公开(公告)号：US09717143B2

公开(公告)日：2017-07-25

申请号：US14353389

申请日：2013-12-12

申请人： BOE TECHNOLOGY GROUP CO., LTD.

发明人： Meili Wang ,  Hongda Sun ,  Fengjuan Liu

IPC分类号： H05K3/02 ,  H05K3/46 ,  H05K1/02 ,  H01L23/00 ,  H01L21/48 ,  H05K1/03

CPC分类号： H05K1/028 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/00 ,  H01L25/105 ,  H01L51/003 ,  H01L51/5228 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2251/5338 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/022 ,  H05K3/4644 ,  H05K2201/0195 ,  H05K2203/0235 ,  H05K2203/068 ,  H01L2924/00

摘要： A method for fabricating a flexible substrate and a flexible substrate prefabricated component are disclosed, the flexible substrate comprises an electronic device and a flexible layer provided with the electronic device. The fabrication method comprises: disposing a single-sided adhesive layer at a central portion of a surface of a support substrate, an adhesive side of the single-sided adhesive layer being in contact with the support substrate; disposing a double-sided adhesive layer at a peripheral region of the support substrate; disposing the flexible layer on surfaces of the single-sided adhesive layer and the double-sided adhesive layer, the flexible layer being bonded to the double-sided adhesive layer; disposing the electronic device in a region of a surface of the flexible layer corresponding to the single-sided adhesive layer; cutting the flexible layer along a boundary of the electronic device and removing the flexible layer from the single-sided adhesive layer.

公开(公告)号：US20160262256A1

公开(公告)日：2016-09-08

申请号：US14353389

申请日：2013-12-12

申请人： BOE TECHNOLOGY GROUP CO., LTD.

发明人： Meili WANG ,  Hongda SUN ,  Fengjuan LIU

IPC分类号： H05K1/02 ,  H05K3/46

CPC分类号： H05K1/028 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/00 ,  H01L25/105 ,  H01L51/003 ,  H01L51/5228 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68381 ,  H01L2251/5338 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/022 ,  H05K3/4644 ,  H05K2201/0195 ,  H05K2203/0235 ,  H05K2203/068 ,  H01L2924/00

摘要： A method for fabricating a flexible substrate and a flexible substrate prefabricated component are disclosed, the flexible substrate comprises an electronic device and a flexible layer provided with the electronic device. The fabrication method comprises: disposing a single-sided adhesive layer at a central portion of a surface of a support substrate, an adhesive side of the single-sided adhesive layer being in contact with the support substrate; disposing a double-sided adhesive layer at a peripheral region of the support substrate; disposing the flexible layer on surfaces of the single-sided adhesive layer and the double-sided adhesive layer, the flexible layer being bonded to the double-sided adhesive layer; disposing the electronic device in a region of a surface of the flexible layer corresponding to the single-sided adhesive layer; cutting the flexible layer along a boundary of the electronic device and removing the flexible layer from the single-sided adhesive layer.

摘要翻译： 公开了一种用于制造柔性基板和柔性基板预制部件的方法，柔性基板包括电子装置和设置有电子装置的柔性层。 制造方法包括：在支撑基板的表面的中心部分处设置单面粘合剂层，单面粘合剂层的粘合剂侧与支撑基板接触; 在支撑基板的周边区域设置双面粘合剂层; 将柔性层设置在单面粘合剂层和双面粘合剂层的表面上，柔性层粘合到双面粘合剂层上; 将所述电子器件设置在与所述单面粘合剂层相对应的所述柔性层的表面的区域中; 沿着电子设备的边界切割柔性层并从柔性层从单面粘合剂层移除。

公开(公告)号：US20130319759A1

公开(公告)日：2013-12-05

申请号：US13485526

申请日：2012-05-31

申请人： James Wilson Rose ,  Kaustubh Ravindra Nagarkar ,  Craig Patrick Galligan ,  Binoy Milan Shah ,  Oliver Richard Astley

发明人： James Wilson Rose ,  Kaustubh Ravindra Nagarkar ,  Craig Patrick Galligan ,  Binoy Milan Shah ,  Oliver Richard Astley

IPC分类号： H02G15/02 ,  H01B13/00

CPC分类号： H01L24/43 ,  H01L24/46 ,  H01L2224/43 ,  H01L2224/45014 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H05K1/118 ,  H05K2203/0235 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/206

摘要： A flexible wire assembly includes a plurality of elongated conductors and insulators each having a quadrilateral cross section and alternatingly laminated together, the flexible wire assembly having a wire width measured across the conductor and insulators, a wire height equivalent to the height of the conductors and insulators, and a wire length which is measured in a longitudinal direction orthogonal to the wire width and the wire height, wherein the wire length is one or more orders of magnitude greater than the wire width and the wire height; and a first device comprising a plurality of bond pads spaced to define a bond pad pitch, wherein the flexible wire assembly is coupled to the first device at the bond pads such that spacing of the conductor conductors is matched to the bond pad pitch.

