公开(公告)号：US11243127B2

公开(公告)日：2022-02-08

申请号：US15424282

申请日：2017-02-03

Applicant: Hutchinson Technology Incorporated

Inventor： Michael W. Davis ,  Peter F. Ladwig ,  Matthew S. Lang ,  Dean E. Myers ,  Clark T. Olsen ,  Douglas P. Riemer

IPC: G01L1/22 ,  G01L1/14

Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

公开(公告)号：US20210247691A1

公开(公告)日：2021-08-12

申请号：US17171886

申请日：2021-02-09

Applicant: Hutchinson Technology Incorporated

Inventor： Clark T. Olsen ,  Jeffery G. Ribar

IPC: G03F7/00 ,  C23F1/02 ,  C09J7/30 ,  C09J7/25 ,  C09J7/40

Abstract: A method for producing a component without tabs during etching. The method includes: applying a wafer tape to the plated side of the substrate; depositing a resist layer on a metal layer on a metal side of the substrate that is opposite of the plated side; exposing the resist layer to UV light; developing the resist layer; and etching the metal layer.

公开(公告)号：US20200092998A1

公开(公告)日：2020-03-19

申请号：US16572509

申请日：2019-09-16

Applicant: Hutchinson Technology Incorporated

Inventor： Michael W. Davis ,  Jeffery G. Ribar ,  Clark T. Olsen

IPC: H05K1/18 ,  H05K3/30 ,  G01K7/16 ,  G01L1/22 ,  G01L1/14

Abstract: An apparatus is described. The apparatus including a substrate; one or more sensor components formed on the substrate; and one or more electrical circuits formed on the substrate electrically coupled with at least one of the one or more sensor components formed on the substrate.

公开(公告)号：US11940340B2

公开(公告)日：2024-03-26

申请号：US17028706

申请日：2020-09-22

Applicant: Hutchinson Technology Incorporated

Inventor： Clark T. Olsen ,  Duane M. Jelkin

IPC: G01L1/22 ,  G01K7/16 ,  G01L1/14

CPC classification number: G01L1/2206 ,  G01K7/16 ,  G01L1/14

Abstract: An apparatus is described. The apparatus may include a substrate and one or more sensors mounted to the substrate. The one or more sensors may be mounted to the substrate using adhesive material and one or more spot welds.

公开(公告)号：US11638353B2

公开(公告)日：2023-04-25

申请号：US16572509

申请日：2019-09-16

Applicant: Hutchinson Technology Incorporated

Inventor： Michael W. Davis ,  Jeffery G. Ribar ,  Clark T. Olsen

IPC: H05K1/18 ,  H05K3/30 ,  G01L1/22 ,  G01L1/14 ,  G01K7/16

Abstract: An apparatus is described. The apparatus includes a substrate and one or more sensor components formed on the substrate. And, the apparatus includes one or more electrical circuits formed on the substrate electrically coupled with at least one of the one or more sensor components formed on the substrate.

公开(公告)号：US20220196494A1

公开(公告)日：2022-06-23

申请号：US17587865

申请日：2022-01-28

Applicant: Hutchinson Technology Incorporated

Inventor： Michael W. Davis ,  Peter F. Ladwig ,  Matthew S. Lang ,  Dean E. Myers ,  Clark T. Olsen ,  Douglas P. Riemer

IPC: G01L1/22 ,  G01L1/14

Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

公开(公告)号：US20170113297A1

公开(公告)日：2017-04-27

申请号：US15334986

申请日：2016-10-26

Applicant: Hutchinson Technology Incorporated

Inventor： Michael W. Davis ,  Douglas P. Riemer ,  Clark T. Olsen ,  Steven R. Lagergren ,  Paul V. Pesavento

IPC: B23K20/10 ,  B23K1/19 ,  B23K20/233 ,  B23K20/02 ,  C23C14/20 ,  C23C18/32 ,  C23C14/34 ,  C23C14/24 ,  C25D3/04 ,  C25D7/00 ,  C25D5/56 ,  C23C18/16 ,  B23K1/00 ,  C23C14/18

CPC classification number: B23K20/10 ,  B23K1/0008 ,  B23K1/19 ,  B23K20/023 ,  B23K20/233 ,  B23K2101/35 ,  B23K2103/08 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/52 ,  C23C14/185 ,  C23C14/205 ,  C23C18/1641 ,  C23C18/1689 ,  C23C18/1851 ,  C23C18/2006 ,  C23C18/32 ,  C23C18/42 ,  C25D3/04 ,  C25D3/48 ,  C25D5/48 ,  C25D5/505 ,  C25D5/56 ,  C25D7/00

Abstract: A method of manufacture includes forming a metallized tie layer on a surface of a non-metallic component, positioning the surface of the non-metallic component to mate with a metallic surface of a second component, and joining the metallized tie layer with the mated metallic surface of the second component using metal to metal joining techniques.

公开(公告)号：US20240068889A1

公开(公告)日：2024-02-29

申请号：US18388473

申请日：2023-11-09

Applicant: Hutchinson Technology Incorporated

Inventor： Michael W. Davis ,  Peter F. Ladwig ,  Matthew S. Lang ,  Dean E. Myers ,  Clark T. Olsen ,  Douglas P. Riemer

IPC: G01L1/22 ,  G01L1/14

CPC classification number: G01L1/2268 ,  G01L1/146

Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.

公开(公告)号：US20210356338A1

公开(公告)日：2021-11-18

申请号：US17028706

申请日：2020-09-22

Applicant: Hutchinson Technology Incorporated

Inventor： Clark T. Olsen ,  Duane M. Jelkin

IPC: G01L1/22 ,  G01L1/14 ,  G01K7/16

Abstract: An apparatus is described. The apparatus may include a substrate and one or more sensors mounted to the substrate. The one or more sensors may be mounted to the substrate using adhesive material and one or more spot welds.

公开(公告)号：US20210279545A1

公开(公告)日：2021-09-09

申请号：US17028073

申请日：2020-09-22

Applicant: Hutchinson Technology Incorporated

Inventor： Dean E. Myers ,  Michael W. Davis ,  Clark T. Olsen ,  Beauregard J. Gagnon

IPC: G06K19/077 ,  G06K19/07

Abstract: An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer.