-
公开(公告)号：US10317960B2
公开(公告)日：2019-06-11
申请号：US15324040
申请日：2014-09-28
Applicant: Intel Corporation
Inventor： Hong W. Wong , Yanbing Sun , Shaorong Zhou , Xiaoguo Liang , Wah Yiu Kwong , Cheong W. Wong , Jiancheng Tao , Prosenjit Ghosh
Abstract: In one example an electronic device comprises at least heat generating component, a heat spreader positioned proximate the at least one heat generating component and a passive radiator cooling device, comprising an enclosure, an active speaker positioned at least partially within the enclosure, and a passive audio radiator positioned at least partially within the enclosure. Other examples may be described.
-
公开(公告)号：US10585464B2
公开(公告)日：2020-03-10
申请号：US16089029
申请日：2016-03-28
Applicant: Intel Corporation
Inventor： Hong W. Wong , Wah Yiu Kwong , Cheong W. Wong , Vivek M. Paranjape , Chia-Hung S. Kuo
Abstract: Systems, apparatuses and methods may provide for a thermal protection apparatus comprising a substrate including surfaces defining one or more channels and an array of openings adjacent to the one or more channels and an outer layer coupled to the substrate. The outer layer may include a plurality of opaque elastic regions positioned adjacent to the array of openings. Additionally, a fluid may be positioned within the one or more channels. In one example, the plurality of opaque elastic regions are expandable to become protrusions including one or more of a rectangular shape, a donut shape or a dome shape.
-
公开(公告)号：US20180138387A1
公开(公告)日：2018-05-17
申请号：US15553372
申请日：2015-03-27
Applicant: INTEL CORPORATION
Inventor： Hong W. Wong , Wah Yiu Kwong , Shaorong Zhou , Xiaoguo Liang , Cheong W. Wong , Yanbing Sun
IPC: H01L37/02
CPC classification number: H01L37/02 , F28D15/02 , F28D20/02 , F28D20/028 , F28D2021/0028 , F28F2013/006 , H01L23/4275 , H01L35/32 , H05K3/284 , Y02E60/145
Abstract: Various embodiments are generally directed to an apparatus, method and other techniques to receive thermal energy from a source, convert phase change material (102) from an initial state to a secondary state in response to absorption of the thermal energy, and transfer the thermal energy from the phase change material (102) to a thermoelectric component (106). In addition, various embodiments may include collecting, conducting and converting the thermal energy into electrical energy for use in powering one or more electronic components.
-
公开(公告)号：US10446735B2
公开(公告)日：2019-10-15
申请号：US15553372
申请日：2015-03-27
Applicant: INTEL CORPORATION
Inventor： Hong W. Wong , Wah Yiu Kwong , Shaorong Zhou , Xiaoguo Liang , Cheong W. Wong , Yanbing Sun
Abstract: Various embodiments are generally directed to an apparatus, method and other techniques to receive thermal energy from a source, convert phase change material (102) from an initial state to a secondary state in response to absorption of the thermal energy, and transfer the thermal energy from the phase change material (102) to a thermoelectric component (106). In addition, various embodiments may include collecting, conducting and converting the thermal energy into electrical energy for use in powering one or more electronic components.
-
公开(公告)号：US20170235338A1
公开(公告)日：2017-08-17
申请号：US15503100
申请日：2014-09-26
Applicant: INTEL CORPORATION
Inventor： Hong W. Wong , Wah Yiu Kwong , Cheong W. Wong , Xiaoguo Liang , Christine Kim
CPC classification number: G06F1/1626 , A45C1/06 , A45C11/00 , A45C15/00 , A45C2011/002 , A45C2011/003 , A45C2011/186 , G06F1/1652 , G06F1/1656 , G06F2200/1633 , H04B1/3888
Abstract: An electronic device is described herein. The electronic device includes a portable housing for the electronic device. A zipper of the portable housing is to enable access to the electronic device. Additionally, the electronic device includes a flexible display integrated into the portable housing. The zipper may enable electromagnetic interference (EMI) shielding while enclosing the electronic device and associated components within the portable form factor. In embodiments, a flexible magnetic seal may be used to enclose the electronic device and associated components within the portable form factor.
