公开(公告)号：US20230191406A1

公开(公告)日：2023-06-22

申请号：US18074142

申请日：2022-12-02

申请人： CYTESI, INC.

发明人： Tung-Yu WU ,  Tang-Hung PO ,  CHUNG-YI WANG

IPC分类号： B01L3/00 ,  B81B7/00 ,  B01L7/00

CPC分类号： B01L3/50273 ,  B01L7/54 ,  B81B7/0096 ,  B01L2300/0645 ,  B01L2300/1827 ,  B01L2400/0427 ,  B81B2201/057

摘要： There is provided a heating device to independently and/or effectively heat the micro objects manipulated by a micro apparatus/system, for example the droplets of fluids in an electrowetting on dielectric EWOD device of a microfluidic apparatus. The heating device may include a plurality of micro heaters arranged in an array of rows and columns, and the micro heaters of the heating device may be disposed in relative to the electrode elements of the EWOD device, respectively. Therefore, the micro heaters of the heating device may heat one of the electrode elements of the EWOD device, thereby preventing thermal effect of the micro object on the other electrode elements.

公开(公告)号：US20170029270A1

公开(公告)日：2017-02-02

申请号：US15222754

申请日：2016-07-28

申请人： Carrier Corporation

发明人： David P. Potasek ,  John Carl Christenson ,  Marcus Allen Childress

IPC分类号： B81B7/00

CPC分类号： B81B7/0096 ,  B81B7/0087 ,  B81B2201/0214 ,  G01N27/128

摘要： A microelectromechanical systems die including a thermally conductive substrate, at least one insulator film disposed on the thermally conductive substrate, a sensor material disposed on the at least one insulator film, and a heater circumferentially disposed around the sensor material.

摘要翻译： 一种微机电系统管芯，其包括导热基板，设置在导热基板上的至少一个绝缘膜，设置在所述至少一个绝缘膜上的传感器材料和围绕传感器材料周向设置的加热器。

公开(公告)号：US12000792B2

公开(公告)日：2024-06-04

申请号：US17621977

申请日：2020-06-30

申请人： HANGZHOU WEIMING XINKE TECHNOLOGY CO., LTD ,  ADVANCED INSTITUTE OF INFORMATION TECHNOLOGY (AIIT) , PEKING UNIVERSITY

发明人： Han Xiao ,  Guangjun Yu ,  Le Ye ,  Ru Huang

IPC分类号： G01N27/22 ,  B81B7/00

CPC分类号： G01N27/223 ,  B81B7/0096 ,  B81B2201/0214 ,  B81B2203/0136 ,  B81B2203/04 ,  B81B2207/015

摘要： A CMOS-MEMS humidity sensor includes a complementary metal oxide semiconductor (CMOS) ASIC readout circuit and a microelectromechanical system (MEMS) humidity sensor. The MEMS humidity sensor is provided on the ASIC readout circuit. The ASIC readout circuit includes a substrate, a heating resistor layer located above the substrate, a metal layer located above the heating resistor layer, and dielectric layers. The substrate, the heating resistor layer, and the metal layer are partitioned by dielectric layers. The MEMS humidity sensor includes an aluminum electrode layer, a passivation layer located above the aluminum electrode layer, and a humidity sensitive layer located above the passivation layer. The provision of heating resistors in the ASIC circuit realizes the heating function and satisfies the requirements of the standard CMOS process, so that the CMOS-MEMS integrated humidity sensor can be used stably under low temperature and high humidity conditions.

公开(公告)号：US20230159322A1

公开(公告)日：2023-05-25

申请号：US17871075

申请日：2022-07-22

申请人： HYUNDAI MOTOR COMPANY ,  KIA CORPORATION

发明人： Dae Sung Kwon ,  Il Seon Yoo ,  Jang Hyeon Lee ,  Dong Gu Kim ,  Hyun Soo Kim

IPC分类号： B81B7/00

CPC分类号： B81B7/0096

摘要： The present disclosure relates to a microelectromechanical systems (MEMS) device and method for manufacturing the same for improving the uniformity of temperature distribution in a heater unit, and the present disclosure discloses a MEMS device and method for manufacturing the same, including a heater unit that is formed on a substrate, and a dummy pattern unit that is formed in a remaining portion except for a portion where the heater unit is formed so as not to be electrically connected to the heater unit.

