公开(公告)号：US10168749B2

公开(公告)日：2019-01-01

申请号：US15366799

申请日：2016-12-01

Applicant: Intel Corporation

Inventor： Russell S. Aoki ,  Devdatta P. Kulkarni ,  Alan W. Tate ,  Robin A. Steinbrecher ,  Ralph W. Jensen

IPC: H05K7/20 ,  G06F1/20 ,  F28F9/26 ,  H05K1/02 ,  H05K1/18 ,  H01L23/40 ,  H01L23/473

Abstract: Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.

公开(公告)号：US09899358B2

公开(公告)日：2018-02-20

申请号：US15163197

申请日：2016-05-24

Applicant: Intel Corporation

Inventor： Alan W. Tate ,  Andrew F. Thompson

IPC: H05K7/00 ,  H01L25/10 ,  H05K1/18 ,  H01L25/00 ,  H05K3/30

CPC classification number: G06F1/185 ,  G11C5/04 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/1082 ,  H05K1/141 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409

Abstract: Printed circuit board (PCB) structures and methods of assembling them are described herein. In some embodiments, a PCB structure may include a first mounting hole; first, second, and third projections radiating from the first mounting hole; and a second mounting hole adjacent to the third projection. The first and second mounting holes located at opposite ends of the third projection. The second mounting hole to cause an electrical coupling of a bottom integrated circuit (IC) module to a connection structure included in a PCB, and the first mounting hole, the first projection, and the second projection to cause positioning of a top IC module above the bottom IC module and electrical coupling of the top IC module to the connection structure.

公开(公告)号：US20170345803A1

公开(公告)日：2017-11-30

申请号：US15163197

申请日：2016-05-24

Applicant: Intel Corporation

Inventor： Alan W. Tate ,  Andrew F. Thompson

IPC: H01L25/10 ,  H05K1/18 ,  H01L25/00 ,  H05K3/30

CPC classification number: G06F1/185 ,  G11C5/04 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/1082 ,  H05K1/141 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409

Abstract: Printed circuit board (PCB) structures and methods of assembling them are described herein. In some embodiments, a PCB structure may include a first mounting hole; first, second, and third projections radiating from the first mounting hole; and a second mounting hole adjacent to the third projection. The first and second mounting holes located at opposite ends of the third projection. The second mounting hole to cause an electrical coupling of a bottom integrated circuit (IC) module to a connection structure included in a PCB, and the first mounting hole, the first projection, and the second projection to cause positioning of a top IC module above the bottom IC module and electrical coupling of the top IC module to the connection structure.

公开(公告)号：US10021814B2

公开(公告)日：2018-07-10

申请号：US15254535

申请日：2016-09-01

Applicant: Intel Corporation

Inventor： Russell S. Aoki ,  Alan W. Tate ,  Ralph W. Jensen

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20763 ,  G06F1/20 ,  G06F1/203 ,  H05K7/2039

Abstract: Embodiments herein relate to liquid cooling interfaces for computer memory components. An apparatus for cooling a computer memory component may include a support and a cooling tube coupled with the support, where the cooling tube is to be positioned parallel to a computer memory connector to receive the computer memory component, and the cooling tube is to be removably coupled with a memory component heat spreader associated with the computer memory component. In some embodiments, the support may be a liquid manifold. Other embodiments may be described and/or claimed.

公开(公告)号：US09823702B2

公开(公告)日：2017-11-21

申请号：US14129252

申请日：2013-03-29

Applicant: INTEL CORPORATION

Inventor： Ming Zhang ,  Michael T. Crocker ,  Xiaofeng Shawn Sheng ,  Alan W. Tate ,  Shanjun Deng ,  Kapil Kane ,  Minglei Wang ,  Russell Beauregard

IPC: G06F1/16 ,  H01R31/00

CPC classification number: G06F1/1656 ,  G06F1/1626 ,  G06F1/1632 ,  G06F1/1643 ,  G06F1/1654 ,  H01R31/00

Abstract: An electronic device may be provided that includes a base portion having an input device, a tablet having a display and a docking connector with a plurality of second electrical connectors, and a docking connector to move relative to the base portion. The docking connector may include a first docking pole to extend from the docking connector and to engage with the docking receptacle, and a plurality of first electrical connectors.