-
Patent Agency Ranking
公开(公告)号：US10702622B2
公开(公告)日：2020-07-07
申请号：US15534750
申请日：2014-12-10
Applicant: Intel Corporation
Inventor： Hong W. Wong , Jiancheng Tao , Vivek M. Paranjape , Cheong W. Wong , Xiaoguo Liang , Wah Yiu Kwong , Shaorong Zhou , Russell S. Beauregard
Abstract: A system and method for application controlled fragrance generation are disclosed. A particular embodiment includes: receiving a fragrance trigger from an application, the fragrance trigger being associated with a particular fragrance that corresponds to an event, action, image, sound, or gesture depicted in the application, determining a temperature needed to cause the particular fragrance to be emitted from a fragrance cartridge; and causing a thermal element to heat the fragrance cartridge to the determined temperature.
-
公开(公告)号：US20170340764A1
公开(公告)日：2017-11-30
申请号：US15534750
申请日：2014-12-10
Applicant: Intel Corporation
Inventor： Hong W. Wong , Jiancheng Tao , Vivek M. Paranjape , Cheong W. Wong , Xiaoguo Liang , Wah Yiu Kwong , Shaorong Zhou , Russell S. Beauregard
IPC: A61L9/03
CPC classification number: A61L9/035 , A61L9/03 , A61L2209/11 , A61L2209/111 , H04M1/21 , H04M1/72522
Abstract: A system and method for application controlled fragrance generation are disclosed. A particular embodiment includes: receiving a fragrance trigger from an application, the fragrance trigger being associated with a particular fragrance that corresponds to an event, action, image, sound, or gesture depicted in the application, determining a temperature needed to cause the particular fragrance to be emitted from a fragrance cartridge; and causing a thermal element to heat the fragrance cartridge to the determined temperature.
-
公开(公告)号：US20170205858A1
公开(公告)日：2017-07-20
申请号：US15324040
申请日：2014-09-28
Applicant: Intel Corporation
Inventor： Hong W. Wong , Yanbing Sun , Shaorong Zhou , Xiaoguo Liang , Wah Yiu Kwong , Cheong W. Wong , Jiancheng Tao , Prosenjit Ghosh
IPC: G06F1/20
CPC classification number: G06F1/203 , G06F1/1626 , H04R1/2834 , H04R2499/11 , H04R2499/15
Abstract: In one example an electronic device comprises at least heat generating component, a heat spreader positioned proximate the at least one heat generating component and a passive radiator cooling device, comprising an enclosure, an active speaker positioned at least partially within the enclosure, and a passive audio radiator positioned at least partially within the enclosure. Other examples may be described.
-
公开(公告)号：US10990198B2
公开(公告)日：2021-04-27
申请号：US16305866
申请日：2016-06-30
Applicant: INTEL CORPORATION
Inventor： Hong W. Wong , Jiancheng Tao , Xiaoguo Liang , Wah Yiu Kwong , Cheong W. Wong
IPC: G06F3/0354 , G06F3/038 , G06F3/041 , G06F3/045 , G06F3/0488 , G06F1/16
Abstract: Embodiments are generally directed to a wireless stylus with force expression capability. An embodiment of an apparatus includes a body; a microcontroller; a force sensor to detect a pressure applied against the body of the apparatus; one or more motion sensors; and a wireless transmitter and antenna, the microcontroller to transmit force data from the force sensor and motion data from the one or more motion sensors via the wireless transmitter and antenna.
-
公开(公告)号：US20190121408A1
公开(公告)日：2019-04-25
申请号：US16089029
申请日：2016-03-28
Applicant: Hong W. WONG , Wah Yiu KWONG , Cheong W. WONG , Vivek M. PARANJAPE , Chia-Hung S. KUO , Intel Corporation
Inventor： Hong W. Wong , Wah Yiu Kwong , Cheong W. Wong , Vivek M. Paranjape , Chia-Hung S. Kuo
Abstract: Systems, apparatuses and methods may provide for a thermal protection apparatus comprising a substrate including surfaces defining one or more channels and an array of openings adjacent to the one or more channels and an outer layer coupled to the substrate. The outer layer may include a plurality of opaque elastic regions positioned adjacent to the array of openings. Additionally, a fluid may be positioned within the one or more channels. In one example, the plurality of opaque elastic regions are expandable to become protrusions including one or more of a rectangular shape, a donut shape or a dome shape.
-
-
-
-
-
-
-
-
-
Search Results
11
records
(took 0.011 seconds)