公开(公告)号：US20180188220A1

公开(公告)日：2018-07-05

申请号：US15393265

申请日：2016-12-29

申请人： Industrial Technology Research Institute

发明人： Yu-Wen Hsu ,  Ying-Che Lo ,  Chao-Ta Huang ,  Li-Tao Teng

IPC分类号： G01N33/00 ,  G01N27/12

CPC分类号： G01N33/0073 ,  B81B7/0096 ,  G01N27/123 ,  G01N27/128

摘要： A MEMS apparatus for thermal energy control including a sensor and an IC chip is provided. The sensor includes a heating device for heating a sensing element and a detecting device for detecting a physical quantity. The IC chip includes a memory unit for storing a target value of the sensing element and a data processing unit for convert the physical quantity to a converted value, where a gap value is defined by subtracting the converted value from the target value. Besides, a control unit of the IC chip sets a parameter value according to the gap value, and a driving unit adjusts a quantity of thermal energy generated by the heating device according to the parameter value to reduce heating time and frequency of the heating device thereby reducing electrical power consumption. The MEMS apparatus is applicable to MEMS sensors requiring controlled operating temperature, such as a gas sensor.

公开(公告)号：US09250074B1

公开(公告)日：2016-02-02

申请号：US14249723

申请日：2014-04-10

申请人： HRL Laboratories, LLC

发明人： Randall L. Kubena ,  David T. Chang

IPC分类号： G01C19/56 ,  H03B5/32 ,  H03H3/02 ,  H01L41/25 ,  H01L41/053 ,  G01C19/5684 ,  G01C19/5719 ,  G01P15/14 ,  H03B1/02 ,  B81C1/00

CPC分类号： G01C19/56 ,  B81B7/0096 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2207/012 ,  B81C1/00134 ,  B81C1/00261 ,  B81C2201/019 ,  G01C19/5684 ,  G01C19/5719 ,  G01P15/14 ,  H03B1/02 ,  H03B5/32 ,  H03H3/02 ,  H03H9/19 ,  H03H9/2426

摘要： A resonator assembly comprising a semiconductor substrate, a resonator gyroscope, the resonator gyroscope including a first resonator formed in a layer of a first material, and an oscillator on the semiconductor substrate, the oscillator including a second resonator formed of a second material, wherein the second resonator is attached in a cavity; the cavity comprising a first recess in said layer of a first material and the edges of the first recess being attached to the substrate, or the cavity comprising a second recess in said substrate and the edges of the second recess being attached to said layer of a first material.

摘要翻译： 一种谐振器组件，包括半导体衬底，谐振器陀螺仪，谐振器陀螺仪，包括形成在第一材料层中的第一谐振器和半导体衬底上的振荡器，所述振荡器包括由第二材料形成的第二谐振器，其中， 第二谐振器附接在空腔中; 所述空腔包括在所述第一材料层中的第一凹部，并且所述第一凹部的边缘附接到所述基底，或所述腔包括所述基底中的第二凹部，并且所述第二凹部的边缘附接到所述第一凹槽的所述层 第一材料。

公开(公告)号：US20100300201A1

公开(公告)日：2010-12-02

申请号：US12473084

申请日：2009-05-27

申请人： Howard H. Ge ,  A. Dorian Challoner

发明人： Howard H. Ge ,  A. Dorian Challoner

IPC分类号： G01C19/56 ,  B44C1/22

CPC分类号： G01C19/5712 ,  B81B7/0048 ,  B81B7/0096 ,  B81B2201/0242 ,  G01C25/00 ,  Y10T29/49007 ,  Y10T29/4902 ,  Y10T29/49083 ,  Y10T29/49105

摘要： A micromachined thermal and mechanical isolator for MEMS die that may include two layers, a first layer with an active temperature regulator comprising a built-in heater and temperature sensor and a second layer having mechanical isolation beams supporting the die. The isolator may be inserted between a MEMS die of a disc resonator gyroscope (DRG) chip and the leadless chip carrier (LCC) package to isolate the die from stress and temperature gradients. Thermal and mechanical stress to the DRG can be significantly reduced in addition to mitigating temperature sensitivity of the DRG chip. The small form can drastically reduce cost and power consumption of the MEMS inertial sensor and enable new applications such as smart munitions, compact and integrated space navigation solutions, with significant potential cost savings over the existing inertial systems.

