公开(公告)号：US20220347327A1

公开(公告)日：2022-11-03

申请号：US17245356

申请日：2021-04-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing ZHANG ,  David J. LEWISON ,  Frank L. POMPEO ,  James BUSBY ,  Jay A. BUNT ,  Joyce E. MOLINELLI ACOCELLA ,  Madhana SUNDER ,  Michael J. ELLSWORTH, JR.

IPC: A61L2/10 ,  F21V29/58

Abstract: Apparatuses and methods of fabrication are provided which include a coolant-cooled heat sink through which coolant passes to facilitate cooling the coolant-cooled heat sink, and an ultra-violet (UV) light assembly associated with the coolant-cooled heat sink for directing UV light towards an interior surface of the coolant-cooled heat sink across which the coolant passes. The UV light inhibits bacterial growth at the interior surface of the coolant-cooled heat sink.

公开(公告)号：US20210222956A1

公开(公告)日：2021-07-22

申请号：US16747059

申请日：2020-01-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing ZHANG ,  Jay A. BUNT ,  David J. LEWISON ,  Joyce E. MOLINELLI ACOCELLA ,  Frank L. POMPEO ,  Jeffrey Allen ZITZ

IPC: F28D15/02 ,  H05K7/20 ,  F28D15/04

Abstract: Coolant-cooled heat sinks and methods of fabrication are provided with a coolant-carrying compartment between a cover and a heat transfer base. The heat transfer base includes a heat transfer surface to couple to a component to be cooled, and a plurality of thermally-conductive fins extending into the coolant-carrying compartment from a surface of the heat transfer base opposite to the heat transfer surface. One or more grooves are provided in an interface surface of the cover and fins, and wicking element(s) are positioned within, at least in part, the groove(s). A joining material is provided between the cover and fins to join the plurality of thermally-conductive fins to the cover. The wicking element(s) within, at least in part, the groove(s) facilitate retaining the joining material over the plurality of thermally-conductive fins during joining of the cover and fins.

公开(公告)号：US20250089174A1

公开(公告)日：2025-03-13

申请号：US18463397

申请日：2023-09-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing ZHANG ,  Arthur J. HIGBY ,  David J. LEWISON ,  James BUSBY ,  Jay A. BUNT ,  Levi CAMPBELL ,  Philipp K. BUCHLING REGO ,  Shidong LI ,  Sylvain TETREAULT ,  Yu LUO

IPC: H05K3/00 ,  G05B19/4097 ,  H05K1/02 ,  H05K3/02 ,  H05K3/10 ,  H05K3/18 ,  H05K3/46

Abstract: In-situ fabrication of tamper-respondent sensors with random security circuit patterns is provided. The method includes establishing a random security circuit pattern for fabricating a security circuit of a tamper-respondent sensor to enclose, at least in part, one or more components within a secure volume. The establishing includes generating a trace pattern extending once through nodes of a plurality of nodes dispersed within an area of the tamper-respondent sensor, and randomly modifying the trace pattern to produce a randomly modified trace pattern with a desired randomization index relative to a specified randomization threshold, and providing the randomly modified trace pattern as a random security circuit pattern. Further, the method includes initiating fabricating of the tamper-respondent sensor in-situ on a surface of an enclosure to facilitate defining the secure volume, with the fabricating using the random security circuit pattern.

公开(公告)号：US20220192011A1

公开(公告)日：2022-06-16

申请号：US17117267

申请日：2020-12-10

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing ZHANG ,  Arthur J. HIGBY ,  David J. LEWISON ,  Philipp K. BUCHLING REGO ,  Jay A. BUNT ,  James BUSBY ,  Levi CAMPBELL

IPC: H05K1/02 ,  H05K7/20 ,  F28F13/00 ,  G08B21/18

Abstract: Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.