公开(公告)号：US20150279762A1

公开(公告)日：2015-10-01

申请号：US14736120

申请日：2015-06-10

Applicant: INTEL CORPORATION

Inventor： Randall LOWE ,  Syawad JAIN ,  James C. Matayabas, JR.

IPC: H01L23/373 ,  H01L23/367

CPC classification number: H01L23/3737 ,  B32B5/16 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/085 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2003/282 ,  C08L83/04 ,  C09C3/12 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  C08K3/28 ,  C08K3/10

Abstract: A polymer thermal interface material is described that has enhanced thermal conductivity. In one example, a vinyl-terminated silicone oil is combined with a silicone chain extender, and a thermally conductive filler comprising at least 85% by weight of the material, and comprising surface wetted particles with a range of shapes and sizes. The material may be used for bonding components inside a microelectronic package, for example.

Abstract translation: 描述了具有增强的导热性的聚合物热界面材料。 在一个实例中，将乙烯基封端的硅油与硅氧烷扩链剂和包含至少85重量％的材料的导热填料组合，并且包含具有一定形状和尺寸的表面润湿颗粒。 该材料可以用于例如将微电子封装内部的部件粘接。