ELECTROMAGNETIC WAVEGUIDING THROUGH LIQUID COOLING CONDUIT

    公开(公告)号:US20230420394A1

    公开(公告)日:2023-12-28

    申请号:US17808221

    申请日:2022-06-22

    IPC分类号: H01L23/66 H01L23/473 H01P3/16

    摘要: A multi-chip package structure is provided. The multi-chip package structure includes a first IC chip and a second IC chip, and a fluid conduit thermally coupled to the first IC chip and the second IC chip. The multi-chip package structure is configured to remove heat generated by at least one of the first IC chip and the second IC chip. The fluid conduit has a first end and a second end opposite to the first end. The multi-chip package structure also includes a first monopole feed connected between the first IC chip and the first end of the fluid conduit, and a second monopole feed connected between the second IC chip and the second end of the fluid conduit. The first monopole feed is configured to transmit an electromagnetic signal through the fluid conduit toward the second monopole feed and vice versa.