism is achieved such that the ink meniscus is operably maintained.
Abstract:
Gallium nitride material devices and methods associated with the devices are described. The devices may be designed to provide enhanced thermal conduction and reduced thermal resistance. The increased thermal conduction through and out of the gallium nitride devices enhances operability of the devices, including providing excellent RF operation, reliability, and lifetime.
Abstract:
This invention pertains to an electronic device and to a method for making it. The device is a heterojunction transistor, particularly a high electron mobility transistor, characterized by presence of a 2 DEG channel. Transistors of this invention contain an AlGaN barrier and a GaN buffer, with the channel disposed, when present, at the interface of the barrier and the buffer. Surface treated with ammonia plasma resembles untreated surface. The method pertains to treatment of the device with ammonia plasma prior to passivation to extend reliability of the device beyond a period of time on the order of 300 hours of operation, the device typically being a 2 DEG AlGaN/GaN high electron mobility transistor with essentially no gate lag and with essentially no rf power output degradation.
Abstract:
A method of detecting explosives in a vehicle includes providing a first rack on one side of the vehicle, the rack including a neutron generator and a plurality of gamma ray detectors; providing a second rack on another side of the vehicle, the second rack including a neutron generator and a plurality of gamma ray detectors; providing a control system, remote from the first and second racks, coupled to the neutron generators and gamma ray detectors; using the control system, causing the neutron generators to generate neutrons; and performing gamma ray spectroscopy on spectra read by the gamma ray detectors to look for a signature indicative of presence of an explosive. Various apparatus and other methods are also provided.