公开(公告)号：US10120826B2

公开(公告)日：2018-11-06

申请号：US15810556

申请日：2017-11-13

Applicant: INPHI CORPORATION

Inventor： Siddharth Sheth ,  Radhakrishnan L. Nagarajan

IPC: G06F13/42 ,  H04B10/80 ,  H04B10/40 ,  H04B10/556 ,  H04B10/54 ,  H04B10/516 ,  H04B10/69 ,  H04B14/02 ,  G06F13/364 ,  G06F13/40 ,  G06F15/78 ,  H04L1/00 ,  H04L25/03 ,  H04L27/34

Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

公开(公告)号：US10055375B2

公开(公告)日：2018-08-21

申请号：US15730479

申请日：2017-10-11

Applicant: INPHI CORPORATION

Inventor： Siddharth Sheth ,  Radhakrishnan L. Nagarajan

IPC: G06F13/24 ,  H04B10/80 ,  H04B10/40 ,  H04B10/556 ,  H04B10/54 ,  H04B10/516 ,  H04B10/69 ,  H04B14/02 ,  G06F13/42

CPC classification number: G06F13/42 ,  G06F13/364 ,  G06F13/4072 ,  G06F13/4282 ,  G06F15/7807 ,  G06F15/7817 ,  H04L1/0003 ,  H04L25/03006 ,  H04L25/03012 ,  H04L27/34

Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

公开(公告)号：US10120825B2

公开(公告)日：2018-11-06

申请号：US15730451

申请日：2017-10-11

Applicant: INPHI CORPORATION

Inventor： Siddharth Sheth ,  Radhakrishnan L. Nagarajan

IPC: G06F13/24 ,  H04B10/80 ,  H04B10/40 ,  H04B10/556 ,  H04B10/54 ,  H04B10/516 ,  H04B10/69 ,  H04B14/02 ,  G06F13/42 ,  G06F13/364 ,  G06F13/40 ,  G06F15/78 ,  H04L1/00 ,  H04L25/03 ,  H04L27/34

Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

公开(公告)号：US10409758B1

公开(公告)日：2019-09-10

申请号：US16403350

申请日：2019-05-03

Applicant: INPHI CORPORATION

Inventor： Siddharth Sheth ,  Radhakrishnan L. Nagarajan

IPC: G06F13/24 ,  H04B10/80 ,  H04B10/40 ,  H04B10/556 ,  H04B10/54 ,  H04B10/516 ,  H04B10/69 ,  H04B14/02 ,  G06F13/42 ,  G06F15/78 ,  G06F13/364 ,  H04L1/00 ,  H04L25/03 ,  G06F13/40 ,  H04L27/34

Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.

公开(公告)号：US10289595B2

公开(公告)日：2019-05-14

申请号：US16040817

申请日：2018-07-20

Applicant: INPHI CORPORATION

Inventor： Siddharth Sheth ,  Radhakrishnan L. Nagarajan

IPC: G06F13/24 ,  H04B10/80 ,  H04B10/40 ,  H04B10/556 ,  H04B10/54 ,  H04B10/516 ,  H04B10/69 ,  H04B14/02 ,  G06F13/42 ,  G06F15/78 ,  H04L1/00 ,  H04L25/03 ,  G06F13/364 ,  G06F13/40 ,  H04L27/34

Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.