摘要翻译： 柔性线组件包括多个细长导体和绝缘体，每个细长导体和绝缘体具有四边形横截面并交替层压在一起，柔性线组件具有跨导体和绝缘体测量的导线宽度，线高度等于导体和绝缘体的高度 以及在与线宽度和线高度正交的纵向方向上测量的线长度，其中线长度比线宽和线高度大一个或多个数量级; 以及包括间隔开以限定接合焊盘间距的多个接合焊盘的第一器件，其中所述柔性线组件在所述接合焊盘处耦合到所述第一器件，使得所述导体导体的间隔与所述接合焊盘间距匹配。

公开(公告)号：US07353592B2

公开(公告)日：2008-04-08

申请号：US11622012

申请日：2007-01-11

申请人： Dennis Tebbe ,  Thomas Smyth ,  Terry Provo ,  Dara Ruggiero

发明人： Dennis Tebbe ,  Thomas Smyth ,  Terry Provo ,  Dara Ruggiero

IPC分类号： H05K3/36

CPC分类号： H05K1/024 ,  H01P11/00 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2203/0228 ,  H05K2203/0235 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49155

摘要： Method for fabricating a textured dielectric substrate (400) for an RF circuit. The method can include the step (104) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate patter (106) which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials (202, 204) into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces (206, 208). Arranging the dielectric pieces on a base plate (302) in accordance with the selected pattern to form the textured dielectric substrate.

摘要翻译： 用于制造用于RF电路的纹理介质衬底（400）的方法。 该方法可以包括选择多个介电衬底材料的步骤（104），每个电介质衬底材料具有不同于电介质衬底材料的每个其它电介质材料的电性能的组合的不同组合或电特性。 选择纹理衬底图案（106），其由分别具有不同组电特性的至少两种类型的不同区域组成，其中每个不同区域的尺寸远小于感兴趣频率处的波长。 将电介质基板材料（202,204）切割成与所选图案的不同区域一致的尺寸和形状，以便形成多个电介质片（206,208）。 根据所选择的图案将电介质片布置在基板（302）上以形成织构化电介质基片。

公开(公告)号：US20050201034A1

公开(公告)日：2005-09-15

申请号：US11074634

申请日：2005-03-09

申请人： Miki Hasegawa

发明人： Miki Hasegawa

IPC分类号： H01R11/01 ,  B61D15/08 ,  H01H73/00 ,  H01L21/3205 ,  H01L21/4763 ,  H01R12/00 ,  H01R13/24 ,  H01R13/44 ,  H01R13/62 ,  H01R13/66 ,  H02H3/00 ,  H02H7/00 ,  H02H9/02 ,  H05K1/00 ,  H05K1/02 ,  H05K3/36

CPC分类号： H01R43/007 ,  H01R13/2414 ,  H05K3/368 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2203/0235

摘要： An anisotropic conductive sheet capable of transmitting high-speed digital signals reliably is provided. The anisotropic conductive sheet has a conductive property in a thickness direction thereof under a predetermined condition, and includes: insulative matrix members having a dielectric constant value of at most 2.28 and a dielectric loss value of at most 0.025; and conductive members having a conductive property in the thickness direction under the predetermined condition in the conductive members capable of flowing electricity between top and bottom surfaces thereof are located in a scattered manner in the matrix members, and the conductive and matrix members are bonded chemically. Especially, the matrix member is made from a resin material having a resin foamed body of a foaming structure, i.e. homogeneous microcell structure. At least one of the conductive members may be of conductive elastomer.

