公开(公告)号：US10168357B2

公开(公告)日：2019-01-01

申请号：US14976808

申请日：2015-12-21

Applicant: INTEL CORPORATION

Inventor： Wen Yin ,  Anna M. Prakash ,  Teag R. Haughan ,  Dingying David Xu ,  Joaquin Aguilar-Santillan

IPC: G01R1/067 ,  C25D3/54 ,  C25D7/00 ,  C25D5/50 ,  C23C8/20 ,  C22F1/18 ,  C25D5/34 ,  C11D11/00

Abstract: Coated probe tips are described for plunger pins of an integrated circuit package tests system. One example has a plunger having a tip to contact a solder ball of an integrated circuit package, a sleeve to hold the plunger and allow the plunger to move toward and away from the package, the sleeve being held in a socket, a spring within the sleeve to drive the plunger toward the package, and a coating over the tip, the coating being harder than a solder ball.

公开(公告)号：US20170176495A1

公开(公告)日：2017-06-22

申请号：US14976808

申请日：2015-12-21

Applicant: INTEL CORPORATION

Inventor： Wen Yin ,  Anna M. Prakash ,  Teag R. Haughan ,  Dingying David Xu ,  Joaquin Aguilar-Santillan

IPC: G01R1/067 ,  C25D3/54 ,  C25D5/34 ,  C25D5/50 ,  C23C8/20 ,  C22F1/18 ,  C11D7/28 ,  C25D7/00

CPC classification number: G01R1/06761 ,  C11D11/0047 ,  C22F1/183 ,  C23C8/16 ,  C23C8/20 ,  C23C8/80 ,  C25D3/54 ,  C25D5/34 ,  C25D5/50 ,  C25D7/00 ,  G01R1/06722

Abstract: Coated probe tips are described for plunger pins of an integrated circuit package tests system. One example has a plunger having a tip to contact a solder ball of an integrated circuit package, a sleeve to hold the plunger and allow the plunger to move toward and away from the package, the sleeve being held in a socket, a spring within the sleeve to drive the plunger toward the package, and a coating over the tip, the coating being harder than a solder ball.