公开(公告)号：US20130126918A1

公开(公告)日：2013-05-23

申请号：US13730787

申请日：2012-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chia-Fen HSIEH ,  Chien-Chun LU ,  Ya-Hui CHIANG ,  Chen-Peng HSU ,  Hung-Lieh HU

IPC: H01L33/50

CPC classification number: H01L33/505 ,  H01L33/508 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2933/0041 ,  H05B33/10 ,  H01L2924/00

Abstract: A light emitting device and a fabricating method thereof are described, wherein the light emitting device includes a substrate, a wall, a first LED chip and a light conversion filling. The first LED chip is disposed on a surface of the substrate. The wall is disposed on the surface of the substrate, and surrounds the first LED chip. A first angle between a central axis of the wall and an inner surface of the wall is 0 degree or is acute, a second angle between the central axis of the wall and an outer surface of the wall is 0 degree or is acute, and the outer surface of the wall and the substrate has a space therebetween. The light conversion filling is surrounded by the light conversion wall, and is disposed on the first LED chip.

Abstract translation: 描述了发光器件及其制造方法，其中发光器件包括衬底，壁，第一LED芯片和光转换填充物。 第一LED芯片设置在基板的表面上。 壁布置在基板的表面上，并围绕第一LED芯片。 壁的中心轴线和壁的内表面之间的第一角度为0度或是锐角，壁的中心轴线与壁的外表面之间的第二角度为0度或是尖锐的，并且 壁和基板的外表面之间具有间隔。 光转换填充物被光转换壁包围，并且设置在第一LED芯片上。