摘要翻译： 提供能够可靠地传输高速数字信号的各向异性导电片。 各向异性导电片在预定条件下在其厚度方向上具有导电性，并且包括绝缘矩阵构件，介电常数值至多为2.28，介电损耗值至多为0.025; 并且在能够在其顶表面和底表面之间流动的导电构件中，在预定条件下在厚度方向上具有导电性的导电构件以分散的方式位于矩阵构件中，并且导电和矩阵构件被化学键合。 特别地，基体材料由具有发泡结构的树脂发泡体的树脂材料制成，即均匀的微孔结构。 至少一个导电构件可以是导电弹性体。

公开(公告)号：US20050194697A1

公开(公告)日：2005-09-08

申请号：US11071239

申请日：2005-03-04

申请人： Miki Hasegawa

发明人： Miki Hasegawa

IPC分类号： H01R11/01 ,  H01B5/16 ,  H01B13/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/48 ,  H05K3/32

CPC分类号： H05K3/325 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2203/0235 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： An anisotropic conductive sheet manufactured through improved manufacturing steps and a method of manufacturing the same. Conductive portions are unevenly arranged in a nonconductive elastomer having fluidity and serving as a matrix, the conductive portions highly densely containing the conductive particles having a specific gravity greater than that of the matrix component, the conductive particles are unevenly dispersed to form substantially nonconductive portions, and the conductive portions and the nonconductive portions are integrally cured to mold anisotropic conductive pieces. The anisotropic conductive pieces are so laminated that the conductive portions and the nonconductive portions are alternately arranged thereby to obtain a first laminate, and the first laminate is cut maintaining a predetermined thickness to obtain a zebra-like sheet. A second laminate obtained by alternately laminating the zebra-like sheets and the elastomer sheets is cut maintaining a predetermined thickness to obtain an isotropic conductive sheet in which the conductive portions are arranged like a matrix.

摘要翻译： 通过改进的制造步骤制造的各向异性导电片及其制造方法。 导电部分不均匀地布置在具有流动性并用作基体的非导电弹性体中，导电部分高密度地包含导电颗粒的比重大于基体组分的导电颗粒，导电颗粒不均匀地分散以形成基本上不导电的部分， 并且导电部分和非导电部分被一体地固化以模制各向异性导电片。 各向异性导电片被层压，使得导电部分和非导电部分交替地布置，从而获得第一层压体，并且将第一层压体切割成保持预定厚度以获得斑马状片材。 通过交替层叠斑马状片材和弹性体片材获得的第二层压体被切割成保持预定厚度，以获得其中导电部分排列成矩阵的各向同性导电片材。

公开(公告)号：US06841882B2

公开(公告)日：2005-01-11

申请号：US10293564

申请日：2002-11-14

申请人： Ray Chien

发明人： Ray Chien

IPC分类号： H01L23/498 ,  H05K3/34 ,  H05K3/40 ,  H01L23/00 ,  H01R12/00 ,  H01R13/40 ,  H01K4/58

CPC分类号： H05K3/4038 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/09836 ,  H05K2201/10287 ,  H05K2201/10378 ,  H05K2203/0235 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00

摘要： An elastomer interposer employed between a package and a printed circuit board and the method of manufacturing the same are disclosed. The elastomer interposer includes an elastomer, a plurality of conductive wires, Cu pads, solder resistant blocks and Ni/Au plated pads. The elastomer has two contact surfaces. The conductive wires are arranged inside the elastomer at a certain interval and tilted toward one of the contact surfaces with an inclined angle. The Cu pads are formed on both of the surfaces at a space, and electrically connected to the corresponding conductive wires. Also, the Ni/Au plated pads are formed over the Cu pads.

摘要翻译： 公开了一种在封装和印刷电路板之间采用的弹性体插入件及其制造方法。 弹性体插入件包括弹性体，多根导线，铜焊盘，阻焊块和Ni / Au电镀垫。 弹性体具有两个接触表面。 导线以一定的间隔配置在弹性体的内侧，以倾斜角朝向其中一个接触面倾斜。 Cu焊盘在空间的两个表面上形成，并且电连接到相应的导线。 此外，Ni / Au电镀焊盘形成在Cu焊盘上。

公开(公告)号：US06707158B2

公开(公告)日：2004-03-16

申请号：US10095579

申请日：2002-03-13

申请人： Sachiyuki Nose

发明人： Sachiyuki Nose

IPC分类号： H01L2348

CPC分类号： H05K3/4038 ,  H01L21/4846 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/0203 ,  H05K3/341 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K2203/0235 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49171 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00014

