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公开(公告)号:US20150156876A1
公开(公告)日:2015-06-04
申请号:US14622328
申请日:2015-02-13
申请人: Hyojae BANG , Dogeun KIM , Hongkyun KIM , Youngbok JEON
发明人: Hyojae BANG , Dogeun KIM , Hongkyun KIM , Youngbok JEON
IPC分类号: H05K1/11
CPC分类号: H05K5/0026 , G06F1/18 , G06F1/185 , G06K7/0047 , H01R12/57 , H01R12/721 , H01R13/00 , H01R23/70 , H01R27/00 , H05K1/0295 , H05K1/11 , H05K1/117 , H05K1/181 , H05K3/10 , H05K3/303 , H05K3/3405 , H05K7/02 , H05K13/00 , H05K2201/09409 , H05K2201/09709 , H05K2201/09954 , H05K2201/10159 , H05K2201/10189 , H05K2201/10446 , Y10S439/946 , Y10S439/951 , Y10T29/49124 , Y10T29/49147
摘要: Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors.