公开(公告)号：US20220347327A1

公开(公告)日：2022-11-03

申请号：US17245356

申请日：2021-04-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing ZHANG ,  David J. LEWISON ,  Frank L. POMPEO ,  James BUSBY ,  Jay A. BUNT ,  Joyce E. MOLINELLI ACOCELLA ,  Madhana SUNDER ,  Michael J. ELLSWORTH, JR.

IPC: A61L2/10 ,  F21V29/58

Abstract: Apparatuses and methods of fabrication are provided which include a coolant-cooled heat sink through which coolant passes to facilitate cooling the coolant-cooled heat sink, and an ultra-violet (UV) light assembly associated with the coolant-cooled heat sink for directing UV light towards an interior surface of the coolant-cooled heat sink across which the coolant passes. The UV light inhibits bacterial growth at the interior surface of the coolant-cooled heat sink.

公开(公告)号：US20250098062A1

公开(公告)日：2025-03-20

申请号：US18469606

申请日：2023-09-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Philipp K. BUCHLING REGO ,  Sushumna IRUVANTI ,  Jeffrey Allen ZITZ ,  Steven Paul OSTRANDER ,  Thomas Anthony WASSICK ,  William SANTIAGO-FERNANDEZ ,  Nihad HADZIC ,  James BUSBY

IPC: H05K1/02 ,  G06F21/87 ,  H01L23/04 ,  H05K3/00 ,  H05K5/02

Abstract: Tamper-detect assemblies and methods of fabrication are provided. A tamper-detect assembly includes a laminate carrier with embedded tamper-detect circuitry within the laminate carrier, and one or more electronic components on the laminate carrier. Further, the tamper-detect assembly includes a heat sink cover. The heat sink cover includes a heat sink and tamper-detect circuitry integrated within the heat sink cover. The heat sink cover is mounted to the laminate carrier and encloses the one or more electronic components between the laminate carrier and the heat sink cover. Together, the embedded tamper-detect circuitry of the laminate carrier and the integrated tamper-detect circuitry of the heat sink cover define, at least in part, a secure volume about the one or more electronic components.

公开(公告)号：US20230052840A1

公开(公告)日：2023-02-16

申请号：US17399302

申请日：2021-08-11

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Arthur J. HIGBY ,  William L. BRODSKY ,  Levi CAMPBELL ,  David Clifford LONG ,  James BUSBY ,  Philipp K. BUCHLING REGO

IPC: H05K1/02 ,  H05K5/03

Abstract: Tamper-respondent assemblies are provided which include an enclosure mounted to a circuit board and enclosing one or more components to be protected within a secure volume. A tamper-respondent sensor covers, at least in part, an inner surface of the enclosure, and includes at least one tamper-detect circuit. A monitor circuit is disposed within the secure volume to monitor the tamper-detect circuit(s) for a tamper event. A pressure connector assembly is also disposed within the secure volume, between the tamper-respondent sensor and the circuit board. The pressure connector assembly includes a conductive pressure connector electrically connecting, at least in part, the monitor circuit and the tamper-detect circuit(s) of the tamper-respondent assembly, and a spring-biasing mechanism to facilitate breaking electrical connection of the conductive pressure connector to the tamper-detect circuit(s) with a tamper event.

公开(公告)号：US20250098061A1

公开(公告)日：2025-03-20

申请号：US18467060

申请日：2023-09-14

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Philipp K. BUCHLING REGO ,  Madhana SUNDER ,  Conor Ryan THOMAS ,  Joyce E. MOLINELLI ACOCELLA ,  William L. BRODSKY ,  William SANTIAGO-FERNANDEZ ,  Michael FISHER ,  James BUSBY ,  Arthur J. HIGBY

IPC: H05K1/02

Abstract: Tamper-respondent assemblies are provided which include individualized fluid chemical mixtures for tamper detection. The tamper-respondent assemblies include, for instance, a circuit board and an enclosure. The circuit board includes an electronic component, and the enclosure is mounted to the circuit board to enclose the electronic component within a secure volume, where the secure volume is a sealed space. A fluid is disposed within the secure volume that includes a chemical mixture of multiple chemical substances, and the multiple chemical substances have randomly generated concentrations within the chemical mixture. One or more sensors are provided to facilitate detecting a change in the chemical mixture of the fluid within the secure volume indicative of a tamper event.

公开(公告)号：US20250089174A1

公开(公告)日：2025-03-13

申请号：US18463397

申请日：2023-09-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing ZHANG ,  Arthur J. HIGBY ,  David J. LEWISON ,  James BUSBY ,  Jay A. BUNT ,  Levi CAMPBELL ,  Philipp K. BUCHLING REGO ,  Shidong LI ,  Sylvain TETREAULT ,  Yu LUO

IPC: H05K3/00 ,  G05B19/4097 ,  H05K1/02 ,  H05K3/02 ,  H05K3/10 ,  H05K3/18 ,  H05K3/46

Abstract: In-situ fabrication of tamper-respondent sensors with random security circuit patterns is provided. The method includes establishing a random security circuit pattern for fabricating a security circuit of a tamper-respondent sensor to enclose, at least in part, one or more components within a secure volume. The establishing includes generating a trace pattern extending once through nodes of a plurality of nodes dispersed within an area of the tamper-respondent sensor, and randomly modifying the trace pattern to produce a randomly modified trace pattern with a desired randomization index relative to a specified randomization threshold, and providing the randomly modified trace pattern as a random security circuit pattern. Further, the method includes initiating fabricating of the tamper-respondent sensor in-situ on a surface of an enclosure to facilitate defining the secure volume, with the fabricating using the random security circuit pattern.

公开(公告)号：US20220192011A1

公开(公告)日：2022-06-16

申请号：US17117267

申请日：2020-12-10

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hongqing ZHANG ,  Arthur J. HIGBY ,  David J. LEWISON ,  Philipp K. BUCHLING REGO ,  Jay A. BUNT ,  James BUSBY ,  Levi CAMPBELL

IPC: H05K1/02 ,  H05K7/20 ,  F28F13/00 ,  G08B21/18

Abstract: Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.