公开(公告)号：US20140353387A1

公开(公告)日：2014-12-04

申请号：US14292270

申请日：2014-05-30

Applicant: Infineon Technologies AG

Inventor： Juergen Hoegerl ,  Andreas Mueller-Hipper ,  Frank Pueschner ,  Wolfgang Schindler ,  Peter Stampka

IPC: G06K19/077 ,  H01L23/00

CPC classification number: G06K19/07743 ,  G06K19/07728 ,  G06K19/07745 ,  H01L23/16 ,  H01L23/293 ,  H01L24/16 ,  H01L24/83 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/014

Abstract: A smart card module for use in a smart card includes a microchip and a contact zone for making contact with the microchip by means of a reader. The microchip can be enclosed by an encapsulation which can enclose the microchip completely from all sides.

Abstract translation: 用于智能卡的智能卡模块包括微芯片和用于通过读取器与微芯片接触的接触区域。 微芯片可以通过封装，其可以从所有侧面完全包围微芯片。

公开(公告)号：US11354392B2

公开(公告)日：2022-06-07

申请号：US17075771

申请日：2020-10-21

Applicant: Infineon Technologies AG

Inventor： Timo Lisk ,  Wolfgang Schindler

IPC: G06F21/32 ,  G06Q20/34 ,  G06Q20/40

Abstract: A dual interface smart card having a smart card body, a contact-based interface for contact-based communications, a first security chip which is arranged in the smart card body and is electrically conductively coupled to the contact-based interface, a fingerprint sensor arranged in the smart card body, a second security chip, which is coupled to the fingerprint sensor and is configured to carry out a fingerprint verification by means of fingerprint signals detected by the fingerprint sensor, and an antenna coupled to the second security chip.

公开(公告)号：US10198684B2

公开(公告)日：2019-02-05

申请号：US14719374

申请日：2015-05-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Frank Pueschner ,  Alfred Haimerl ,  Jens Pohl ,  Wolfgang Schindler

IPC: H01L21/56 ,  G06K19/077 ,  H01L23/498 ,  H01L23/00

Abstract: A smart card module includes a substrate having a first main surface and a second main surface, which is opposite the first main surface. The substrate has a plurality of plated-through holes, which extend through the substrate from the first main surface to the second main surface. The smart card module further includes a chip over the first main surface of the substrate, a first metal structure over the second main surface of the substrate, electrically insulating material, which covers the first metal structure, and a second metal structure over the electrically insulating material, wherein the second metal structure is electrically insulated from the first metal structure by the electrically insulating material. The chip is connected to the first metal structure by at least one first plated-through hole. The chip is connected to the second metal structure by at least one second plated-through hole.

公开(公告)号：US20140084070A1

公开(公告)日：2014-03-27

申请号：US13625888

申请日：2012-09-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Frank Pueschner ,  Siegfried Hoffner ,  Peter Stampka ,  Wolfgang Schindler ,  Stephan Rampetzreiter

IPC: G06K19/02 ,  H05K13/00 ,  G06K19/077

CPC classification number: G06K7/10178 ,  Y10T29/49018

Abstract: According to one embodiment, a chip card is provided comprising a booster antenna wherein the booster antenna comprises a material having an electrical resistivity of at least 0.05 Ohm*mm2/m.

Abstract translation: 根据一个实施例，提供了包括增强天线的芯片卡，其中所述增强天线包括具有至少0.05欧姆* mm 2 / m的电阻率的材料。

公开(公告)号：US20210117526A1

公开(公告)日：2021-04-22

申请号：US17075771

申请日：2020-10-21

Applicant: Infineon Technologies AG

Inventor： Timo Lisk ,  Wolfgang Schindler

IPC: G06F21/32 ,  G06Q20/40 ,  G06Q20/34

Abstract: A dual interface smart card having a smart card body, a contact-based interface for contact-based communications, a first security chip which is arranged in the smart card body and is electrically conductively coupled to the contact-based interface, a fingerprint sensor arranged in the smart card body, a second security chip, which is coupled to the fingerprint sensor and is configured to carry out a fingerprint verification by means of fingerprint signals detected by the fingerprint sensor, and an antenna coupled to the second security chip.

公开(公告)号：US09070067B2

公开(公告)日：2015-06-30

申请号：US14292270

申请日：2014-05-30

Applicant: Infineon Technologies AG

Inventor： Juergen Hoegerl ,  Andreas Mueller-Hipper ,  Frank Pueschner ,  Wolfgang Schindler ,  Peter Stampka

IPC: G06K19/06 ,  G06K19/077 ,  H01L23/00

CPC classification number: G06K19/07743 ,  G06K19/07728 ,  G06K19/07745 ,  H01L23/16 ,  H01L23/293 ,  H01L24/16 ,  H01L24/83 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/014

Abstract: A smart card module for use in a smart card includes a microchip and a contact zone for making contact with the microchip by means of a reader. The microchip can be enclosed by an encapsulation which can enclose the microchip completely from all sides.

Abstract translation: 用于智能卡的智能卡模块包括微芯片和用于通过读取器与微芯片接触的接触区域。 微芯片可以通过封装，其可以从所有侧面完全包围微芯片。