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公开(公告)号：US09705201B2
公开(公告)日：2017-07-11
申请号：US14628076
申请日：2015-02-20
申请人： HRL LABORATORIES LLC
CPC分类号： H01Q15/002 , H01Q15/0013 , H01Q15/0066 , H01Q15/008 , H01Q15/142 , H01Q15/148 , H05K1/165 , H05K2203/08 , H05K2203/162
摘要： An active artificial magnetic conductor includes an array of unit cells, each unit cell including a top face, at least one wall coupled to the top face, a base coupled to the at least one wall, and a crossed slot in the top face. The top face, the at least one wall, and the base form a cavity and are conductive.
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公开(公告)号：US11930601B2
公开(公告)日：2024-03-12
申请号：US17679525
申请日：2022-02-24
申请人： IBIDEN CO., LTD.
发明人： Yuji Kadowaki , Tomomi Kano
CPC分类号： H05K3/4629 , H05K3/106 , H05K3/108 , H05K3/143 , H05K3/4602 , H05K2203/0143 , H05K2203/0235 , H05K2203/065 , H05K2203/068 , H05K2203/08
摘要： A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.
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公开(公告)号：US20170171966A1
公开(公告)日：2017-06-15
申请号：US15418918
申请日：2017-01-30
发明人： Naoki GOUCHI
CPC分类号： H05K1/0287 , H05K1/0292 , H05K1/0293 , H05K1/0298 , H05K1/0306 , H05K1/0393 , H05K1/111 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/24 , H05K3/4007 , H05K3/4092 , H05K3/4632 , H05K2201/0195 , H05K2201/09509 , H05K2201/096 , H05K2201/09663 , H05K2201/0969 , H05K2201/09781 , H05K2201/10007 , H05K2201/10159 , H05K2201/10984 , H05K2201/2072 , H05K2203/0271 , H05K2203/063 , H05K2203/08
摘要： To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.
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公开(公告)号：US20150263432A1
公开(公告)日：2015-09-17
申请号：US14628076
申请日：2015-02-20
申请人： HRL LABORATORIES LLC
IPC分类号： H01Q15/00
CPC分类号： H01Q15/002 , H01Q15/0013 , H01Q15/0066 , H01Q15/008 , H01Q15/142 , H01Q15/148 , H05K1/165 , H05K2203/08 , H05K2203/162
摘要： An active artificial magnetic conductor includes an array of unit cells, each unit cell including a top face, at least one wall coupled to the top face, a base coupled to the at least one wall, and a crossed slot in the top face. The top face, the at least one wall, and the base form a cavity and are conductive.
摘要翻译： 活性人造磁性导体包括单元电池阵列，每个单元电池包括顶面，与顶面相连的至少一个壁，与该至少一个壁相连的基座，以及顶面中的交叉槽。 顶面，至少一个壁和基部形成空腔并且是导电的。
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5.发明公开公开(公告)号：US20240188228A1
公开(公告)日：2024-06-06
申请号：US18441702
申请日：2024-02-14
申请人： IBIDEN CO., LTD.
发明人： Yuji KADOWAKI , Tomomi KANO
CPC分类号： H05K3/4629 , H05K3/106 , H05K3/108 , H05K3/143 , H05K3/4602 , H05K2203/0143 , H05K2203/0235 , H05K2203/065 , H05K2203/068 , H05K2203/08
摘要： A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.
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公开(公告)号：US09974165B2
公开(公告)日：2018-05-15
申请号：US15418918
申请日：2017-01-30
发明人： Naoki Gouchi
CPC分类号： H05K1/0287 , H05K1/0292 , H05K1/0293 , H05K1/0298 , H05K1/0306 , H05K1/0393 , H05K1/111 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/24 , H05K3/4007 , H05K3/4092 , H05K3/4632 , H05K2201/0195 , H05K2201/09509 , H05K2201/096 , H05K2201/09663 , H05K2201/0969 , H05K2201/09781 , H05K2201/10007 , H05K2201/10159 , H05K2201/10984 , H05K2201/2072 , H05K2203/0271 , H05K2203/063 , H05K2203/08
摘要： To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.
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公开(公告)号：US09596764B2
公开(公告)日：2017-03-14
申请号：US14577333
申请日：2014-12-19
发明人： Naoki Gouchi
CPC分类号： H05K1/0287 , H05K1/0292 , H05K1/0293 , H05K1/0298 , H05K1/0306 , H05K1/0393 , H05K1/111 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/24 , H05K3/4007 , H05K3/4092 , H05K3/4632 , H05K2201/0195 , H05K2201/09509 , H05K2201/096 , H05K2201/09663 , H05K2201/0969 , H05K2201/09781 , H05K2201/10007 , H05K2201/10159 , H05K2201/10984 , H05K2201/2072 , H05K2203/0271 , H05K2203/063 , H05K2203/08
摘要： To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.
摘要翻译： 为了防止电子部件和多层基板的接合强度的降低，电子部件嵌入式模块可以包括具有多个焊盘的电子部件和包括多个树脂层的多层基板和用于容纳电子部件的空腔 零件。 多层基板可以包括具有多个第一图案导体和空间的第一树脂层和具有第二图案导体和多个第三图案导体的第二树脂层。 多个第三图案导体可以与第一图案导体或垫中的任一个导通，其中第二树脂层被放置在第一树脂层上。 第二图案导体可以布置在具有间隙的第一衬垫周围，并且第二树脂层存在于第二图案导体和至少一个第一衬垫之间。
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公开(公告)号：US20150103499A1
公开(公告)日：2015-04-16
申请号：US14577333
申请日：2014-12-19
发明人： Naoki GOUCHI
CPC分类号： H05K1/0287 , H05K1/0292 , H05K1/0293 , H05K1/0298 , H05K1/0306 , H05K1/0393 , H05K1/111 , H05K1/183 , H05K1/185 , H05K1/186 , H05K3/24 , H05K3/4007 , H05K3/4092 , H05K3/4632 , H05K2201/0195 , H05K2201/09509 , H05K2201/096 , H05K2201/09663 , H05K2201/0969 , H05K2201/09781 , H05K2201/10007 , H05K2201/10159 , H05K2201/10984 , H05K2201/2072 , H05K2203/0271 , H05K2203/063 , H05K2203/08
摘要： To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.
摘要翻译： 为了防止电子部件和多层基板的接合强度的降低，电子部件嵌入式模块可以包括具有多个焊盘的电子部件和包括多个树脂层的多层基板和用于容纳电子部件的空腔 零件。 多层基板可以包括具有多个第一图案导体和空间的第一树脂层和具有第二图案导体和多个第三图案导体的第二树脂层。 多个第三图案导体可以与第一图案导体或垫中的任一个导通，其中第二树脂层被放置在第一树脂层上。 第二图案导体可以布置在具有间隙的第一衬垫周围，并且第二树脂层存在于第二图案导体和至少一个第一衬垫之间。
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