公开(公告)号：US20250096125A1

公开(公告)日：2025-03-20

申请号：US18470472

申请日：2023-09-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Ashim Dutta ,  Chih-Chao Yang ,  Kishan Jayanand

IPC: H01L23/525

Abstract: A horizontal antifuse structure including a fuse dielectric layer, two slanted annular metal structures arranged adjacent to and opposite one another, wherein bottom portions of the two slanted annular metal structures are embedded in the fuse dielectric layer.

公开(公告)号：US20250004208A1

公开(公告)日：2025-01-02

申请号：US18342127

申请日：2023-06-27

Applicant: International Business Machines Corporation

Inventor： Nicholas Alexander POLOMOFF ,  Nicholas Latham ,  Junwon Han ,  Kishan Jayanand ,  Mary McGahay ,  Sathyanarayanan Raghavan ,  Aakrati Jain

IPC: G02B6/36

Abstract: A lid for a photonic device includes a resilient frame configured to bridge transversely over one or more optical fibers in a region of the photonic device. The resilient frame includes a span that defines a span direction, the resilient frame further includes end portions that are disposed transversely to the span to form an internal region of the frame. A compliant solid base material is formed within the internal region of the frame and attached to the frame along the span. The resilient frame is configured to transversely span over one or more optical fibers and preload the one or more optical fibers with the compliant solid base material when secured to the photonic device.

公开(公告)号：US20250140609A1

公开(公告)日：2025-05-01

申请号：US18496966

申请日：2023-10-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Nicholas Latham ,  Junwon Han ,  Kishan Jayanand ,  Nicholas Alexander POLOMOFF ,  Aakrati Jain ,  Mary McGahay ,  Sathyanarayanan Raghavan

IPC: H01L21/768 ,  H01L21/3105 ,  H01L23/498 ,  H01L23/532

Abstract: Embodiments of present invention provide a method. The method includes forming a set of metal pillars on a substrate; forming a negative-tone organic dielectric layer covering the set of metal pillars; planarizing the negative-tone organic dielectric layer to expose the set of metal pillars; forming a resist mask on the negative-tone organic dielectric layer, the resist mask having openings that expose the set of metal pillars; and forming a redistribution layer in the openings of the resist mask, the redistribution layer being in direct contact with the set of metal pillars. A structure formed thereby is also provided.