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    METHOD FOR CREATING A DOCUMENT STRUCTURE, AND DOCUMENT STRUCTURE
    2.
    发明申请
    METHOD FOR CREATING A DOCUMENT STRUCTURE, AND DOCUMENT STRUCTURE 有权

    公开(公告)号：US20230021853A1

    公开(公告)日：2023-01-26

    申请号：US17866777

    申请日：2022-07-18

    Applicant: Infineon Technologies AG

    Inventor： Frank Pueschner ,  Peter Stampka ,  Jens Pohl ,  Uwe Wagner ,  Thomas Spoettl

    IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  B42D25/305

    Abstract: A method for producing a document structure, wherein the method includes producing a chip structure by forming a cavity in a carrier having a top side and an under side, picking up a chip having at least one chip contact and a redistribution layer (RDL) connected to the at least one chip contact by means of a picking-up device detaching the chip from an auxiliary carrier, wherein the chip bears on the auxiliary carrier by way of the RDL, wherein the chip is lifted up from the auxiliary carrier by means of pressure being exerted on the RDL, wherein the lifted-up chip is picked up and inserted into the cavity, and wherein the RDL is oriented on the top side of the carrier, fixing the chip in the cavity by means of an adhesive, electrically conductively connecting the at least one chip contact of the RDL to an electrically conductive region of the carrier by means of an electrically conductive material, and embedding the carrier between a first paper layer and a second paper layer.

    Chip card and method of forming a chip card
    3.
    发明授权
    Chip card and method of forming a chip card 有权

    公开(公告)号：US10380477B2

    公开(公告)日：2019-08-13

    申请号：US15406832

    申请日：2017-01-16

    Applicant: Infineon Technologies AG

    Inventor： Frank Pueschner ,  Peter Stampka ,  Siegfried Hoffner ,  Jens Pohl

    IPC: G06K19/00 ,  G06K19/077

    Abstract: A chip card is provided. The chip card may include a chip card substrate and an antenna structure disposed in or over the chip card substrate, the antenna structure including a wire arranged to form a first antenna portion configured to contactlessly couple to a chip card external device and a second antenna portion configured to couple to a chip antenna, wherein the wire may include an electrically conductive material coated with an electrically insulating material, wherein the wire of the first antenna portion may be arranged such that a direction of laying progress of the wire of at least some adjacent wire portions are opposite to each other, such that the at least some adjacent wire portions may form a capacitor, wherein the isolation material of the at least some adjacent wire portions may be physically contacting each other.

    On-Chip RF Shields with Backside Redistribution Lines
    6.
    发明申请
    On-Chip RF Shields with Backside Redistribution Lines 审中-公开
    带背面再分配线的片上RF屏蔽

    公开(公告)号：US20150024591A1

    公开(公告)日：2015-01-22

    申请号：US14505270

    申请日：2014-10-02

    Applicant: Infineon Technologies AG

    Inventor： Hans-Joachim Barth ,  Jens Pohl ,  Gottfried Beer ,  Heinrich Koerner

    IPC: H01L21/768 ,  H01L21/308 ,  H01L21/3065

    CPC classification number: H01L21/76898 ,  H01L21/3065 ,  H01L21/308 ,  H01L21/76879 ,  H01L23/481 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6688 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05569 ,  H01L2924/00014 ,  H01L2224/05552

    Abstract: Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes forming a through substrate opening from a back surface of a substrate, the through substrate opening disposed between a first and a second region, the first region comprising devices for RF circuitry and the second region comprising devices for other circuitry. The method further includes forming patterns for redistribution lines on a photo resist layer, the photo resist layer disposed under the back surface, and filling the through substrate opening and the patterns for redistribution lines with a conductive material.

    Abstract translation: 公开了一种片上系统的结构以及片上系统的形成方法。 在一个实施例中，一种制造片上系统的方法包括从衬底的背面形成穿透衬底开口，穿过衬底开口设置在第一和第二区域之间，第一区域包括用于RF电路的装置，第二区域包括第二 区域包括用于其他电路的装置。 该方法还包括在光致抗蚀剂层上形成用于再分配线的图案，设置在背面下方的光致抗蚀剂层，以及用导电材料填充贯通基板开口和再分配线图案。

    ANNULAR DEVICE FORMATION
    8.
    发明公开
    ANNULAR DEVICE FORMATION 审中-公开

    公开(公告)号：US20240097316A1

    公开(公告)日：2024-03-21

    申请号：US18463458

    申请日：2023-09-08

    Applicant: Infineon Technologies AG

    Inventor： Jens Pohl ,  Michael Huber ,  Walther Pachler ,  Stephan Rampetzreiter

    IPC: H01Q1/27 ,  H01Q1/38 ,  H01Q1/50

    CPC classification number: H01Q1/273 ,  H01Q1/38 ,  H01Q1/50

    Abstract: An antenna structure for a contactless wearable structure having a plurality of antenna tracks on the substrate, the opposite ends of which are connectable to form an antenna when the substrate is bent, a plurality of capacitor elements on the substrate that are couplable to the antenna for adjusting the resonance frequency of the antenna, and at least one predefined separation region, by means of which it is possible to adjust which of the plurality of capacitor elements are electrically conductively connectable to the antenna when the substrate is bent, in order to form at least one capacitor with a predetermined total capacitance that is electrically conductively coupled to the antenna.

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