摘要:
A flash memory device manufacturing process includes the steps of providing a semiconductor substrate; forming two gate structures on the substrate; performing an ion implantation process to form two first source regions in the substrate at two lateral outer sides of the two gate structures; performing a further ion implantation process to form a first drain region in the substrate between the two gate structures; performing a pocket implantation process between the gate structures to form two doped regions in the substrate at two opposite sides of the first drain region; forming two facing L-shaped spacer walls between the two gate structures above the first drain region; performing an ion implantation process to form a second drain region beneath the first drain region, both of which having a steep junction profile compared to the first source regions; and forming a barrier plug above the first drain region.
摘要:
In a manufacturing method of a flash memory structure with a stress area, a better stress effect can be achieved by controlling the manufacturing process of a tunneling oxide layer formed in a gate structure and contacted with a silicon substrate, so that an L-shaped spacer (or a first stress area) and a contact etch stop layer (or a second stress area) of each L-shaped spacer are formed between two gate structures and aligned towards each other to enhance the carrier mobility of the gate structure, so as to achieve the effects of improving a read current, obtaining the required read current by using a lower read voltage, reducing the possibility of having a stress-induced leakage current, and enhancing the data preservation of the flash memory.
摘要:
A semiconductor structure with stress regions includes a substrate defining a first and a second device zone; a first and a second stress region formed in each of the first and second device zones to yield stress different in level; and a barrier plug separating the two device zones from each other. Due to the stress yielded at the stress regions, increased carrier mobility and accordingly, increased reading current can be obtained, and a relatively lower reading voltage is needed to obtain initially required reading current. As a result, the probability of stress-induced leakage current (SILC) is reduced and the semiconductor memory structure may have enhanced data retention ability.
摘要:
In a manufacturing method of a straight word line NOR flash memory array, a source line is implanted after the formation of a word line in the NOR type flash memory array is completed, and a discrete implant region is formed in the NOR type flash memory array and parallel to a component isolation structure, and each discrete implant region constitutes an electric connection with a low impedance between a source line and source contacts on the source line. With such discrete distribution, adjacent memory cells will not be short-circuited or failed even if a deviation of a mash occurs during the manufacturing process.
摘要:
A semiconductor memory structure with stress regions includes a substrate defining a first and a second device zone; a first and a second stress region formed in each of the first and second device zone to yield stress different in level; a barrier plug separating the two device zones from each other; and a plurality of oxide spacers being located between the first stress regions and the barrier plug while in direct contact with the first stress regions. Due to the stress yielded at the stress regions, increased carrier mobility and accordingly, increased reading current can be obtained, and only a relatively lower reading voltage is needed to obtain an initially required reading current. As a result, the probability of stress-induced leakage current is reduced to enhance the data retention ability.
摘要:
A semiconductor memory structure with stress regions includes a substrate defining a first and a second device zone; a first and a second stress region formed in each of the first and second device zone to yield stress different in level; a barrier plug separating the two device zones from each other; and a plurality of oxide spacers being located between the first stress regions and the barrier plug while in direct contact with the first stress regions. Due to the stress yielded at the stress regions, increased carrier mobility and accordingly, increased reading current can be obtained, and only a relatively lower reading voltage is needed to obtain an initially required reading current. As a result, the probability of stress-induced leakage current is reduced to enhance the data retention ability.
摘要:
A method for forming a semiconductor device includes providing a semiconductor substrate; forming a gate dielectric over the semiconductor substrate; forming a gate electrode over the gate dielectric; forming a slim spacer on sidewalls of the gate dielectric and the gate electrode; forming a silicon carbon (SiC) region adjacent the slim spacer; forming a deep source/drain region comprising at least a portion of the silicon carbon region; blanket forming a metal layer, wherein a first interface between the metal layer and the deep source/drain is higher than a second interface between the gate dielectric and the semiconductor substrate; and annealing the semiconductor device to form a silicide region. Preferably, a horizontal spacing between an inner edge of the silicide region and a respective edge of the gate electrode is preferably less than about 150 Å.
摘要:
A semiconductor device and method for forming the same including improved electrostatic discharge protection for advanced semiconductor devices, the semiconductor device including providing semiconductor substrate having a pre-selected surface orientation and crystal direction; an insulator layer overlying the semiconductor substrate; a first semiconductor active region overlying the insulator layer having a first surface orientation selected from the group consisting of and ; a second semiconductor active region extending through a thickness portion of the insulator layer having a second surface orientation selected from the group consisting of and different from the first surface orientation; wherein MOS devices including a first MOS device of a first conduction type is disposed on the first semiconductor active region and a second MOS device of a second conduction type is disposed on the second semiconductor active region.
摘要:
A BiCMOS device with enhanced performance by mechanical uniaxial strain is provided. A first embodiment of the present invention includes an NMOS transistor, a PMOS transistor, and a bipolar transistor formed on different areas of the substrate. A first contact etch stop layer with tensile stress is formed over the NMOS transistor, and a second contact etch stop layer with compressive stress is formed over the PMOS transistor and the bipolar transistor, allowing for an enhancement of each device. Another embodiment has, in addition to the stressed contact etch stop layers, strained channel regions in the PMOS transistor and the NMOS transistor, and a strained base in the BJT.
摘要:
A method of enlarging an image by interpolation means and a related digital camera are disclosed. The method comprises: dividing an original image into a plurality of divided sections; defining a first divided section selected from the plurality of divided sections; defining a second divided section from the divided sections adjacent thereto and continuing until defining a final divided section; enlarging the first divided section by a first specific multiplier and zooming out by a second specific multiplier by using the interpolation means to form a first processed section, and continuing until a final processed section is formed. The first processed section to the final processed section thereby form an enlarged image.