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公开(公告)号:US20250158794A1
公开(公告)日:2025-05-15
申请号:US18505431
申请日:2023-11-09
Applicant: International Business Machines Corporation
Inventor: Layne A. Berge , Matthew Doyle , Kyle Schoneck , Jason J. Bjorgaard , John R. Dangler , Matthew A. Walther , Kevin Daniel Escobar , Thomas W. Liang
IPC: H04L5/14
Abstract: A duplex signal communication channel includes first and second signal transmission lines. While a first amplifier coupled to the first signal transmission line is driver into a nonlinear region of operation, a first data signal is transmitted by the first amplifier on the first signal transmission line. The first data signal is transmitted at a multiple of a common clock frequency. A second amplifier coupled to the second signal transmission line transmits a second data signal on the second signal transmission line concurrently with the first data signal, but does so at the common clock frequency. A first receiver circuit receives the first data signal on the first signal transmission line, and a second receiver circuit receives the second data signal on the second signal transmission line. Receiving the first data signal includes extracting the first data signal from the first signal transmission line utilizing a frequency divider circuit.
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公开(公告)号:US20240426893A1
公开(公告)日:2024-12-26
申请号:US18341047
申请日:2023-06-26
Applicant: International Business Machines Corporation
Inventor: Samuel R. Conner , Matteo Cocchini , Matthew Doyle , Stuart Brett Benefield
Abstract: Computer-implemented methods for performing enhanced resolution time-domain reflectometry are provided. Aspects include obtaining a plurality of waveforms by transmitting a first pulse on a transmission line, transmitting a second pulse on the transmission line, where the second pulse is transmitted after the first pulse by a delay, and capturing and measuring reflections of the transmitted pulses, wherein the delay corresponding to each of the plurality of waveforms is different. Aspects also include identifying a discontinuity of the transmission line based at least in part on the plurality of waveforms. Based on a determination that the transmission line includes the discontinuity, aspects include calculating third derivative curves for each of the plurality of waveforms and calculating a length of the discontinuity of the transmission line based on the third derivative curves. Aspects also include creating a notification indicating a location and the length of the discontinuity of the transmission line.
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公开(公告)号:US12117420B2
公开(公告)日:2024-10-15
申请号:US17217592
申请日:2021-03-30
Applicant: International Business Machines Corporation
Inventor: Layne A. Berge , Matthew Doyle , John R. Dangler , Thomas W. Liang , Jason J. Bjorgaard , Kyle Schoneck , Matthew A. Walther
CPC classification number: G01N29/26 , G01N29/4445 , H01B11/1882 , H01B11/1895 , G06N10/00
Abstract: A system, apparatus, and method for determining ultrasonic vital product data of coaxial cables and side-band communications through a water medium of a water-cooling system and/or apparatus. The system may include a first electronic device. The system may also include a second electronic device. The system may also include one or more cables running between the first electronic device and the second electronic device. The system may also include a water jacket filled with water encasing the one or more cables. The system may also include one or more transducers connected to the water jacket, the one or more transducers configured to send signals through the water to gather information about each cable. The system may also include a computer system connected to the one or more transducers, where the computer system is configured to control the one or more transducers.
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公开(公告)号:US20240311222A1
公开(公告)日:2024-09-19
申请号:US18182448
申请日:2023-03-13
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Matthew Doyle , Patrick Fiske , Rodolfo Lopez , Sneha U. Kadam
CPC classification number: G06F11/2023 , G06F11/076 , G06F11/0772 , G06F11/2263
Abstract: A method, computer system, and a computer program product for computer memory structural analysis are provided. A processor receives test results that indicate baseline interface voltage level that is from a transient data transmission and is measured at the computer memory. In response to detecting, via the processor, that the test results indicate a baseline wander for the baseline interface voltage level of the computer memory, the processor generates, based on the baseline wander, an identification of an associated structural communication flaw of the computer memory and a compensation recommendation for compensative for the structural flaw. The processor transmits the compensation recommendation for presentation of the compensation recommendation.
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公开(公告)号:US12079377B2
公开(公告)日:2024-09-03
申请号:US17189857
申请日:2021-03-02
Applicant: International Business Machines Corporation
Inventor: Eric J. Campbell , Matthew Doyle , Mark J. Jeanson , Gerald Bartley , Darryl Becker
IPC: G06F21/72 , C01G5/02 , C09D7/61 , C09K5/14 , G01J1/42 , G01R31/00 , G01R31/28 , G01T1/17 , H01L23/00 , H05K1/02 , H05K1/18
CPC classification number: G06F21/72 , C01G5/02 , C09D7/61 , C09K5/14 , G01J1/429 , G01R31/002 , G01T1/17 , H01L23/576 , H05K1/0275 , H05K1/181 , G01R31/2801
Abstract: A method, printed circuit board assembly (PCBA), and device comprising a PCBA are disclosed. The method includes obtaining a material comprising silver halide grains, incorporating the material into a PCBA having at least one component in contact with the material, detecting a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enacting a data protection response. The PCBA includes a material comprising silver halide grains, at least one component in contact with the material, and a monitoring component. The monitoring component is configured to detect a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enact a data protection response.