摘要翻译： 一种用于MEMS管芯的微加工热和机械隔离器，其可以包括两层，具有主动温度调节器的第一层，其包括内置加热器和温度传感器，以及具有支撑所述管芯的机械隔离梁的第二层。 隔离器可以插入在盘式谐振器陀螺仪（DRG）芯片的MEMS管芯和无引线芯片载体（LCC）封装之间，以将管芯与应力和温度梯度隔离。 除了降低DRG芯片的温度敏感性之外，DRG的热和机械应力可以显着降低。 这种小型化可以大大降低MEMS惯性传感器的成本和功耗，并实现了诸如智能弹药，紧凑型和集成的空间导航解决方案等新应用，相比现有的惯性系统具有显着的潜在成本。

公开(公告)号：US11909354B2

公开(公告)日：2024-02-20

申请号：US17824389

申请日：2022-05-25

申请人： SiTime Corporation

发明人： Carl Arft ,  Aaron Partridge ,  Markus Lutz ,  Charles I. Grosjean

IPC分类号： H03B5/04 ,  H03B5/30 ,  H01L23/31 ,  H01L23/34 ,  B81B3/00 ,  H01L23/00 ,  B81B7/00 ,  H03L1/04 ,  H03H9/08

CPC分类号： H03B5/04 ,  B81B3/0081 ,  B81B7/0096 ,  H01L23/3121 ,  H01L23/345 ,  H01L24/16 ,  H03B5/30 ,  H03L1/04 ,  B81B2207/012 ,  B81B2207/098 ,  H01L2224/16145 ,  H01L2924/1461 ,  H03H9/08

摘要： One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

公开(公告)号：US20150115377A1

公开(公告)日：2015-04-30

申请号：US14065310

申请日：2013-10-28

申请人： Teledyne Scientific & Imaging, LLC

发明人： Jeffrey F. DeNatale ,  Philip A. Stupar

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0096 ,  B81B7/0032 ,  B81B7/0087 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C1/00301 ,  B81C2203/0109 ,  G01C19/5712

摘要： An apparatus for providing localized heating as well as protection for a vibrating MEMS device. A cap over a MEMS gyroscope includes an embedded temperature sensor and a heater. The temperature sensor is a trace made of a material with a known temperature/resistance coefficient, which loops back along itself to reduce electromagnetic interference. The heater is a resistive metal trace which also loops back along itself. The temperature sensor and the heater provide localized temperature stabilization for the MEMS gyroscope to reduce temperature drift in the MEMS gyroscope.

摘要翻译： 一种用于提供局部加热以及用于振动MEMS装置的保护的装置。 MEMS陀螺仪上的盖子包括嵌入式温度传感器和加热器。 温度传感器是由具有已知温度/电阻系数的材料制成的痕迹，其自身循环回落以减少电磁干扰。 加热器是电阻性金属痕迹，其也沿着其自身回绕。 温度传感器和加热器为MEMS陀螺仪提供局部温度稳定，以减少MEMS陀螺仪中的温度漂移。

公开(公告)号：US20150037974A1

公开(公告)日：2015-02-05

申请号：US13953753

申请日：2013-07-30

申请人： UNITED MICROELECTRONICS CORP.

发明人： Hsin-Yi Lu ,  Yu-Chi Lin ,  Jeng-Ho Wang

IPC分类号： B81C1/00

CPC分类号： H01L21/32135 ,  B81B7/0096 ,  C23F1/02 ,  C23F1/12

摘要： A method of patterning a platinum layer includes the following steps. A substrate is provided. A platinum layer is formed on the substrate. An etching process is performed to pattern the platinum layer, wherein an etchant used in the etching process simultaneously includes at least a chloride-containing gas and at least a fluoride-containing gas.

摘要翻译： 图案化铂层的方法包括以下步骤。 提供基板。 在基板上形成铂层。 执行蚀刻工艺以对铂层进行图案化，其中在蚀刻工艺中使用的蚀刻剂同时包括至少含氯化物的气体和至少含氟化物的气体。