公开(公告)号：US20180128468A1

公开(公告)日：2018-05-10

申请号：US15479733

申请日：2017-04-05

Applicant: Industrial Technology Research Institute

Inventor： Heng-Chieh Chien ,  Yu-Lin Chao ,  Wen-Fu Hsu ,  Chih-Ming Shen ,  Chia-Wei Jui ,  Yao-Shun Chen

IPC: F21V21/35 ,  F21V23/06 ,  F21V21/14

CPC classification number: F21V21/35 ,  F21V19/0045 ,  F21V21/14 ,  F21V23/06 ,  F21Y2115/15 ,  H01R25/142 ,  Y02B20/36

Abstract: A rail-type organic light emitting diode lamp assembly is provided. The lamp assembly includes a lamp module, an annular member, a connector, a conductive member, and a rail module. The annular member includes a protrusion portion having a pair of indentations. The connector is connected to the annular member, and includes a through hole, a first end provided with a pair of ears and a second end provided with a pair of hooks. The conductive member is provided in the through hole and has a first end in contact with the annular conductive coil. The rail module is connected with the connector and includes a conductor in contact with a second end of the conductive member. The connector can be slidably hooked to the rail module through the hooks, and after the ears are inserted into the indentations, the annular member can be rotatable with respect to the connector.

公开(公告)号：US10197255B2

公开(公告)日：2019-02-05

申请号：US15479733

申请日：2017-04-05

Applicant: Industrial Technology Research Institute

Inventor： Heng-Chieh Chien ,  Yu-Lin Chao ,  Wen-Fu Hsu ,  Chih-Ming Shen ,  Chia-Wei Jui ,  Yao-Shun Chen

IPC: F21V21/35 ,  F21V21/14 ,  F21V23/06 ,  F21V19/02 ,  F21V19/00 ,  H01R25/14 ,  F21Y115/15

Abstract: A rail-type organic light emitting diode lamp assembly is provided. The lamp assembly includes a lamp module, an annular member, a connector, a conductive member, and a rail module. The annular member includes a protrusion portion having a pair of indentations. The connector is connected to the annular member, and includes a through hole, a first end provided with a pair of ears and a second end provided with a pair of hooks. The conductive member is provided in the through hole and has a first end in contact with the annular conductive coil. The rail module is connected with the connector and includes a conductor in contact with a second end of the conductive member. The connector can be slidably hooked to the rail module through the hooks, and after the ears are inserted into the indentations, the annular member can be rotatable with respect to the connector.

公开(公告)号：US20240162114A1

公开(公告)日：2024-05-16

申请号：US18166496

申请日：2023-02-09

Applicant: Industrial Technology Research Institute

Inventor： Shian-Chiau Chiou ,  Chun-Kai Liu ,  Po-Kai Chiu ,  Chih-Ming Tzeng ,  Yao-Shun Chen

IPC: H01L23/427 ,  H01L23/498

CPC classification number: H01L23/427 ,  H01L23/49894 ,  H01L24/32

Abstract: A power module including at least one power device, an insulation thermally conductive layer, and a heat dissipation device is provided. The insulation thermally conductive layer has a patterned circuit layer. The power device is disposed on the patterned circuit layer and is electrically connected to the patterned circuit layer. The heat dissipation device includes a heat dissipation plate and a heat dissipation base. The heat dissipation plate has a first surface and a second surface opposite to each other, and the insulation thermally conductive layer is disposed on the first surface. The heat dissipation base is partially bonded to the heat dissipation plate, and a chamber is formed between the heat dissipation plate and the heat dissipation bases. The heat dissipation base has a plurality of first heat dissipation bumps located in the chamber.

公开(公告)号：US11362014B2

公开(公告)日：2022-06-14

申请号：US16884403

申请日：2020-05-27

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chun-Kai Liu ,  Yao-Shun Chen ,  Po-Kai Chiu

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/00 ,  H05K7/20 ,  H01L23/433

Abstract: A power module including a circuit board, a chip, a first heat-conduction and insulation substrate and a second heat-conduction and insulation substrate is provided. The circuit board includes a board and a metal block embedded in the board and exposed from a first surface and a second surface of the board opposite to one another. The chip is disposed on a side of the second surface of the board corresponding to the metal block, and the chip is electrically and thermally connected to the metal block. The first heat-conduction and insulation substrate is located on a side of the first surface of the board to be disposed on the circuit board. The second heat-conduction and insulation substrate is electrically and thermally connected to the chip.