公开(公告)号：US20170093064A1

公开(公告)日：2017-03-30

申请号：US14863974

申请日：2015-09-24

Applicant: INTEL CORPORATION

Inventor： JACKSON CHUNG PENG KONG ,  ENG HUAT GOH ,  BOK ENG CHEAH ,  SU SIN FLORENCE PHUN ,  KHANG CHOONG YONG ,  MIN KEEN TANG

IPC: H01R12/72 ,  C25D7/00 ,  H01G4/228 ,  C25D5/48 ,  H01G4/06 ,  H01R13/66 ,  C25D5/34

CPC classification number: H01R12/721 ,  C23C18/1653 ,  C25D5/34 ,  C25D5/48 ,  C25D7/00 ,  H01G4/06 ,  H01G4/228 ,  H01G4/40 ,  H01R12/732 ,  H01R13/6625 ,  H05K1/117 ,  H05K1/162 ,  H05K3/00 ,  H05K2201/0187

Abstract: A board-edge interconnection module features integrated capacitive coupling, which enables a board design employing the module to avoid having AC capacitors and flexible cables with bulky connectors. The recovered real estate enables further miniaturization, enabling the component to be used on a wide variety of devices, including ultra-mobile computing devices.

公开(公告)号：US20170091131A1

公开(公告)日：2017-03-30

申请号：US14864019

申请日：2015-09-24

Applicant: INTEL CORPORATION

Inventor： KHANG CHOONG YONG ,  KHAI ERN SEE ,  AMIT KUMAR SRIVASTAVA ,  JACKSON CHUNG PENG KONG ,  TEONG KEAT BEH ,  ENG HUAT GOH

IPC: G06F13/38 ,  G06F3/06 ,  G06F11/14 ,  G06F13/40

CPC classification number: G06F13/385 ,  G06F3/0634 ,  G06F3/065 ,  G06F3/0673 ,  G06F11/1456 ,  G06F13/4022 ,  G06F13/4081 ,  G06F2201/84

Abstract: A universal interconnection scheme enables system architecture modularization with a hot-pluggable external computing module, such as a PC-on-a-card device using USB type-C technology. With the flexibility to interchange the system computing module with an external module, system performance can be augmented to fulfill the essential needs of the user, whether the system is a portable low-power tablet device, a smartphone, a wearable device such as an Internet of Things device, or a high-performance PC.