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12 条记录 (耗时 0.013 秒)

    Technologies for managing hot spots in a compute device
    2.
    发明授权
    Technologies for managing hot spots in a compute device 有权

    公开(公告)号：US11058028B2

    公开(公告)日：2021-07-06

    申请号：US16398957

    申请日：2019-04-30

    申请人： Intel Corporation

    发明人： Casey Winkel ,  Shaorong Zhou ,  Lianchang Du ,  Feng Qi

    IPC分类号： H05K7/20

    摘要： Technologies for managing hot spots in a compute device with use of a vortex tube are disclosed. Cold air from one or more vortex tubes can be routed to hot spots of one or more compute devices, providing effective spot cooling. This approach may allow for cooling of components that might otherwise be difficult to cool, such as components where would be difficult or impossible to cool with a heat sink. This approach may also be effective in cooling components that are downstream of a heat sink and would otherwise only be cooled by air that was already heated by the heat sink.

    TECHNOLOGIES FOR MANAGING HOT SPOTS IN A COMPUTE DEVICE
    6.
    发明申请
    TECHNOLOGIES FOR MANAGING HOT SPOTS IN A COMPUTE DEVICE 审中-公开

    公开(公告)号：US20190261536A1

    公开(公告)日：2019-08-22

    申请号：US16398957

    申请日：2019-04-30

    申请人： Intel Corporation

    发明人： Casey Winkel ,  Shaorong Zhou ,  Lianchang Du ,  Feng Qi

    IPC分类号： H05K7/20

    摘要： Technologies for managing hot spots in a compute device with use of a vortex tube are disclosed. Cold air from one or more vortex tubes can be routed to hot spots of one or more compute devices, providing effective spot cooling. This approach may allow for cooling of components that might otherwise be difficult to cool, such as components where would be difficult or impossible to cool with a heat sink. This approach may also be effective in cooling components that are downstream of a heat sink and would otherwise only be cooled by air that was already heated by the heat sink.

    Remediation of thermal irregularities in computing environment
    7.
    发明授权
    Remediation of thermal irregularities in computing environment 有权

    公开(公告)号：US09952638B2

    公开(公告)日：2018-04-24

    申请号：US15119017

    申请日：2014-04-01

    申请人： Intel Corporation

    发明人： Shaorong Zhou ,  Hong W. Wong

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/203 ,  G06F1/20 ,  H05K7/20154 ,  H05K7/20436

    摘要： In an example, a computing device is disclosed in which processing elements and other active devices may generate thermal irregularities such as hot spots on the casing of a computing device. In some cases, these hot spots may be undesirable from a comfort and usability standpoint or because they may result in thermal damage to system components. To remediate thermal irregularities, including hot spots, a localized depression may be provided in a casing or chassis to enlarge the air gap between the heat source and the bottom casing around the hot spot, so that the bottom casing skin temperature at the hot spot can be lowered with the increased air gap. A heat spreader may also be disposed above the localized depression to better distribute heat over a surface area. In some cases, ribbing may be provided to provide structural support to a heat spreader disposed over a localized depression.

    Wireless docking mat for electronic devices
    8.
    发明授权
    Wireless docking mat for electronic devices 有权

    公开(公告)号：US10998774B2

    公开(公告)日：2021-05-04

    申请号：US16085942

    申请日：2016-07-21

    申请人： INTEL CORPORATION

    发明人： Hong W. Wong ,  Timothy Nguyen ,  Shaorong Zhou ,  Xiaoguo Liang ,  Chia-Hung Kuo

    IPC分类号： H02J50/80 ,  H02J50/90 ,  H02J50/05 ,  H02J50/10 ,  H02J7/00 ,  H01F38/14 ,  H02J7/02 ,  H05K7/20

    摘要： In one example a docking mat for an electronic device comprises a first major surface on which the electronic device may be positioned, a wireless power transmitting device, and a controller comprising logic, at least partly including hardware logic, to determine a location of the electronic device on the first major surface of the docking mat, establish a communication connection with the electronic device, receive at least one charge parameter from the electronic device, and activate the wireless power transmitting device in response to a determination that the electronic device is positioned proximate the wireless power transmitting device and the at least one charge parameter indicates that the electronic device is in a condition to receive power from the wireless power transmitting device. Other examples may be described.

    Electronic system having power adapter for wired and wireless charging
    9.
    发明授权
    Electronic system having power adapter for wired and wireless charging 有权

    公开(公告)号：US10971951B2

    公开(公告)日：2021-04-06

    申请号：US15779508

    申请日：2015-12-24

    申请人： INTEL CORPORATION

    发明人： Shaorong Zhou ,  Songnan Yang ,  Hong W. Wong ,  Peipei Ding ,  Xiaoguo Liang ,  Ze An Xia

    IPC分类号： H02J50/12 ,  H02J7/00 ,  H02J7/02

    摘要： A universal power adapter may be provided to provide both a wireless charging signal and a DC signal for wired charging. The universal power adapter may include an AC/DC converter device, a first power circuit, a second power circuit, and a jack to provide a wireless charging signal and a DC signal. The AC/DC converter device to provide a DC signal based on an AC signal received from an external power source. The first power circuit to receive the DC signal and to provide a wireless charging signal based on the DC signal. The second power circuit to receive the DC signal and to provide a DC signal based on the DC signal. The jack may provide both the wireless charging signal and the DC signal.