公开(公告)号：US12185456B2

公开(公告)日：2024-12-31

申请号：US17564225

申请日：2021-12-29

Applicant: First Hi-tec Enterprise Co., Ltd. ,  NEXCOM International Co., Ltd. ,  Industrial Technology Research Institute

Inventor： Min-Lin Lee ,  Sheng-Che Hung ,  Ching-Shan Chang ,  Ying-Tsuen Liou

IPC: H05K1/02 ,  H01R12/73 ,  H01R13/6461 ,  H05K3/42 ,  H01R12/77 ,  H01R12/78 ,  H01R12/81 ,  H01R13/26 ,  H01R13/6471 ,  H01R13/648 ,  H01R13/658 ,  H01R13/6581 ,  H01R13/6585 ,  H05K3/46

Abstract: A circuit board and an electronic package using the same are provided. The circuit board includes a rigid board body, at least one bendable extension portion, connecting members, and shielding members. The rigid board body includes conductive layers and dielectric layers therebetween. The extension portion is connected to a side of the rigid board body and formed by layers of the conductive layers and at least one layer of the dielectric layers extending outside the rigid board body. The connecting members are arranged on a connecting end of the extension portion and electrically connected to a signal layer of the conductive layers. The shielding members are arranged around the corresponding connecting members and electrically connected to a ground layer of the conductive layers. The connecting members and the shielding members protrude from the connecting end. A height of the shielding members is lower than a height of the connecting members.

公开(公告)号：US10559534B2

公开(公告)日：2020-02-11

申请号：US16052641

申请日：2018-08-02

Applicant: Industrial Technology Research Institute ,  First Hi-tec Enterprise Co., Ltd. ,  NEXCOM International Co., Ltd.

Inventor： Sheng-Che Hung ,  Min-Lin Lee ,  Ching-Shan Chang ,  Hung-I Liu

IPC: H05K1/18 ,  H01L23/538 ,  H01L23/522 ,  H01L23/00 ,  H05K1/02 ,  H01L23/498 ,  H05K1/11

Abstract: A circuit substrate includes a dielectric layer, a first conductive structure and a second conductive structure. The first conductive structure includes a first conductive circuit and a first conductive via. The first conductive circuit is disposed on the dielectric layer. The first conductive via is disposed in the dielectric layer, and the first conductive circuit is connected to the first conductive via. The second conductive structure includes a second conductive circuit and a second conductive via. The second conductive circuit is disposed in the dielectric layer, the second conductive circuit and the first conductive circuit of the first conductive structure are arranged with an interval, and the second conductive via surrounds the first conductive via with an interval. The second conductive structure has an extending portion. The extending portion protrudes toward the first conductive via and does not contact the first conductive via.

公开(公告)号：US20230189435A1

公开(公告)日：2023-06-15

申请号：US17564225

申请日：2021-12-29

Applicant: First Hi-tec Enterprise Co.,Ltd. ,  NEXCOM International Co., Ltd. ,  Industrial Technology Research Institute

Inventor： Min-Lin Lee ,  Sheng-Che Hung ,  Ching-Shan Chang ,  Ying-Tsuen Liou

IPC: H05K1/02 ,  H01R13/6461 ,  H01R12/73 ,  H01R13/26

CPC classification number: H05K1/0278 ,  H01R13/6461 ,  H01R12/73 ,  H01R13/26

Abstract: A circuit board and an electronic package using the same are provided. The circuit board includes a rigid board body, at least one bendable extension portion, connecting members, and shielding members. The rigid board body includes conductive layers and dielectric layers therebetween. The extension portion is connected to a side of the rigid board body and formed by layers of the conductive layers and at least one layer of the dielectric layers extending outside the rigid board body. The connecting members are arranged on a connecting end of the extension portion and electrically connected to a signal layer of the conductive layers. The shielding members are arranged around the corresponding connecting members and electrically connected to a ground layer of the conductive layers. The connecting members and the shielding members protrude from the connecting end. A height of the shielding members is lower than a height of the connecting members.

公开(公告)号：US20240220694A1

公开(公告)日：2024-07-04

申请号：US18149158

申请日：2023-01-03

Applicant: Industrial Technology Research Institute

Inventor： Sheng-Che Hung ,  Shih-Hsien Wu ,  Hsu-Wei Liu ,  Tzong-Lin Wu

IPC: G06F30/39

CPC classification number: G06F30/39 ,  G06F2119/06

Abstract: A power design architecture including a power supply circuit, a power wiring, at least one chip, a power ring, and a first reference conductor is provided. The power wiring is connected to the power supply circuit. The power ring is disposed around the chip and electrically connected to the chip and the power wiring. The first reference conductor is electrically connected to the chip. Low self-impedance is maintained at any position of the power ring.

公开(公告)号：US11756865B2

公开(公告)日：2023-09-12

申请号：US17141035

申请日：2021-01-04

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Sheng-Che Hung ,  Shih-Hsien Wu ,  Yu-Wei Huang

IPC: H01L23/485 ,  H05K1/11 ,  H05K3/30 ,  H05K3/42

CPC classification number: H01L23/485 ,  H05K1/114 ,  H05K1/115 ,  H05K3/303 ,  H05K3/421 ,  H05K2201/09609

Abstract: An electronic device having a substrate includes a substrate and at least one outer layer. The substrate has a plurality of first vias. The outer layer has a plurality of second vias. The outer layer is disposed on a side of the substrate. The first vias have a larger distribution density or quantity than the second vias so that a portion of the first vias are electrically connected to the second vias, and a portion of the first vias are electrically floating.

公开(公告)号：US20190148300A1

公开(公告)日：2019-05-16

申请号：US16052641

申请日：2018-08-02

Applicant: Industrial Technology Research Institute ,  First Hi-tec Enterprise Co.,Ltd. ,  NEXCOM International Co., Ltd.

Inventor： Sheng-Che Hung ,  Min-Lin Lee ,  Ching-Shan Chang ,  Hung-I Liu

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/522

Abstract: A circuit substrate includes a dielectric layer, a first conductive structure and a second conductive structure. The first conductive structure includes a first conductive circuit and a first conductive via. The first conductive circuit is disposed on the dielectric layer. The first conductive via is disposed in the dielectric layer, and the first conductive circuit is connected to the first conductive via. The second conductive structure includes a second conductive circuit and a second conductive via. The second conductive circuit is disposed in the dielectric layer, the second conductive circuit and the first conductive circuit of the first conductive structure are arranged with an interval, and the second conductive via surrounds the first conductive via with an interval. The second conductive structure has an extending portion. The extending portion protrudes toward the first conductive via and does not contact the first conductive via.