公开(公告)号：US08895347B2

公开(公告)日：2014-11-25

申请号：US13869764

申请日：2013-04-24

Applicant: Industrial Technology Research Institute

Inventor： Teng-Yu Wang ,  Chien-Hsun Chen ,  Chen-Hsun Du ,  Chung-Yuan Kung

IPC: H01L21/00 ,  H01L21/30 ,  H01L31/18 ,  H01L21/20 ,  H01L31/0236 ,  H01L31/068

CPC classification number: H01L31/18 ,  H01L21/20 ,  H01L31/02363 ,  H01L31/068 ,  Y02E10/52 ,  Y02E10/547

Abstract: The disclosure provides a method for fabricating a semiconductor layer having a textured surface, including: (a) providing a textured substrate; (b) forming at least one semiconductor layer on the textured substrate; (c) forming a metal layer on the semiconductor layer; and (d) conducting a thermal process or a low temperature process to the textured substrate, the semiconductor layer and the metal layer, wherein the semiconductor layer is separated from the textured substrate by the thermal process to obtain the semiconductor layer having the metal layer and a textured surface.

Abstract translation: 本公开提供了一种用于制造具有纹理表面的半导体层的方法，包括：（a）提供纹理化衬底; （b）在纹理化衬底上形成至少一个半导体层; （c）在半导体层上形成金属层; 和（d）对纹理化衬底，半导体层和金属层进行热处理或低温工艺，其中半导体层通过热处理与纹理化衬底分离，以获得具有金属层的半导体层和 纹理表面。

公开(公告)号：US20250081632A1

公开(公告)日：2025-03-06

申请号：US18818614

申请日：2024-08-29

Applicant: Industrial Technology Research Institute

Inventor： Hsin-Chung Wu ,  Chun-Wei Su ,  Tzu-Ting Lin ,  En-Yu Pan ,  Yu-Tsung Chiu ,  Chih-Lung Lin ,  Teng-Yu Wang ,  Chiou-Chu Lai ,  Ying-Jung Chiang

IPC: H01L31/048 ,  H01L31/024

Abstract: A solar cell module includes a first substrate, a second substrate, at least one cell unit, a first packaging film, a second packaging film, a first protective layer, a second protective layer, and a plurality of support members. The first substrate and the second substrate are disposed opposite to each other. The cell unit is disposed between the first substrate and the second substrate. The first packaging film is disposed between the cell unit and the first substrate. The second packaging film is disposed between the cell unit and the second substrate. The first protective layer is disposed between the cell unit and the first packaging film. The second protective layer is disposed between the cell unit and the second packaging film. The support members are respectively disposed between the first packaging film and the second packaging film and surround at least two opposite sides of the cell unit.

公开(公告)号：US11931783B2

公开(公告)日：2024-03-19

申请号：US17072349

申请日：2020-10-16

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Teng-Yu Wang ,  Chih-Lung Lin ,  Cheng Chuan Wang

IPC: B26D3/28 ,  B09B3/40 ,  B09B3/80 ,  B09B5/00 ,  B26D7/10

CPC classification number: B09B3/80 ,  B09B3/40 ,  B09B5/00 ,  B26D3/281 ,  B26D7/10

Abstract: A recycle apparatus includes a conveyor, a flattening device, and a cutting tool. The conveyor includes a first roller and a second roller opposite to each other. The flattening device is located aside the first roller and the second roller. The cutting tool is located aside the flattening device. The flattening device is located between the first roller and the second roller of the conveyor and the cutting tool. The first roller and the second roller is configured to press and feed the photovoltaic module to the flattening device for allowing the photovoltaic module to be flattened by the flattening device, and then the flattened photovoltaic module is fed to the cutting tool by the first roller and the second roller for allowing the back sheet to be separated from the glass sheet assembly by the cutting tool.

公开(公告)号：US11811357B2

公开(公告)日：2023-11-07

申请号：US17134807

申请日：2020-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Teng-Yu Wang ,  Chih-Lung Lin ,  Mu-Hsi Sung ,  Neng-Wen Hsieh ,  Chin-Yueh Li

IPC: B25B27/00 ,  H02S30/10 ,  B25B11/02 ,  B23Q3/00

CPC classification number: H02S30/10 ,  B23Q3/00 ,  B25B11/02 ,  B25B27/00

Abstract: The disclosed embodiments relate to a dismantling device configured for a frame of a PV module. The dismantling device includes a connection portion, a first holding portion, and a second holding portion. The first holding portion is connected to the connection portion and configured to press against one of an inner wall and outer wall of the frame. The second holding portion is slidably disposed on the connection portion and movably closer to or away from the first holding portion along a sliding direction. The second holding portion is configured to press against the other one of the inner wall and the outer wall so as to clamp the frame with the first holding portion and to distort the frame.

公开(公告)号：US20170121842A1

公开(公告)日：2017-05-04

申请号：US14977660

申请日：2015-12-22

Applicant: Industrial Technology Research Institute

Inventor： Teng-Yu Wang

IPC: C25F3/12 ,  C25F3/14 ,  C25D17/00 ,  C25D5/02 ,  C25D5/08 ,  H01L31/18 ,  C25F7/00

CPC classification number: C25F3/12 ,  C25D5/026 ,  C25D5/08 ,  C25D17/001 ,  C25D17/02 ,  C25F3/14 ,  C25F7/00

Abstract: An apparatus for electrochemical etching and an apparatus for electroplating are provided, wherein the apparatus for electrochemical etching includes an etching solution spraying head, a support, and a first and a second electrode. The first electrode is disposed inside the etching solution spraying head, and current is provided to an etching solution inside the etching solution spraying head by the first electrode. The support is disposed opposite to the etching solution spraying head. The second electrode is disposed on the support. When a substrate is placed on the second electrode, a first surface of the substrate is in electrical contact with the second electrode, and the etching solution sprayed from the etching solution spraying head can naturally flow through a second surface of the substrate and then flow off from the edges of the support.