Abstract:
A pressure sensor with calibration function includes a casing, a diaphragm, a sensing element, a medium, and at least one calibration element. The diaphragm is disposed on the casing, wherein the casing and the diaphragm define an accommodating space. The sensing element is disposed in the casing. The medium is filled in the accommodating space and in contact with the sensing element. The at least one calibration element is adjustably disposed at the casing and extended into the accommodating space to be in contact with the medium, wherein when the at least one calibration element is moved relative to the casing, the at least one calibration element changes the pressure applied to the medium.
Abstract:
A vibration sensor with monitoring function is provided, which includes a substrate, a microelectromechanical vibration sensor chip and an application-specific integrated circuit chip. The microelectromechanical vibration sensor chip is disposed on the substrate and detects a vibration applied to an object to generate a plurality of vibration signals. The application-specific integrated circuit chip is disposed on the substrate and electrically connected to the microelectromechanical vibration sensor chip, which includes a sampling module, a transform module and an analysis module. The sampling module receives and converts the vibration signals into a plurality of digital signals, and filters the digital signals to generate a plurality of time-domain data. The transform module transforms the time-domain data into a frequency-domain data according to a predetermined number. The analysis module executes a comparison process to compare the frequency-domain data with a predetermined spectrum feature table and generates a notification signal according to the comparison result.
Abstract:
An interaction force detection apparatus includes a sensor, a driving element, a moving element, and a connecting element. The connecting element is connected to the driving element and the sensor. The driving element is adapted to interact with the moving element, so as to generate a pair of forces. The pair of forces includes a first force and a second force, and a magnitude of the first force is equal to that of the second force. The sensor detects the first force exerted on the driving element, and the second force is exerted on the moving element to generate a movement.
Abstract:
An apparatus with two anchors including a housing, a movable element, and a rotary element is provided. The housing includes a first expansion unit, a second expansion unit, and a linkage. First alignment structures are disposed in the movable element and anti-rotation structures are disposed in the linkage. When the movable element and the rotary element enter the housing from two ends and are coupled along an axis, the movable element and the rotary element can approach each other to expand the first expansion unit and the second expansion unit to fonn two anchors. The apparatus :with two anchors secures a sensor in a variety of environments such as walls or machines. When the apparatus with two anchors fixes a sensor in a hole of a stamping machine, the impact force does not cause stress concentration on the sensor so as to improve the reliability of the sensor.
Abstract:
A MEMS apparatus for thermal energy control including a sensor and an IC chip is provided. The sensor includes a heating device for heating a sensing element and a detecting device for detecting a physical quantity. The IC chip includes a memory unit for storing a target value of the sensing element and a data processing unit for convert the physical quantity to a converted value, where a gap value is defined by subtracting the converted value from the target value. Besides, a control unit of the IC chip sets a parameter value according to the gap value, and a driving unit adjusts a quantity of thermal energy generated by the heating device according to the parameter value to reduce heating time and frequency of the heating device thereby reducing electrical power consumption. The MEMS apparatus is applicable to MEMS sensors requiring controlled operating temperature, such as a gas sensor.
Abstract:
A MEMS apparatus comprising composite vibrating unit and the manufacturing method thereof are disclosed. The vibrating unit includes a stiffness element on which a first material is disposed. A second material being a conductive material is disposed on the first material and is extended to the stiffness element to remove electric charge on first material. When a temperature is changed, a variation direction of a Young's modulus of the first material is opposite to a variation direction of a Young's modulus of the stiffness element. The unique attributes above allow vibrating unit of the MEMS apparatus such as resonator and gyroscope to have stable resonance frequency against the change of temperature.
Abstract:
A vertically integrated micro-bolometer includes an integrated circuit chip, an infrared sensing film, and a metal bonding layer. The integrated circuit chip includes a silicon substrate, a circuit element, and a dielectric layer disposed on the silicon substrate. The infrared sensing film includes a top absorbing layer, a sensing layer, and a bottom absorbing layer. The sensing layer is disposed between the top absorbing layer and the bottom absorbing layer. Materials of the top absorbing layer, the sensing layer, and the bottom absorbing layer are materials compatible with a semiconductor manufacturing process. The metal bonding layer connects the dielectric layer on the silicon substrate in the integrated circuit chip and the bottom absorbing layer of the infrared sensing film to form a vertically integrated micro-bolometer. In one embodiment, the infrared sensing film is divided into a central sensing film, a surrounding sensing film, and a plurality of connecting portions by a plurality of slots. The surrounding sensing film surrounds the central sensing film. Each of the connecting portions connects the surrounding sensing film and the central sensing film. A central distance from the bottom absorbing layer of the central sensing film to the silicon substrate is substantially equal to a surrounding distance from the bottom absorbing layer of the surrounding sensing film to the silicon substrate.
Abstract:
A MEMS apparatus with adjustable spring includes a central portion, a peripheral portion and at least one spring. The peripheral portion surrounds the central portion and is spaced apart from the central portion. The spring includes a peripheral section, an outward extension section and a central section. The peripheral section is connected to the outward extension section. An amount of thermal expansion per unit temperature change of the outward extension section is greater than that of the peripheral section or greater than that of the central section.
Abstract:
A ball screw with force sensor in radial direction including a screw rod, a screw nut, a plurality of balls, and a force sensor is provided. The screw nut has a cavity. The cavity is extended along a radial direction from an outer surface of the screw nut. The force sensor is disposed in the cavity of the screw nut, and the force sensor includes a stationary base and an elastic component. The stationary base includes a displacement restraint, and the elastic component includes a contact end and a fixed end. The displacement restraint is coupled to the cavity to prevent the stationary base from being displaced in the radial direction for fixing stationary base firmly in the cavity. The fixed end is connected to the stationary base, and the contact end contacts a bottom surface of the cavity in order to sense a force along the radial direction.
Abstract:
An apparatus with two anchors including a housing, a movable element, and a rotary element is provided. The housing includes a first expansion unit, a second expansion unit, and a linkage. First alignment structures are disposed in the movable element and anti-rotation structures are disposed in the linkage. When the movable element and the rotary element enter the housing from two ends and are coupled along an axis, the movable element and the rotary element can approach each other to expand the first expansion unit and the second expansion unit to form two anchors. The apparatus with two anchors secures a sensor in a variety of environments such as walls or machines. When the apparatus with two anchors fixes a sensor in a hole of a stamping machine, the impact force does not cause stress concentration on the sensor so as to improve the reliability of the sensor.