公开(公告)号：US20190267332A1

公开(公告)日：2019-08-29

申请号：US15904556

申请日：2018-02-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Kamal K. SIKKA ,  Krishna R. TUNGA ,  Hilton T. TOY ,  Thomas WEISS ,  Shidong LI ,  Sushumna IRUVANTI

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/027

Abstract: A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.

公开(公告)号：US20250089174A1

公开(公告)日：2025-03-13

申请号：US18463397

申请日：2023-09-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing ZHANG ,  Arthur J. HIGBY ,  David J. LEWISON ,  James BUSBY ,  Jay A. BUNT ,  Levi CAMPBELL ,  Philipp K. BUCHLING REGO ,  Shidong LI ,  Sylvain TETREAULT ,  Yu LUO

IPC: H05K3/00 ,  G05B19/4097 ,  H05K1/02 ,  H05K3/02 ,  H05K3/10 ,  H05K3/18 ,  H05K3/46

Abstract: In-situ fabrication of tamper-respondent sensors with random security circuit patterns is provided. The method includes establishing a random security circuit pattern for fabricating a security circuit of a tamper-respondent sensor to enclose, at least in part, one or more components within a secure volume. The establishing includes generating a trace pattern extending once through nodes of a plurality of nodes dispersed within an area of the tamper-respondent sensor, and randomly modifying the trace pattern to produce a randomly modified trace pattern with a desired randomization index relative to a specified randomization threshold, and providing the randomly modified trace pattern as a random security circuit pattern. Further, the method includes initiating fabricating of the tamper-respondent sensor in-situ on a surface of an enclosure to facilitate defining the secure volume, with the fabricating using the random security circuit pattern.