公开(公告)号：US08901739B2

公开(公告)日：2014-12-02

申请号：US13705367

申请日：2012-12-05

Applicant: Infineon Technologies AG

Inventor： Edward Fuergut ,  Horst Theuss ,  Walter Diez

IPC: H01L23/488 ,  H01L29/84 ,  H01L21/56 ,  H01L21/67 ,  H01L23/48

CPC classification number: H01L23/488 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/67242 ,  H01L23/48 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L29/84 ,  H01L2224/12105 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/82

Abstract: An embedded chip package is provided. The embedded chip package includes a plurality of chips; encapsulation material embedding the plurality of chips; at least one electrical redistribution layer electrically connected to the plurality of chips; and a common terminal connected to the at least one electrical redistribution layer, wherein the common terminal provides an interface to at least one of transmit and receive a common electrical signal between the plurality of chips and the common terminal.

Abstract translation: 提供嵌入式芯片封装。 嵌入式芯片封装包括多个芯片; 封装材料嵌入多个芯片; 电连接到所述多个芯片的至少一个电再分配层; 以及连接到所述至少一个电再分配层的公共终端，其中所述公共终端为所述多个芯片和所述公共终端之间的公共电信号的发射和接收中的至少一个提供接口。

公开(公告)号：US20140151701A1

公开(公告)日：2014-06-05

申请号：US13705367

申请日：2012-12-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Edward Fuergut ,  Horst Theuss ,  Walter Diez

IPC: H01L23/488 ,  H01L23/48 ,  H01L21/67 ,  H01L21/56 ,  H01L29/84

CPC classification number: H01L23/488 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/67242 ,  H01L23/48 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L29/84 ,  H01L2224/12105 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/82

Abstract: An embedded chip package is provided. The embedded chip package includes a plurality of chips; encapsulation material embedding the plurality of chips; at least one electrical redistribution layer electrically connected to the plurality of chips; and a common terminal connected to the at least one electrical redistribution layer, wherein the common terminal provides an interface to at least one of transmit and receive a common electrical signal between the plurality of chips and the common terminal.

Abstract translation: 提供嵌入式芯片封装。 嵌入式芯片封装包括多个芯片; 封装材料嵌入多个芯片; 电连接到所述多个芯片的至少一个电再分配层; 以及连接到所述至少一个电再分配层的公共终端，其中所述公共终端为所述多个芯片和所述公共终端之间的公共电信号的发射和接收中的至少一个提供接口。