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公开(公告)号:US12075702B2
公开(公告)日:2024-08-27
申请号:US17811374
申请日:2022-07-08
Applicant: International Business Machines Corporation
Inventor: Matthew Doyle , Joseph Kuczynski , Patrick Egan , Jeffrey N. Judd , Timothy J. Tofil
IPC: H01L41/04 , H01H1/029 , H01H57/00 , H10N30/20 , H10N30/857
CPC classification number: H10N30/20 , H01H1/029 , H01H57/00 , H10N30/857
Abstract: Provided is an apparatus comprising a conductive particle interconnect (CPI). The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The elastomeric carrier includes an electroactive polymer (EAP) configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP is in the first position and a second electrical resistance when the EAP is in the second position. The apparatus further comprises one or more electrodes electrically coupled to the CPI. The electrodes are configured to generate the electrical field within the CPI. The apparatus further comprises one or more insulators coupled to the CPI. The one or more insulators are configured to constrain expansion of the CPI in at least one direction.
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公开(公告)号:US12051870B2
公开(公告)日:2024-07-30
申请号:US17456670
申请日:2021-11-29
Applicant: International Business Machines Corporation
Inventor: Kyle Schoneck , Layne A. Berge , Jason J. Bjorgaard , John R. Dangler , Matthew Doyle , Thomas W. Liang , Matthew A. Walther
IPC: H01R13/207 , G06N10/40 , H01R24/28
CPC classification number: H01R13/207 , H01R24/28 , G06N10/40
Abstract: An approach for connecting electrical wiring between two chambers of varying temperatures is disclosed. One approach includes a first end of a wiring bundle comprising a first plurality of metal conductors; a second end of the wiring bundle comprising of equal number of metal conductors as the first end of the wiring bundle; the first end of the wiring bundle is separated by an air gap from the second end of the wiring bundle at a first temperature; and an insulator surrounding the wire bundle. Another approach includes the use of one or more SMA (shape-memory alloy) pins connecting the first end of the wiring bundle to the second end of the wiring bundle and that is separated by an air gap and a boundary plate.
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公开(公告)号:US11991277B2
公开(公告)日:2024-05-21
申请号:US17404071
申请日:2021-08-17
Applicant: International Business Machines Corporation
Inventor: Arthur J. Higby , David Clifford Long , Edward N. Cohen , John R. Dangler , Matthew Doyle , Philipp K. Buchling Rego , William Santiago-Fernandez , Levi Campbell , James Busby
CPC classification number: H04L9/0877 , F28D15/0275
Abstract: Aspects include a cryptographic hardware security module having a secure embedded heat pipe and methods for assembling the same. The cryptographic hardware security module can include a printed circuit board having one or more components. The cryptographic hardware security module can further include an encapsulation structure having a top can and a bottom can. The top can is fixed to a first surface of the printed circuit board and the bottom can is fixed to second surface of the printed circuit board opposite the first surface. A heat pipe is positioned between the top can and the component. The heat pipe includes two or more 180-degree bends. A portion of the heat pipe extends beyond a secure region of the encapsulation structure.
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公开(公告)号:US20240098882A1
公开(公告)日:2024-03-21
申请号:US17933693
申请日:2022-09-20
Applicant: International Business Machines Corporation
Inventor: Matthew Doyle , DAVID CLIFFORD LONG , Matteo Cocchini , Russell A. Budd , James Busby , Roger S. Krabbenhoft , Arthur J. Higby
CPC classification number: H05K1/0228 , H01P3/081 , H01P11/003
Abstract: An electronic component includes a first trace configured to transmit a first signal and a second trace configured to transmit a second signal. The electronic component further includes a layer of conductive material separated from the first and second traces by a layer of insulative material. The electronic component further includes a first vertical wall formed in direct contact with the layer of conductive material. The electronic component further includes a second vertical wall formed in direct contact with the layer of conductive material. The second vertical wall is separated from the first vertical wall by a void, and the void extends between the first trace and the second trace.
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公开(公告)号:US20230170641A1
公开(公告)日:2023-06-01
申请号:US17456670
申请日:2021-11-29
Applicant: International Business Machines Corporation
Inventor: Kyle Schoneck , Layne A. Berge , Jason J. Bjorgaard , John R. Dangler , Matthew Doyle , Thomas W. Liang , Matthew A. Walther
IPC: H01R13/207 , H01R24/28
CPC classification number: H01R13/207 , H01R24/28 , G06N10/40
Abstract: An approach for connecting electrical wiring between two chambers of varying temperatures is disclosed. One approach includes a first end of a wiring bundle comprising a first plurality of metal conductors; a second end of the wiring bundle comprising of equal number of metal conductors as the first end of the wiring bundle; the first end of the wiring bundle is separated by an air gap from the second end of the wiring bundle at a first temperature; and an insulator surrounding the wire bundle. Another approach includes the use of one or more SMA (shape-memory alloy) pins connecting the first end of the wiring bundle to the second end of the wiring bundle and that is separated by an air gap and a boundary plate.
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