公开(公告)号：US20160165755A1

公开(公告)日：2016-06-09

申请号：US14561663

申请日：2014-12-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Paul F. BODENWEBER ,  Kenneth C. MARSTON ,  Kamal K. SIKKA ,  Hilton T. TOY ,  Randall J. WERNER ,  Jeffrey A. ZITZ

IPC: H05K7/20

CPC classification number: H05K7/20263 ,  G06F1/203 ,  H01L23/34 ,  H01L23/3672 ,  H01L23/46 ,  H01L23/467 ,  H01L23/473 ,  H01L35/30 ,  H05K1/181 ,  H05K7/20254 ,  H05K7/20272 ,  H05K2201/2018

Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

Abstract translation: 公开了一种具有紧密间隔异种模具和封装的大型电子板的冷却结构。 组件包括具有多个开口的框架。 组件还包括安装到框架的冷板。 冷板包括与至少一个入口和至少一个出口连通的至少一个入口和至少一个出口和流体通道。 组件还包括安装在多个开口中的每一个内的散热器，其结合框架的开口的侧壁和冷板形成各自与流体通道流体连通的各个隔室。

公开(公告)号：US20170196119A1

公开(公告)日：2017-07-06

申请号：US15462242

申请日：2017-03-17

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Paul F. BODENWEBER ,  Kenneth C. MARSTON ,  Kamal K. SIKKA ,  Hilton T. TOY ,  Randall J. WERNER ,  Jeffrey A. ZITZ

IPC: H05K7/20 ,  H01L23/46 ,  H05K1/18

CPC classification number: H05K7/20263 ,  G06F1/203 ,  H01L23/34 ,  H01L23/3672 ,  H01L23/46 ,  H01L23/467 ,  H01L23/473 ,  H01L35/30 ,  H05K1/181 ,  H05K7/20254 ,  H05K7/20272 ,  H05K2201/2018

Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

公开(公告)号：US20180338390A1

公开(公告)日：2018-11-22

申请号：US16049007

申请日：2018-07-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Paul F. BODENWEBER ,  Kenneth C. MARSTON ,  Kamal K. SIKKA ,  Hilton T. TOY ,  Randall J. WERNER ,  Jeffrey A. ZITZ

IPC: H05K7/20 ,  H01L23/34 ,  H01L23/367 ,  H01L23/46 ,  H05K1/18 ,  H01L35/30 ,  H01L23/467 ,  G06F1/20 ,  H01L23/473

Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

公开(公告)号：US20200068744A1

公开(公告)日：2020-02-27

申请号：US16666480

申请日：2019-10-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Paul F. BODENWEBER ,  Kenneth C. MARSTON ,  Kamal K. SIKKA ,  Hilton T. TOY ,  Randall J. WERNER ,  Jeffrey A. ZITZ

IPC: H05K7/20 ,  H05K1/18 ,  H01L23/46 ,  H01L23/34 ,  H01L23/367 ,  H01L35/30

Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

公开(公告)号：US20190335617A1

公开(公告)日：2019-10-31

申请号：US16448028

申请日：2019-06-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Paul F. BODENWEBER ,  Kenneth C. MARSTON ,  Kamal K. SIKKA ,  Hilton T. TOY ,  Randall J. WERNER ,  Jeffrey A. ZITZ

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/34 ,  H05K1/18 ,  H01L35/30 ,  H01L23/46

Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.