摘要： A semiconductor device includes a circuit board, a semiconductor element that is mounted on an upper surface of the circuit board and has an electrode terminal, and a sealing resin for sealing a periphery of the semiconductor element that is mounted on the upper surface of the circuit board. The circuit board includes a plurality of conductive members and an insulating substance for binding and fixing the plurality of conductive members. Each of the plurality of conductive members includes a conductive material formed integrally from the upper surface through the lower surface of the circuit board, and an insulating material covering an outer circumference of the conductive material. The conductive material of at least one conductive member of the plurality of conductive members is exposed to the upper surface of the circuit board. The electrode terminal of the semiconductor element is electrically connected to the conductive material of the conductive member exposed to the upper surface of the circuit board via a connecting member.

摘要翻译： 半导体器件包括电路板，安装在电路板的上表面上并具有电极端子的半导体元件和用于密封安装在电路的上表面上的半导体元件的周边的密封树脂 板。 电路板包括多个导电构件和用于绑定和固定多个导电构件的绝缘物质。 多个导电构件中的每一个包括从电路板的下表面的上表面一体地形成的导电材料和覆盖导电材料的外周的绝缘材料。 多个导电构件中的至少一个导电构件的导电材料暴露于电路板的上表面。 半导体元件的电极端子通过连接部件电连接到暴露于电路板的上表面的导电部件的导电材料。

公开(公告)号：US06563210B2

公开(公告)日：2003-05-13

申请号：US09741206

申请日：2000-12-19

申请人： Robert L. Sankman

发明人： Robert L. Sankman

IPC分类号： H01L2312

CPC分类号： H05K3/4038 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/4602 ,  H05K2201/1028 ,  H05K2203/0235 ,  H01L2224/05599

摘要： A microelectronic substrate having a plurality of alternating substantially planar layers of dielectric material and conductive material, and further having a first surface and a second surface, wherein the dielectric material and the conductive material layers extend substantially perpendicularly between the first and second surfaces.

公开(公告)号：US5919546A

公开(公告)日：1999-07-06

申请号：US871419

申请日：1997-06-09

申请人： Michio Horiuchi ,  Yukiharu Takeuchi

发明人： Michio Horiuchi ,  Yukiharu Takeuchi

IPC分类号： H01L23/498 ,  H05K1/03 ,  H05K3/40 ,  B32B3/20

CPC分类号： H01L23/49827 ,  H05K3/4038 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2201/10287 ,  H05K2203/0235 ,  H05K2203/1147 ,  Y10S428/901 ,  Y10T29/49211 ,  Y10T29/49215 ,  Y10T428/24273 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/249956 ,  Y10T428/249969 ,  Y10T428/249986 ,  Y10T428/249987

摘要： A wiring body, used for manufacturing a substrate, includes a columnar body, having an axis, made of fired porous inorganic insulator impregnated with an organic insulator; and a large number of metallic fine wires embedded in the columnar body in parallel with the axis while the metallic fine wires are arranged at intervals, wherein a ratio of the inorganic insulator in the columnar body is 50 to 80 volume %, preferably 50 to 60 volume %. A method for manufacturing a wiring body includes the steps of charging a dispersed solution, in which inorganic insulating powder is dispersed, into a container in which a number of metallic fine wires are arranged in parallel with the axis, drying the dispersed solution, and firing inorganic insulating powder so that the porosity of the fired body can be in a range from 20 to 50 volume % so as to form a columnar body; and the steps of impregnating the obtained porous columnar body with uncured organic insulating material, and curing the organic insulating material.

摘要翻译： 用于制造基板的布线体包括具有轴线的柱状体，其由浸渍有机绝缘体的烧制多孔无机绝缘体制成; 以及与该轴线平行嵌入柱状体中的大量金属细线，同时金属细线间隔配置，柱状体中的无机绝缘体的比例为50〜80体积％，优选为50〜60 体积％。 制造布线体的方法包括以下步骤：将分散有无机绝缘粉末的分散溶液装入其中多个金属细线与轴平行布置的容器中，干燥分散溶液并进行烧制 无机绝缘粉末，使得烧制体的孔隙率可以在20〜50体积％的范围内，形成柱状体; 以及用未固化的有机绝缘材料浸渍所获得的多孔柱状体并使有机绝缘材料固化的步骤。