MICRO-ELECTROMECHANICAL APPARATUS FOR THERMAL ENERGY CONTROL

    公开(公告)号:US20180188220A1

    公开(公告)日:2018-07-05

    申请号:US15393265

    申请日:2016-12-29

    CPC classification number: G01N33/0073 B81B7/0096 G01N27/123 G01N27/128

    Abstract: A MEMS apparatus for thermal energy control including a sensor and an IC chip is provided. The sensor includes a heating device for heating a sensing element and a detecting device for detecting a physical quantity. The IC chip includes a memory unit for storing a target value of the sensing element and a data processing unit for convert the physical quantity to a converted value, where a gap value is defined by subtracting the converted value from the target value. Besides, a control unit of the IC chip sets a parameter value according to the gap value, and a driving unit adjusts a quantity of thermal energy generated by the heating device according to the parameter value to reduce heating time and frequency of the heating device thereby reducing electrical power consumption. The MEMS apparatus is applicable to MEMS sensors requiring controlled operating temperature, such as a gas sensor.

    Gas sensing device and gas concentration sensing method

    公开(公告)号:US11243198B2

    公开(公告)日:2022-02-08

    申请号:US16879340

    申请日:2020-05-20

    Abstract: A gas sensing device is adapted to detect a concentration of a target gas. The gas sensing device comprises a dielectric layer, a reference sensing portion, a target sensing portion, and a controller. The dielectric layer is disposed on a surface. The reference sensing portion and the target sensing portion are respectively disposed on a supporting side of the dielectric layer, with said supporting side facing away from the surface. The reference sensing portion includes a first conductive layer and a first sensing layer with low sensitivity to the target gas. The target sensing portion includes a second conductive layer and a second sensing layer with high sensitivity to the target gas. The controller obtains the immittance values of the first conductive layer and the second conductive layer, and calculates a concentration value of the target gas according to the immittance values and a correlation function.

    Resistive gas sensor and gas sensing method therefor

    公开(公告)号:US10890548B2

    公开(公告)日:2021-01-12

    申请号:US15856012

    申请日:2017-12-27

    Abstract: A resistive gas sensor is provided. The resistive gas sensor includes a sensing circuit and a determination circuit. The sensing circuit senses a gas to generate a detection signal. The determination circuit performs a frequency-division operation on the detection signal by a frequency-division parameter to generate a frequency-division signal, counts a half of a period of the frequency-division signal to generate a half-period count value, and determines concentration of the gas according to the half-period count value. The determination circuit determines the frequency-division parameter according to the half-period count value.

    Micro-electromechanical apparatus for thermal energy control

    公开(公告)号:US10393718B2

    公开(公告)日:2019-08-27

    申请号:US15393265

    申请日:2016-12-29

    Abstract: A MEMS apparatus for thermal energy control including a sensor and an IC chip is provided. The sensor includes a heating device for heating a sensing element and a detecting device for detecting a physical quantity. The IC chip includes a memory unit for storing a target value of the sensing element and a data processing unit for convert the physical quantity to a converted value, where a gap value is defined by subtracting the converted value from the target value. Besides, a control unit of the IC chip sets a parameter value according to the gap value, and a driving unit adjusts a quantity of thermal energy generated by the heating device according to the parameter value to reduce heating time and frequency of the heating device thereby reducing electrical power consumption. The MEMS apparatus is applicable to MEMS sensors requiring controlled operating temperature, such as a gas sensor.

    Sensing devices and calibration method thereof

    公开(公告)号:US11913925B2

    公开(公告)日:2024-02-27

    申请号:US17125968

    申请日:2020-12-17

    CPC classification number: G01N33/0006 G01K7/16 G01L9/125 G01L27/002 G01N27/121

    Abstract: A sensing device is provided. The sensing device includes a processing circuit and a multi-sensor integrated single chip. The multi-sensor integrated single chip includes a substrate and a temperature sensor, a pressure sensor, and an environmental sensor disposed on the substrate. The temperature sensor senses temperature. The pressure sensor senses pressure. The environmental sensor senses an environmental state. The processing circuit obtains a first sensed temperature value from the temperature sensor when the environmental sensor does not operate, and it obtains a second sensed temperature value from the temperature sensor when the environmental sensor operates. The processing circuit obtains a sensed pressure value from the pressure sensor. The processing circuit obtains at least one temperature calibration reference of the pressure sensor according to the first and second sensed temperature values and calibrates the sensed pressure value according to the temperature calibration reference.

    Sensing devices
    6.
    发明授权

    公开(公告)号:US11543297B2

    公开(公告)日:2023-01-03

    申请号:US16886036

    申请日:2020-05-28

    Abstract: A sensing device is provided. The sensing device includes a plurality of infrared thermosensitive elements and a plurality of resistor-capacitor (RC) oscillators. The plurality of infrared thermosensitive elements are arranged in an array. Each of the plurality of infrared thermosensitive elements has a resistance value which changes with a temperature of the infrared thermosensitive element by absorbing infrared radiation and generates a sensing voltage corresponding to the resistance value. The plurality of RC oscillators are coupled to the plurality of infrared thermosensitive elements to receive the corresponding sensing values, respectively. Each of the plurality of RC oscillators generates a digital sensing signal according to the corresponding sensing value to indicate the temperature of the corresponding infrared thermosensitive element. Each of the plurality of RC oscillators is disposed under the corresponding infrared thermosensitive element.

    Microelectromechanical infrared sensing apparatus having stoppers

    公开(公告)号:US11359970B2

    公开(公告)日:2022-06-14

    申请号:US16904820

    申请日:2020-06-18

    Abstract: A microelectromechanical infrared sensing apparatus includes a substrate, a sensing plate, a plurality of supporting elements and a plurality of stoppers. The substrate includes an infrared reflecting layer. The sensing plate includes an infrared absorbing layer. The supporting elements are disposed on the substrate, and each of the supporting elements is connected to the sensing plate, such that the sensing plate is suspended above the infrared reflecting layer. The stoppers are disposed between the substrate and the sensing plate. When the sensing plate moves toward the infrared reflecting layer and the stoppers contact both the substrate and the sensing plate, the distance between the sensing plate and the infrared reflecting layer is substantially equal to the height of at least one of the stoppers.

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