公开(公告)号：US20130126918A1

公开(公告)日：2013-05-23

申请号：US13730787

申请日：2012-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chia-Fen HSIEH ,  Chien-Chun LU ,  Ya-Hui CHIANG ,  Chen-Peng HSU ,  Hung-Lieh HU

IPC: H01L33/50

CPC classification number: H01L33/505 ,  H01L33/508 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2933/0041 ,  H05B33/10 ,  H01L2924/00

Abstract: A light emitting device and a fabricating method thereof are described, wherein the light emitting device includes a substrate, a wall, a first LED chip and a light conversion filling. The first LED chip is disposed on a surface of the substrate. The wall is disposed on the surface of the substrate, and surrounds the first LED chip. A first angle between a central axis of the wall and an inner surface of the wall is 0 degree or is acute, a second angle between the central axis of the wall and an outer surface of the wall is 0 degree or is acute, and the outer surface of the wall and the substrate has a space therebetween. The light conversion filling is surrounded by the light conversion wall, and is disposed on the first LED chip.

Abstract translation: 描述了发光器件及其制造方法，其中发光器件包括衬底，壁，第一LED芯片和光转换填充物。 第一LED芯片设置在基板的表面上。 壁布置在基板的表面上，并围绕第一LED芯片。 壁的中心轴线和壁的内表面之间的第一角度为0度或是锐角，壁的中心轴线与壁的外表面之间的第二角度为0度或是尖锐的，并且 壁和基板的外表面之间具有间隔。 光转换填充物被光转换壁包围，并且设置在第一LED芯片上。

公开(公告)号：US20130146936A1

公开(公告)日：2013-06-13

申请号：US13758647

申请日：2013-02-04

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yao-Jun TSAI ,  Chen-Peng HSU ,  Kuo-Feng LIN ,  Hsun-Chih LIU ,  Ji-Feng CHEN ,  Hung-Lieh HU ,  Chien-Jen SUN

IPC: H01L33/62 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/10 ,  H01L33/20 ,  H01L33/38 ,  H01L33/48 ,  H01L2224/06102 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/24 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/8592 ,  H01L2224/92244 ,  H01L2924/12032 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality of voids, or a minimum horizontal distance between a surrounding boundary of the light emitting diode chip and the bonding layer is larger than O. The light emitting diode chip, the light emitting diode package structure and the method may improve the product yields and enhance the light emitting efficiency.

Abstract translation: 提供一种发光二极管芯片，发光二极管封装结构及其形成方法。 发光二极管芯片包括具有多个空隙的接合层，或者发光二极管芯片的周围边界和接合层之间的最小水平距离大于O.发光二极管芯片，发光 二极管封装结构和方法可以提高产品产量并提高发光效率。

公开(公告)号：US20180290900A1

公开(公告)日：2018-10-11

申请号：US15940552

申请日：2018-03-29

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chien-Chun LU ,  Chen-Peng HSU ,  Karthickraj Muthuramalingam ,  Yi-Keng FU ,  Chieh Lee

IPC: C02F1/32

Abstract: A fluid sterilization device including a reaction chamber body, a light source, a fluid sensor and a controller is provided. The reaction chamber body has a reaction chamber through which a fluid passes. The light source is used to emit a light to the reaction chamber. The fluid sensor is used to detect the passage of the fluid and accordingly output. The controller is used to control the light source to emit the light in response to the signal.

公开(公告)号：US20130146921A1

公开(公告)日：2013-06-13

申请号：US13730801

申请日：2012-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chien-Chun LU ,  Chia-tai KUO ,  Chen-Peng HSU ,  Hung-Lieh HU ,  Chien-Jen SUN

IPC: H01L33/50

CPC classification number: H01L33/505 ,  H01L33/508 ,  H01L33/60 ,  H01L2924/0002 ,  H05B33/10 ,  H01L2924/00

Abstract: A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light.